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3D XPoint
3D XPoint (pronounced ''three-D cross point'') is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and is available on the open market under the brand name Optane (Intel) from April 2017 until July 2022. Bit storage is based on a change of bulk resistance, in conjunction with a stackable cross-grid data access array. Initial prices are less than dynamic random-access memory (DRAM) but more than flash memory. As a non-volatile memory, 3D XPoint has a number of features that distinguish it from other currently available RAM and NVRAM. Although the first generations of 3D XPoint were not especially large or fast, as of 2019 3D XPoint is used to create some of the fastest SSDs available, with small-write latency. As the memory is inherently fast, and byte-addressable, techniques such as read-modify-write and caching used to enhance traditional SSDs are not needed to obtain high performance. In add ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
3D XPoint
3D XPoint (pronounced ''three-D cross point'') is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and is available on the open market under the brand name Optane (Intel) from April 2017 until July 2022. Bit storage is based on a change of bulk resistance, in conjunction with a stackable cross-grid data access array. Initial prices are less than dynamic random-access memory (DRAM) but more than flash memory. As a non-volatile memory, 3D XPoint has a number of features that distinguish it from other currently available RAM and NVRAM. Although the first generations of 3D XPoint were not especially large or fast, as of 2019 3D XPoint is used to create some of the fastest SSDs available, with small-write latency. As the memory is inherently fast, and byte-addressable, techniques such as read-modify-write and caching used to enhance traditional SSDs are not needed to obtain high performance. In add ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chalcogenide Glass
Chalcogenide glass (pronounced hard ''ch'' as in ''chemistry'') is a glass containing one or more chalcogens (sulfur, selenium and tellurium, but excluding oxygen). Such glasses are covalently bonded materials and may be classified as covalent network solids. Polonium is also a chalcogen but is not used because of its strong radioactivity. Chalcogenide materials behave rather differently from oxides, in particular their lower band gaps contribute to very dissimilar optical and electrical properties. The classical chalcogenide glasses (mainly sulfur-based ones such as As-S or Ge-S) are strong glass-formers and possess glasses within large concentration regions. Glass-forming abilities decrease with increasing molar weight of constituent elements; i.e., S > Se > Te. Chalcogenide compounds such as AgInSbTe and GeSbTe are used in rewritable optical disks and phase-change memory devices. They are fragile glass-formers: by controlling heating and annealing (cooling), they can be swit ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solid-state Drive
A solid-state drive (SSD) is a solid-state storage device that uses integrated circuit assemblies to store data persistently, typically using flash memory, and functioning as secondary storage in the hierarchy of computer storage. It is also sometimes called a semiconductor storage device, a solid-state device or a solid-state disk, even though SSDs lack the physical spinning disks and movable read–write heads used in hard disk drives (HDDs) and floppy disks. SSD also has rich internal parallelism for data processing. In comparison to hard disk drives and similar electromechanical media which use moving parts, SSDs are typically more resistant to physical shock, run silently, and have higher input/output rates and lower latency. SSDs store data in semiconductor cells. cells can contain between 1 and 4 bits of data. SSD storage devices vary in their properties according to the number of bits stored in each cell, with single-bit cells ("Single Level Cells" or "SLC ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PCI Express
PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections. PCIe has numerous improvements over the older standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance scaling for bus devices, a more detailed error detection and reporting mechanism (Advanced Error Reporting, AER), and native hot-swap functionality. More recent revisions of the PCIe standard provide hardware support for I/O virtualization. The PCI Express electrical interface is measured by the number of simultaneous lanes. (A lane is a single send/receive line of data. The analogy is a highway with traffic in both directions. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Developer Forum
The Intel Developer Forum (IDF) was a biannual gathering of technologists to discuss Intel products and products based on Intel products. The first IDF was held in 1997. To emphasize the importance of China, the Spring 2007 IDF was held in Beijing instead of San Francisco, and San Francisco and Taipei shared the Fall IDF event in September and October, respectively. Three IDF shows were scheduled in 2008; with the date of IDF San Francisco notably moving to August rather than September. In previous years, events were held in major cities around the world such as San Francisco, Mumbai, Bangalore, Moscow, Cairo, Sao Paulo, Amsterdam, Munich and Tokyo. On April 17, 2017, Intel announced that it would no longer be hosting IDF. As a result of this announcement, IDF17, which was scheduled for August in San Francisco, was canceled. 2007 events * April 17–18, 2007 - Beijing, China * September 18–20, 2007 - San Francisco, United States * October 15–16, 2007 - Taipei, Taiwan 2008 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IOPS
Input/output operations per second (IOPS, pronounced ''eye-ops'') is an input/output performance measurement used to characterize computer storage devices like hard disk drives (HDD), solid state drives (SSD), and storage area networks (SAN). Like benchmarks, IOPS numbers published by storage device manufacturers do not directly relate to real-world application performance. Background To meaningfully describe the performance characteristics of any storage device, it is necessary to specify a minimum of three metrics simultaneously: IOPS, response time, and (application) workload. Absent simultaneous specifications of response-time and workload, IOPS are essentially meaningless. In isolation, IOPS can be considered analogous to "revolutions per minute" of an automobile engine i.e. an engine capable of spinning at 10,000 RPMs with its transmission in neutral does not convey anything of value, however an engine capable of developing specified torque and horsepower at a given number ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IM Flash Technologies
