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AMD Socket G3
The Socket G3, originally as part of the codenamed ''Piranha'' server platform, was supposed to be the intermediate successor to Socket F and Socket F+ to be used in AMD Opteron processor for dual-processor (2P) and above server platforms scheduled to be launched 2009. The Socket G3 would have been accompanied by the Socket G3 Memory Extender (Socket G3MX), for connecting large amounts of memory to a single microprocessor by a G3MX chip placed on the motherboard. AMD had planned socket G3 to arrive with the advent of the previously planned 8-core MCM chip code named Montreal. Since Q1 2008, the plan for and 8-core MCM server chip based on 45 nm K10.5 design has been scrapped in favor of a 6-core fully integrated MPU design code named Istanbul, which would use the existing socket F/F+ platform, produced by Nvidia, Broadcom, as well as Fiorano to be introduced by AMD in 2009. However, socket G3 was officially discontinued as of March 2008. The socket that was the successor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
HyperTransport
HyperTransport (HT), formerly known as Lightning Data Transport, is a technology for interconnection of computer processors. It is a bidirectional serial/parallel high-bandwidth, low- latency point-to-point link that was introduced on April 2, 2001. The HyperTransport Consortium is in charge of promoting and developing HyperTransport technology. HyperTransport is best known as the system bus architecture of AMD central processing units (CPUs) from Athlon 64 through AMD FX and the associated motherboard chipsets. HyperTransport has also been used by IBM and Apple for the Power Mac G5 machines, as well as a number of modern MIPS systems. The current specification HTX 3.1 remained competitive for 2014 high-speed (2666 and 3200 MT/s or about 10.4 GB/s and 12.8 GB/s) DDR4 RAM and slower (around 1 GB/similar to high end Solid-state drive#Standard card form factors, PCIe SSDs ULLtraDIMM flash RAM) technology—a wider range of RAM speeds on a common CPU bus ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket F
Socket F is a CPU socket designed by Advanced Micro Devices, AMD for its Opteron line of Central processing unit, CPUs released on August 15, 2006. In 2010 Socket F was replaced by Socket C32 for entry-level servers and Socket G34 for high-end servers. Technical specifications The socket has 1207 pins on a 1.1mm pitch and employs a land grid array contact mechanism. Socket F is primarily for use in AMD's Server (computing), server line and is considered to be in the same socket generation as Socket AM2, which is used for the Athlon 64 and Athlon 64 X2; as well as Socket S1, which is used for Turion 64 and Turion 64 X2 microprocessors. AMD Quad FX platform Socket F is the base for the AMD Quad FX Platform (referred to as "4x4" or "QuadFather" prior to release), unveiled by AMD on November 30, 2006. This modified version of Socket F, named Socket 1207 FX by AMD, and Socket L1 by NVIDIA, allows for dual-socket, dual-core (four effective cores and eight effective cores in the f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket F+
Socket F+ (also Socket Fr2 internally Page 12.) is a for server starting from the 45 nm generation of the K10 CPU family. It is the successor to |
Advanced Micro Devices
Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufactured its own processors, the company later outsourced its manufacturing, a practice known as going fabless, after GlobalFoundries was spun off in 2009. AMD's main products include microprocessors, motherboard chipsets, embedded processors, graphics processors, and FPGAs for servers, workstations, personal computers, and embedded system applications. History First twelve years Advanced Micro Devices was formally incorporated by Jerry Sanders, along with seven of his colleagues from Fairchild Semiconductor, on May 1, 1969. Sanders, an electrical engineer who was the director of marketing at Fairchild, had, like many Fairchild executives, grown frustrated with the increasing lack of support, opportunity, and flexibility within th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Opteron
Opteron is AMD's x86 former server and workstation processor line, and was the first processor which supported the AMD64 instruction set architecture (known generically as x86-64 or AMD64). It was released on April 22, 2003, with the ''SledgeHammer'' core (K8) and was intended to compete in the server and workstation markets, particularly in the same segment as the Intel Xeon processor. Processors based on the AMD K10 microarchitecture (codenamed ''Barcelona'') were announced on September 10, 2007, featuring a new quad-core configuration. The most-recently released Opteron CPUs are the Piledriver-based Opteron 4300 and 6300 series processors, codenamed "Seoul" and "Abu Dhabi" respectively. In January 2016, the first ARMv8-A based Opteron-branded SoC was released, though it is unclear what, if any, heritage this Opteron-branded product line shares with the original Opteron technology other than intended use in the server space. Technical description Two key capabilities Opt ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket G3 Memory Extender
