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Design For Test
Design for testing or design for testability (DFT) consists of IC design techniques that add testability features to a hardware product design. The added features make it easier to develop and apply manufacturing tests to the designed hardware. The purpose of manufacturing tests is to validate that the product hardware contains no manufacturing defects that could adversely affect the product's correct functioning. Tests are applied at several steps in the hardware manufacturing flow and, for certain products, may also be used for hardware maintenance in the customer's environment. The tests are generally driven by test programs that execute using automatic test equipment (ATE) or, in the case of system maintenance, inside the assembled system itself. In addition to finding and indicating the presence of defects (i.e., the test fails), tests may be able to log diagnostic information about the nature of the encountered test fails. The diagnostic information can be used to locate th ...
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Integrated Circuit Design
Integrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors, FPGAs, memories (RAM, ROM, and flash) and digital ASICs. Digital design focuses on logical correctness, maximizing circuit density, and placing circuits so that clock and timing signals are routed efficiently. Analog IC design also has specializations in power IC design and RF IC design. Analog IC design is used in the design of op-amps, linear regulators, phase locked loops, oscillators and active filters. Analog design is more concerned with the physics of the semiconductor devices ...
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Input/output
In computing, input/output (I/O, or informally io or IO) is the communication between an information processing system, such as a computer, and the outside world, possibly a human or another information processing system. Inputs are the signals or data received by the system and outputs are the signals or data sent from it. The term can also be used as part of an action; to "perform I/O" is to perform an input or output operation. are the pieces of hardware used by a human (or other system) to communicate with a computer. For instance, a keyboard or computer mouse is an input device for a computer, while monitors and printers are output devices. Devices for communication between computers, such as modems and network cards, typically perform both input and output operations. Any interaction with the system by a interactor is an input and the reaction the system responds is called the output. The designation of a device as either input or output depends on perspective. Mice ...
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Automatic Test Equipment
Automatic test equipment or automated test equipment (ATE) is any apparatus that performs tests on a device, known as the device under test (DUT), equipment under test (EUT) or unit under test (UUT), using automation to quickly perform measurements and evaluate the test results. An ATE can be a simple computer-controlled digital multimeter, or a complicated system containing dozens of complex test instruments (real or simulated electronic test equipment) capable of automatically testing and diagnosing faults in sophisticated electronic packaged parts or on wafer testing, including system on chips and integrated circuits. Where it is used ATE is widely used in the electronic manufacturing industry to test electronic components and systems after being fabricated. ATE is also used to test avionics and the electronic modules in automobiles. It is used in military applications like radar and wireless communication. In the semiconductor industry Semiconductor ATE, named for testing se ...
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Serial Vector Format
Serial Vector Format (SVF) is a file format that contains boundary scan vectors to be sent to an electronic circuit using a JTAG interface. Boundary scan vectors consist of the following data: * Stimulus data: This is data to be sent to a device or electronic circuit * Expected response: This is the data the device or circuit is expected to send back if there is no error * Mask data: Defines which bits in the expected response are valid; other bits of the device's response are unknown and must be ignored when comparing the expected response and the data returned from the circuit * Additional information on how to send the data (e.g. maximum clock frequency) The SVF standard was jointly developed by companies ''Texas Instruments'' and '' Teradyne''. Control over the format has been handed off to boundary-scan solution provider ''ASSET InterTech''. The most recent revision is Revision E. SVF files are used to transfer boundary scan data between tools. As an example a VHDL The ...
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Test Compression
Test compression is a technique used to reduce the time and cost of testing integrated circuits. The first ICs were tested with test vectors created by hand. It proved very difficult to get good coverage of potential faults, so Design for testability (DFT) based on scan and automatic test pattern generation (ATPG) were developed to explicitly test each gate and path in a design. These techniques were very successful at creating high-quality vectors for manufacturing test, with excellent test coverage. However, as chips got bigger and more complex the ratio of logic to be tested per pin increased dramatically, and the volume of scan test data started causing a significant increase in test time, and required tester memory. This raised the cost of testing. Test compression was developed to help address this problem. When an ATPG tool generates a test for a fault, or a set of faults, only a small percentage of scan cells need to take specific values. The rest of the scan chain is ...
