ESMexpress

	ESMexpress ESMexpress is a very compact computer-on-module (COM) standard. It is a complete processor module that currently supports several low-power Intel and PowerPC platforms. Apart from a CPU component, every module also includes memory and a range of serial communication interfaces such as PCI Express, Gigabit Ethernet, USB, SATA, SDVO, LVDS and HD audio. These interfaces are defined in the form factor's specification, and signals are assigned to two 120-pin connectors. This fixed pin mapping ensures that different ESMexpress modules can be exchanged more easily. Consequently, ESMexpress typically does not have an onboard FPGA. The idea behind this is to implement very specialized functions in an FPGA on the COM's carrier board to ease upgrades of the system CPU through exchange of the ESMexpress module. The ESMexpress standard includes only one form factor: 95 x 125 mm. The most important specialty of this computer-on-module is its surrounding mechanical concept, which was designed for e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu]
	Computer-on-module A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM). Design COMs are complete embedded computers built on a single circuit board. The design is centered on a microprocessor with RAM, input/output controllers and all other features needed to be a functional computer on the one board. However, unlike a single-board computer, the COM usually lacks the standard connectors for any input/output peripherals to be attached directly to the board. The module usually needs to be mounted on a carrier board (or "baseboard") which breaks the bus out to standard peripheral connectors. Some COMs also include peripheral connectors. Some can be used without a carrier. A COM solution offers a dense package computer system for use in s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu]
	Computer-on-module A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM). Design COMs are complete embedded computers built on a single circuit board. The design is centered on a microprocessor with RAM, input/output controllers and all other features needed to be a functional computer on the one board. However, unlike a single-board computer, the COM usually lacks the standard connectors for any input/output peripherals to be attached directly to the board. The module usually needs to be mounted on a carrier board (or "baseboard") which breaks the bus out to standard peripheral connectors. Some COMs also include peripheral connectors. Some can be used without a carrier. A COM solution offers a dense package computer system for use in s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu]
picture info	Heat Transfer Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, Convection (heat transfer), thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species (mass transfer in the form of advection), either cold or hot, to achieve heat transfer. While these mechanisms have distinct characteristics, they often occur simultaneously in the same system. Heat conduction, also called diffusion, is the direct microscopic exchanges of kinetic energy of particles (such as molecules) or quasiparticles (such as lattice waves) through the boundary between two systems. When an object is at a different temperature from another body or its surroundings, heat flows so that the body and the surroundings reach the same temperature, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu]
picture info	Electromagnetic Compatibility Electromagnetic compatibility (EMC) is the ability of electrical equipment and systems to function acceptably in their electromagnetic environment, by limiting the unintentional generation, propagation and reception of electromagnetic energy which may cause unwanted effects such as electromagnetic interference (EMI) or even physical damage in operational equipment. The goal of EMC is the correct operation of different equipment in a common electromagnetic environment. It is also the name given to the associated branch of electrical engineering. EMC pursues three main classes of issue. Emission is the generation of electromagnetic energy, whether deliberate or accidental, by some source and its release into the environment. EMC studies the unwanted emissions and the countermeasures which may be taken in order to reduce unwanted emissions. The second class, susceptibility, is the tendency of electrical equipment, referred to as the victim, to malfunction or break down in the presen ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu]
picture info	COM Express COM Express, a computer-on-module (COM) form factor, is a highly integrated and compact computer that can be used in a design application much like an integrated circuit component. Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics ( PEG), and Ethernet. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module. COM Express employs a mezzanine-based approach. The COM modules plug into a baseboard that is typically customized to the application. Over time, the COM Express mezzanine modules can be upgraded to newer, backwards-compatible versions. COM Express is commonly used in Industrial, military, aerospace, gaming, medical, transportation, Internet of things, and general computing embedded applications. History The COM Express standard was first released in 2005 by the PCI Industrial Computer Manufacturers Group (PICMG). It defined five module types, each implementing differen ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu]