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Automated X-ray Inspection
Automated inspection (AXI) is a technology based on the same principles as automated optical inspection (AOI). It uses as its source, instead of visible light, to automatically inspect features, which are typically hidden from view. Automated X-ray inspection is used in a wide range of industries and applications, predominantly with two major goals: # Process optimization, i.e. the results of the inspection are used to optimize following processing steps, # Anomaly detection, i.e. the result of the inspection serve as a criterion to reject a part (for scrap or re-work). Whilst AOI is mainly associated with electronics manufacturing (due to widespread use in PCB manufacturing), AXI has a much wider range of applications. It ranges from the quality check of alloy wheels to the detection of bone fragments in processed meat. Wherever large numbers of very similar items are produced according to a defined standard, automatic inspection using advanced image processing and pattern reco ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
X-Ray Circuit Board Zoom
An X-ray, or, much less commonly, X-radiation, is a penetrating form of high-energy electromagnetic radiation. Most X-rays have a wavelength ranging from 10 Picometre, picometers to 10 Nanometre, nanometers, corresponding to frequency, frequencies in the range 30 Hertz, petahertz to 30 Hertz, exahertz ( to ) and energies in the range 145 electronvolt, eV to 124 keV. X-ray wavelengths are shorter than those of ultraviolet, UV rays and typically longer than those of gamma rays. In many languages, X-radiation is referred to as Röntgen radiation, after the German scientist Wilhelm Röntgen, Wilhelm Conrad Röntgen, who discovered it on November 8, 1895. He named it ''X-radiation'' to signify an unknown type of radiation.Novelline, Robert (1997). ''Squire's Fundamentals of Radiology''. Harvard University Press. 5th edition. . Spellings of ''X-ray(s)'' in English include the variants ''x-ray(s)'', ''xray(s)'', and ''X ray(s)''. The most familiar use of X-ra ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
In-circuit Test
In-circuit testing (ICT) is an example of white box testing where an electrical probe tests a populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated. It may be performed with a "bed of nails" test fixture and specialist test equipment, or with a fixtureless in-circuit test setup. Fixtures for in-circuit testing A common form of in-circuit testing uses a bed-of-nails tester. This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing. Bed-of-nails testers have the advantage that many tests may be performed at a time, but have the disadvantage of placing substantial strain on the PCB. An alternative is the use o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hardware Testing
Hardware may refer to: Technology Computing and electronics * Electronic hardware, interconnected electronic components which perform analog or logic operations ** Digital electronics, electronics that operate on digital signals *** Computer hardware, physical parts of a computer *** Networking hardware, devices that enable use of a computer network ** Electronic component, device in an electronic system used to affect electrons, usually industrial products Other technologies * Household hardware, equipment used for home repair and other work, such as fasteners, wire, plumbing supplies, electrical supplies, utensils, and machine parts *Builders hardware, metal hardware for building fixtures, such as hinges and latches * Hardware (development cooperation), in technology transfer * Drum hardware, used to tension, position, and support the instruments * Military technology, application of technology to warfare * Music hardware, devices other than instruments to create music Entertain ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Acceptance Testing
In engineering and its various subdisciplines, acceptance testing is a test conducted to determine if the requirements of a specification or contract are met. It may involve chemical tests, physical tests, or performance tests. In systems engineering, it may involve black-box testing performed on a system (for example: a piece of software, lots of manufactured mechanical parts, or batches of chemical products) prior to its delivery. In software testing, the ISTQB defines ''acceptance testing'' as: Acceptance testing is also known as user acceptance testing (UAT), end-user testing, operational acceptance testing (OAT), acceptance test-driven development (ATDD) or field (acceptance) testing. Acceptance criteria are the criteria that a system or component must satisfy in order to be accepted by a user, customer, or other authorized entity. Overview Testing is a set of activities conducted to facilitate discovery and/or evaluation of properties of one or more items under test ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Automated Optical Inspection