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Clock Signal
In electronics and especially synchronous digital circuits, a clock signal (historically also known as ''logic beat'') oscillates between a high and a low state and is used like a metronome to coordinate actions of digital circuits. A clock signal is produced by a clock generator. Although more complex arrangements are used, the most common clock signal is in the form of a square wave with a 50% duty cycle, usually with a fixed, constant frequency. Circuits using the clock signal for synchronization may become active at either the rising edge, falling edge, or, in the case of double data rate, both in the rising and in the falling edges of the clock cycle. Digital circuits Most integrated circuits (ICs) of sufficient complexity use a clock signal in order to synchronize different parts of the circuit, cycling at a rate slower than the worst-case internal propagation delays. In some cases, more than one clock cycle is required to perform a predictable action. As ICs beco ...
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Scan Chain
Scan chain is a technique used in design for testing. The objective is to make testing easier by providing a simple way to set and observe every flip-flop in an IC.The basic structure of scan include the following set of signals in order to control and observe the scan mechanism. #Scan_in and scan_out define the input and output of a scan chain. In a full scan mode usually each input drives only one chain and scan out observe one as well. #A scan enable pin is a special signal that is added to a design. When this signal is asserted, every flip-flop in the design is connected into a long shift register. #Clock signal which is used for controlling all the FFs in the chain during shift phase and the capture phase. An arbitrary pattern can be entered into the chain of flip-flops, and the state of every flip-flop can be read out. In a full scan design, automatic test pattern generation (ATPG) is particularly simple. No sequential pattern generation is required - combinatorial te ...
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Flip-flop (electronics)
In electronics, a flip-flop or latch is a circuit that has two stable states and can be used to store state information – a bistable multivibrator. The circuit can be made to change state by signals applied to one or more control inputs and will have one or two outputs. It is the basic storage element in sequential logic. Flip-flops and latches are fundamental building blocks of digital electronics systems used in computers, communications, and many other types of systems. Flip-flops and latches are used as data storage elements. A flip-flop is a device which stores a single '' bit'' (binary digit) of data; one of its two states represents a "one" and the other represents a "zero". Such data storage can be used for storage of ''state'', and such a circuit is described as sequential logic in electronics. When used in a finite-state machine, the output and next state depend not only on its current input, but also on its current state (and hence, previous inputs). It can also ...
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Memory (computers)
In computing, memory is a device or system that is used to store information for immediate use in a computer or related computer hardware and digital electronic devices. The term ''memory'' is often synonymous with the term ''primary storage'' or '' main memory''. An archaic synonym for memory is store. Computer memory operates at a high speed compared to storage that is slower but less expensive and higher in capacity. Besides storing opened programs, computer memory serves as disk cache and write buffer to improve both reading and writing performance. Operating systems borrow RAM capacity for caching so long as not needed by running software. If needed, contents of the computer memory can be transferred to storage; a common way of doing this is through a memory management technique called '' virtual memory''. Modern memory is implemented as semiconductor memory, where data is stored within memory cells built from MOS transistors and other components on an integrated ...
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Multi-Chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnectio ...
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Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds vias: plated-through holes that allow interconnections between layers. Printed circuit boards are used in nearly all electronic products. Alternatives to PCBs include wire ...
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Wafer (electronics)
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit. History In the semiconductor or silicon wafer industry, the term wafer appeared in the 1950s to describe a thin round slice of semiconductor material, typically germanium or silicon. Round shape comes from single-crystal ingots usually produced using the Czochralski method. Silicon wafers were first introduced in the 1940s. By 1960, silicon wafers were being manufactured in the U. ...
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