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Component Placement
Component placement is an electronics manufacturing process that places Electronic component, electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional Electronic component, components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously deposited on the PCB pads. The next step after component placement is soldering. Placement inputs * Flexible placer, chip shooter, and other specialized machines. * PWB with solder print. * Components supplied by feeders. * Computer files: computer program controls location of each component on the PWB (X, Y and angular theta), feeder inventory levels, placement machine vacuum holder capability, automatic component realignment, placement accuracy, vision systems, and transportation of PCBs through the line. Placement process Basic placement sequence generally includes: board indexing, board registr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics Manufacturing
Electronics Manufacturing Services (EMS) is a term used for companies that design, manufacture, test, distribute, and provide return/repair services for electronic components and assemblies for original equipment manufacturers (OEMs). The concept is also referred to as Electronics Contract Manufacturing (ECM). Many consumer electronics are built in China, due to maintenance cost, availability of materials, and speed as opposed to other countries such as the United States. Cities such as Shenzhen and Penang have become important production centres for the industry, attracting many consumer electronics companies such as Apple Inc. Some companies such as Flex (company), Flex and Wistron are Original design manufacturers and providers of Electronics manufacturing services. History The EMS industry was initially established in 1961 by SCI Systems of Huntsville Alabama. The industry realized its most significant growth in the 1980s; at the time, most electronics manufacturing for large-s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronic Component
An electronic component is any basic discrete device or physical entity in an electronic system used to affect electrons or their associated fields. Electronic components are mostly industrial products, available in a singular form and are not to be confused with electrical elements, which are conceptual abstractions representing idealized electronic components and elements. Electronic components have a number of electrical terminals or leads. These leads connect to other electrical components, often over wire, to create an electronic circuit with a particular function (for example an amplifier, radio receiver, or oscillator). Basic electronic components may be packaged discretely, as arrays or networks of like components, or integrated inside of packages such as semiconductor integrated circuits, hybrid integrated circuits, or thick film devices. The following list of electronic components focuses on the discrete version of these components, treating such packages as compone ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Soldering
Soldering (; ) is a process in which two or more items are joined by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the work piece metal also does not melt, but the filler metal is one that melts at a higher temperature than in soldering. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. Origins There is evidence that soldering was employed as early as 5,000 years ago in Mesopotamia. Soldering and brazing are thought to have originated very early in the history of metal-working, probably before 4000 BC. Sumerian swords from were assembled using hard soldering. Soldering was historically used to make jewelry, cookware and cooking tools, assembling stained glass, as well as other uses. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Fiducial Marker
A fiducial marker or fiducial is an object placed in the field of view of an imaging system that appears in the image produced, for use as a point of reference or a measure. It may be either something placed into or on the imaging subject, or a mark or set of marks in the reticle of an optical instrument. Applications Microscopy In high-resolution optical microscopy, fiducials can be used to actively stabilize the field of view. Stabilization to better than 0.1 nm is achievable. Physics In physics, 3D computer graphics, and photography, fiducials are reference points: fixed points or lines within a scene to which other objects can be related or against which objects can be measured. Cameras outfitted with Réseau plates produce these reference marks (also called Réseau crosses) and are commonly used by NASA. Such marks are closely related to the timing marks used in optical mark recognition. Geographical survey Airborne geophysical surveys also use the term "fiducial" ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SMT Placement Equipment
Surface-mount technology (SMT) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of a broad range of electronic components, like capacitors, resistors, integrated circuits onto the PCBs which are in turn used in computers, consumer electronics as well as industrial, medical, automotive, military and telecommunications equipment. Similar equipment exists for through-hole components. This type of equipment is sometimes also used to package microchips using the flip chip method. History 1980s and 1990s During this time, a typical SMT assembly line employed two different types of pick-and-place (P&P) machines arranged in sequence. The unpopulated board was fed into a rapid placement machine. These machines, sometimes called chip shooters, place mainly low-precision, simple package compone ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small-outline Integrated Circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.) Note that because of t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plastic Leaded Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Just-in-Time Manufacturing
Lean manufacturing is a production method aimed primarily at reducing times within the production system as well as response times from suppliers and to customers. It is closely related to another concept called just-in-time manufacturing (JIT manufacturing in short). Just-in-time manufacturing tries to match production to demand by only supplying goods which have been ordered and focuses on efficiency, productivity (with a commitment to continuous improvement) and reduction of "wastes" for the producer and supplier of goods. Lean manufacturing adopts the just-in-time approach and additionally focuses on reducing cycle, flow and throughput times by further eliminating activities which do not add any value for the customer. Lean manufacturing also involves people who work outside of the manufacturing process, such as in marketing and customer service. Lean manufacturing is particularly related to the operational model implemented in the post-war In Western usage, the ph ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Derating
In electronics, derating (or derating) is the operation of a device at less than its rated maximum capability to prolong its life. Typical examples include operations below the maximum power rating, current rating, or voltage rating. In electronics Power semiconductor devices have a maximum power dissipation rating usually quoted at a case temperature of . The datasheet for the device also includes a ''derating curve'' which indicates how much a device will dissipate without getting damaged at any given case temperature, and this must be taken into account while designing a system. As can be seen from the derating curve image for a hypothetical bipolar junction transistor, the device (rated for 100 W at ) cannot be expected to dissipate anything more than about 40 W if the ambient temperature is such that the temperature at which the device's case will stabilize (after heat-sinking) is . This final case temperature is a function of the thermal resistance between the device's ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Bill Of Materials
A bill of materials or product structure (sometimes bill of material, BOM or associated list) is a list of the raw materials, sub-assemblies, intermediate assemblies, sub-components, parts, and the quantities of each needed to manufacture an end product. A BOM may be used for communication between manufacturing partners or confined to a single manufacturing plant. A bill of materials is often tied to a production order whose issuance may generate reservations for components in the bill of materials that are in stock and requisitions for components that are not in stock. There are two types of bill materials. A BOM can define products as they are designed (engineering bill of materials), as they are ordered (sales bill of materials), as they are built (manufacturing bill of materials), or as they are maintained (service bill of materials). The different types depend on the business need and use for which they are intended. In process industries, the BOM is also known as the formula ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