Automated optical inspection (AOI) is an automated visual inspection Visual inspection is a common method of quality control, data acquisition, and data analysis. Visual Inspection, used in maintenance of facilities, mean inspection of equipment and structures using either or all of raw human senses such as vision, ... of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera machine vision, autonomously scans the device under test for both catastrophic failure (e.g. missing component) and Product defect, quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-reflow as well as other stages. Historically, the primary place for AOI systems has been after solder reflow or "post-production." Mainly because, post-reflow ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Joint Test Action Group
JTAG (named after the Joint Test Action Group which codified it) is an industry standard for verifying designs and testing printed circuit boards after manufacture. JTAG implements standards for on-chip instrumentation in electronic design automation (EDA) as a complementary tool to digital simulation. It specifies the use of a dedicated debug port implementing a serial communications interface for low-overhead access without requiring direct external access to the system address and data buses. The interface connects to an on-chip Test Access Port (TAP) that implements a stateful protocol to access a set of test registers that present chip logic levels and device capabilities of various parts. The Joint Test Action Group formed in 1985 to develop a method of verifying designs and testing printed circuit boards after manufacture. In 1990 the Institute of Electrical and Electronics Engineers codified the results of the effort in IEEE Standard 1149.1-1990, entitled ''Standard Te ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
In-circuit Test
In-circuit testing (ICT) is an example of white box testing where an electrical probe tests a populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated. It may be performed with a "bed of nails" test fixture and specialist test equipment, or with a fixtureless in-circuit test setup. Fixtures for in-circuit testing A common form of in-circuit testing uses a bed-of-nails tester. This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing. Bed-of-nails testers have the advantage that many tests may be performed at a time, but have the disadvantage of placing substantial strain on the PCB. An alternative is the use o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Tomosynthesis
Tomosynthesis, also digital tomosynthesis (DTS), is a method for performing high-resolution limited-angle tomography at radiation dose levels comparable with projectional radiography. It has been studied for a variety of clinical applications, including vascular imaging, dental imaging, orthopedic imaging, mammographic imaging, musculoskeletal imaging, and chest imaging. History The concept of tomosynthesis was derived from the work of Ziedses des Plantes, who developed methods of reconstructing an arbitrary number of planes from a set of projections. Though this idea was displaced by the advent of computed tomography, tomosynthesis later gained interest as a low-dose tomographic alternative to CT. Reconstruction Tomosynthesis reconstruction algorithms are similar to CT reconstructions, in that they are based on performing an inverse Radon transform. Due to partial data sampling with very few projections, approximation algorithms have to be used. Filtered back projection and itera ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Boundary Scan
Boundary scan is a method for testing interconnects (wire lines) on printed circuit boards or sub-blocks inside an integrated circuit. Boundary scan is also widely used as a debugging method to watch integrated circuit pin states, measure voltage, or analyze sub-blocks inside an integrated circuit. The Joint Test Action Group (JTAG) developed a specification for boundary scan testing that was standardized in 1990 as the IEEE Std. 1149.1-1990. In 1994, a supplement that contains a description of the Boundary Scan Description Language (BSDL) was added which describes the boundary-scan logic content of IEEE Std 1149.1 compliant devices. Since then, this standard has been adopted by electronic device companies all over the world. Boundary scan is now mostly synonymous with JTAG.IEEE Std 1149.1 (JTAG) Testability Primer [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Automated Optical Inspection
Automated optical inspection (AOI) is an automated visual inspection Visual inspection is a common method of quality control, data acquisition, and data analysis. Visual Inspection, used in maintenance of facilities, mean inspection of equipment and structures using either or all of raw human senses such as vision, ... of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera machine vision, autonomously scans the device under test for both catastrophic failure (e.g. missing component) and Product defect, quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-reflow as well as other stages. Historically, the primary place for AOI systems has been after solder reflow or "post-production." Mainly because, post-reflow ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuits
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern compute ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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