Topic summary
Wafer dicing
Extracted from the Wikipedia article Die singulation.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual siliconchips may be encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.