IM Flash Technologies, LLC was the semiconductor company founded in January 2006, by Intel Corporation and Micron Technology, Inc. IM Flash produced 3D XPoint used in data centers and high end computers. It had a 300mm wafer fab in Lehi, Utah, United States. It built a second 300mm wafer fab, IM Flash Singapore, which opened in April 2011. IM Flash took the leading edge in NAND flash scaling by moving to 34 nm design rules in 2008. IM Flash has been able to devise 25-nm NAND chips with 193-nm immersion lithography, plus self-aligned double-patterning (SADP) techniques, where it is widely believed that it is using scanners from ASML Holdings NV and SADP technology. In 2011 IM Flash moved to a 20 nm process– which was the smallest NAND flash technology at the time. On July 16, 2018, Micron and Intel announced that they would cease joint development of 3D XPoint after the 2nd generation technology is finalized, which is expected to be completed in the first half of 2019. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lehi, Utah
Lehi ( ) is a city in Utah County, Utah, United States. It is named after Lehi, a prophet in the Book of Mormon. The population was 75,907 at the 2020 census, up from 47,407 in 2010. The rapid growth in Lehi is due, in part, to the rapid development of the tech industry region known as Silicon Slopes. The center of population of Utah is located in Lehi. Lehi is part of the Provo–Orem metropolitan area. History A group of Mormon pioneers settled the area now known as Lehi in the fall of 1850 at a place called Dry Creek in the northernmost part of Utah Valley. It was renamed Evansville in 1851 after David Evans, a local bishop in the Church of Jesus Christ of Latter-day Saints. Other historical names include Sulphur Springs and Snow's Springs. The land was organized into parcels of and new settlers received a plot of this size until the entire tract was exhausted. There was little water to irrigate the rich soil, so it became necessary to divert a portion of American Fork ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer Fabrication
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency ( RF) amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer fabrication is used to build components with the necessary electrical structures. The main process begins with electrical engineers designing the circuit and defining its functions, and specifying the signals, inputs/outputs and voltages needed. These electrical circuit specifications are entered into electrical circuit design software, such as ''SPICE'', and then imported into circuit layout programs, which are similar to ones used for computer aided design. This is necessary for the layers to be defined for photomask production. The resolution of the circuits increases rapidly with each step in design, as the scale of the circuits at the sta ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Memristor
A memristor (; a portmanteau of ''memory resistor'') is a non-linear two-terminal electrical component relating electric charge and magnetic flux linkage. It was described and named in 1971 by Leon Chua, completing a theoretical quartet of fundamental electrical components which comprises also the resistor, capacitor and inductor. Chua and Kang later generalized the concept to memristive systems. Such a system comprises a circuit, of multiple conventional components, which mimics key properties of the ideal memristor component and is also commonly referred to as a memristor. Several such memristor system technologies have been developed, notably ReRAM. The identification of memristive properties in electronic devices has attracted controversy. Experimentally, the ideal memristor has yet to be demonstrated. As a fundamental electrical component Chua in his 1971 paper identified a theoretical symmetry between the non-linear resistor (voltage vs. current), non-linear capacit ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Brian Krzanich
Brian Matthew Krzanich (born May 9, 1960) is an American engineer and Krzanich joined Intel as an engineer in 1982 and served as chief operating officer (COO) before being promoted to CEO in May 2013. As CEO, Krzanich was credited for diversifying Intel's product offerings and workforce. However, during Krzanich's term as CEO, Intel went through major restructurings and pulled out of the mobile chip market. Because of Krzanich's decisions, Intel also struggled to produce 10-nanometer chips, compared to chip manufacturers TSMC and Samsung, resulting in numerous delays and a loss of market share in the computer chip business to rivals like AMD. Krzanich has served on the Deere & Co. and Semiconductor Industry Association boards, as well as the Drone Advisory Committee, which advises the Federal Aviation Administration. He resigned from Intel on June 21, 2018 after a past consensual relationship with a subordinate against company policy was disclosed. Early life and education Krza ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Crossbar (computer Hardware Manufacturer)
Crossbar is a company based in Santa Clara, California. Crossbar develops a class of non-volatile resistive random-access memory (RRAM) technology. The company in 2013 announced its goal was a terabyte of storage on a single integrated circuit, compatible with standard CMOS semiconductor manufacturing processes. History Crossbar was founded in 2010, by George Minassian, Hagop Nazarian, and Wei Lu. As part of the University of Michigan Tech Transfer program, in 2010, Crossbar licensed resistive RAM (RRAM) patents from the University of Michigan. Crossbar filed patents relating to the development, commercialization and manufacturing of RRAM technology. In August 2013, Crossbar emerged from stealth mode and announced the development of a memory array at a commercial semiconductor device fabrication facility. It was said to deliver faster write performance; lower power consumption and more endurance at half the Die (integrated circuit), die size, compared to NAND flash memory. Si ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