The Socket G3 Memory Extender (G3MX) was a planned Advanced Micro Devices' solution to the problem of connecting large amounts of memory to a single microprocessor. The G3MX was expected to be available on AMD 800S series chipset for server market starting from 2009, but was officially cancelled together with the cancellation of Socket G3 in early 2008. retrieved August 20, 2008 Electrical limitations preclude connecting more than 2 unbuffered s or 4 buffered DIMMs to a single shared bus. It is also impractical to manufacture a single chip with more than two DDR memory buses (channels) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-Chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Manycore Processing Unit
Manycore processors are special kinds of multi-core processors designed for a high degree of Parallel processing (computing), parallel processing, containing numerous simpler, independent processor cores (from a few tens of cores to thousands or more). Manycore processors are used extensively in embedded computers and high-performance computing. Contrast with multicore architecture Manycore processors are distinct from multi-core processors in being optimized from the outset for a higher degree of explicit parallelism, and for higher throughput (or lower power consumption) at the expense of latency and lower single-thread performance. The broader category of multi-core processors, by contrast, are usually designed to efficiently run ''both'' parallel ''and'' serial code, and therefore place more emphasis on high single-thread performance (e.g. devoting more silicon to out of order execution, deeper pipeline (computing), pipelines, more superscalar execution units, and larger, mo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of AMD Opteron Microprocessors
Opteron is the name of a central processing unit (CPU) family within the AMD64 line. Designed by Advanced Micro Devices (AMD) for the server market, Opteron competed with Intel's Xeon. The Opteron family is succeeded by the Zen-based Epyc, and Ryzen Threadripper and Threadripper Pro series. For Socket 940 and Socket 939 Opterons, each chip has a three-digit model number, in the form ''Opteron XYY''. For Socket F and Socket AM2 Opterons, each chip has a four-digit model number, in the form ''Opteron XZYY''. For all Opterons, the first digit (the X) specifies the number of CPUs on the target machine: * 1 – has 1 processor (uniprocessor) * 2 – has 2 processors (dual processor) * 8 – has 4 or 8 processors For Socket F and Socket AM2 Opterons, the second digit (the Z) represents the processor generation. Presently, only 2 (dual-core), DDR2, 3 (quad-core) and 4 (six-core) are used. For all Opterons, the last two digits in the model number (the YY) indicate the clock rate (freque ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Nvidia
Nvidia CorporationOfficially written as NVIDIA and stylized in its logo as VIDIA with the lowercase "n" the same height as the uppercase "VIDIA"; formerly stylized as VIDIA with a large italicized lowercase "n" on products from the mid 1990s to early-mid 2000s. Though unofficial, second letter capitalization of NVIDIA, i.e. nVidia, may be found within enthusiast communities and publications. ( ) is an American multinational technology company incorporated in Delaware and based in Santa Clara, California. It is a software and fabless company which designs graphics processing units (GPUs), application programming interface (APIs) for data science and high-performance computing as well as system on a chip units (SoCs) for the mobile computing and automotive market. Nvidia is a global leader in artificial intelligence hardware and software. Its professional line of GPUs are used in workstations for applications in such fields as architecture, engineering and construction, media ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Broadcom
Broadcom Inc. is an American designer, developer, manufacturer and global supplier of a wide range of semiconductor and infrastructure software products. Broadcom's product offerings serve the data center, networking, software, broadband, wireless, and storage and industrial markets. Tan Hock Eng is the company's president and CEO. The company is headquartered in San Jose, California. Avago Technologies Limited took the Broadcom part of the Broadcom Corporation name after acquiring it in January 2016. The ticker symbol AVGO that represented old Avago now represents the new merged entity. The Broadcom Corporation ticker symbol BRCM was retired. Broadcom has a long history of corporate transactions (or attempted transactions) with other prominent corporations mainly in the high-technology space. In October 2019, the European Union issued an interim antitrust order against Broadcom concerning anticompetitive business practices which allegedly violate European Union competition l ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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