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Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are ...
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Intel N80C186XL12-3179
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets, the instruction sets found in most personal computers (PCs). Delaware General Corporation Law, Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500, ''Fortune'' 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for List of computer system manufacturers, computer system manufacturers such as Acer Inc., Acer, Lenovo, HP Inc., HP, and Dell Technologies, Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, Graphics processing unit, graphics chips, Embedded system, embedded processors and other devices related to com ...
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Heatspreader
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat transfer with expenditure of energy as work supplied by an external source. A heat pipe uses fluids inside a sealed case. The fluids circulate either passively, by spontaneous convection, triggered when a threshold temperature difference occurs; or actively, because of an impeller driven by an external source of work. Without sealed circulation, energy can be carried by transfer of fluid matter, for example externally supplied colder air, driven by an external source of work, from a hotter body to another external body, though this is not exactly heat transfer as defined in physics. Exemplifying increase of entropy according to the second ...
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Plastic
Plastics are a wide range of synthetic or semi-synthetic materials that use polymers as a main ingredient. Their plasticity makes it possible for plastics to be moulded, extruded or pressed into solid objects of various shapes. This adaptability, plus a wide range of other properties, such as being lightweight, durable, flexible, and inexpensive to produce, has led to its widespread use. Plastics typically are made through human industrial systems. Most modern plastics are derived from fossil fuel-based chemicals like natural gas or petroleum; however, recent industrial methods use variants made from renewable materials, such as corn or cotton derivatives. 9.2 billion tonnes of plastic are estimated to have been made between 1950 and 2017. More than half this plastic has been produced since 2004. In 2020, 400 million tonnes of plastic were produced. If global trends on plastic demand continue, it is estimated that by 2050 annual global plastic production will reach over 1, ...
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Ceramic
A ceramic is any of the various hard, brittle, heat-resistant and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature. Common examples are earthenware, porcelain, and brick. The earliest ceramics made by humans were pottery objects (''pots,'' ''vessels or vases'') or figurines made from clay, either by itself or mixed with other materials like silica, hardened and sintered in fire. Later, ceramics were glazed and fired to create smooth, colored surfaces, decreasing porosity through the use of glassy, amorphous ceramic coatings on top of the crystalline ceramic substrates. Ceramics now include domestic, industrial and building products, as well as a wide range of materials developed for use in advanced ceramic engineering, such as in semiconductors. The word "'' ceramic''" comes from the Greek word (), "of pottery" or "for pottery", from (), "potter's clay, tile, pottery". The earliest kno ...
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KL Intel 80286 CLCC
KL, kL, kl, or kl. may refer to: Businesses and organizations * KLM, a Dutch airline (IATA airline designator KL) * Koninklijke Landmacht, the Royal Netherlands Army * Kvenna Listin ("Women's List"), a political party in Iceland * KL FM, a Malay language radio station Places * Kaiserslautern, Germany (license plate code KL) * Kerala, India (ISO 3166-2:IN subcode KL) * Kirkland Lake, Ontario, Canada * Kowloon, Hong Kong * Kuala Lumpur, Malaysia Science, technology, and mathematics * KL engine, version of the Mazda K engine * Klepton (kl.), a type of species in zoology * Kiloliter (kL), a unit of volume * Kullback–Leibler divergence in mathematics * KL (gene), a gene which encodes the klotho enzyme in humans Other uses * Jeep Cherokee (KL) * Kalaallisut language (ISO 639 alpha-2 language code "kl") * Kl (digraph), used in the Zulu language to write /kʟ̥ʼ/ or /kxʼ/ * Konzentrationslager, or concentration camp, abbreviated KZ or KL * ''KL – A History of the Nazi Concentratio ...
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PLCC Extractor
An IC extractor is a tool for safely and quickly removing integrated circuits (ICs) from their sockets. The main purpose of using this tool is to avoid bending the socket pins and to avoid damage through electrostatic discharge Electrostatic discharge (ESD) is a sudden and momentary flow of electric current between two electrically charged objects caused by contact, an short circuit, electrical short or dielectric breakdown. A buildup of static electricity can be caused ... (ESD). References Electronics work tools {{electronics-stub ...
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Wire Wrap
Wire wrap is an electronic component assembly technique that was invented to wire telephone crossbar switches, and later adapted to construct electronic circuit boards. Electronic components mounted on an insulating board are interconnected by lengths of insulated wire run between their terminals, with the connections made by wrapping several turns of uninsulated sections of the wire around a component lead or a socket pin. Wires can be wrapped by hand or by machine, and can be hand-modified afterwards. It was popular for large-scale manufacturing in the 1960s and early 1970s, and continues today to be used for short runs and prototypes. The method eliminates the design and fabrication of a printed circuit board. Wire wrapping is unusual among other prototyping technologies since it allows for complex assemblies to be produced by automated equipment, but then easily repaired or modified by hand. Wire wrap construction can produce assemblies which are more reliable than printe ...
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Flash Memory
Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed. The two main types of flash memory, NOR flash and NAND flash, are named for the NOR and NAND logic gates. Both use the same cell design, consisting of floating gate MOSFETs. They differ at the circuit level depending on whether the state of the bit line or word lines is pulled high or low: in NAND flash, the relationship between the bit line and the word lines resembles a NAND gate; in NOR flash, it resembles a NOR gate. Flash memory, a type of floating-gate memory, was invented at Toshiba in 1980 and is based on EEPROM technology. Toshiba began marketing flash memory in 1987. EPROMs had to be erased completely before they could be rewritten. NAND flash memory, however, may be erased, written, and read in blocks (or pages), which generally are much smaller than the entire device. NOR flash memory allows a single machine word to be written to an era ...
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Reflow
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (unconventionally) by soldering individual joints with a desoldering hot air pencil. Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology components or SMT to a printed circuit board or PCB. Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly. Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inse ...
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Through-hole Technology
In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines. History Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction. From the second generation of computers in the 1950s until surface-mount technology (SMT) became popular in the mid 1980s, every component on a typical PCB was a through-hole component. PCBs initially had tracks printed on one side only, later both sides, then multi-layer boards were in use. Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, bu ...
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Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ...
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Tool Used To Extract Leaded Chip Carriers From Sockets
A tool is an object that can extend an individual's ability to modify features of the surrounding environment or help them accomplish a particular task. Although many animals use simple tools, only human beings, whose use of stone tools dates back hundreds of millennia, have been observed using tools to make other tools. Early human tools, made of such materials as stone, bone, and wood, were used for preparation of food, hunting, manufacture of weapons, and working of materials to produce clothing and useful artifacts. The development of metalworking made additional types of tools possible. Harnessing energy sources, such as animal power, wind, or steam, allowed increasingly complex tools to produce an even larger range of items, with the Industrial Revolution marking an inflection point in the use of tools. The introduction of widespread automation in the 19th and 20th centuries allowed tools to operate with minimal human supervision, further increasing the productivity of hum ...
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