System in a package

In computer engineering, a system in a package, system in package or SiP is a type of semiconductor packaging where multiple integrated circuits (ICs) are enclosed in one chip carrier. An SiP may include an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using die stacking or package on package, placed side by side (multi-chip module, MCM), and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc. Dies containing integrated circuits may be stacked vertically on the package substrate. They are internally connected by fine wires that are bonded to the package substrate. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together and to the package substrate, or even both techniques can be used in a single package. SiPs are like systems on a chip (SoCs) but less tightly integrated and not on a single semiconductor die.

SIPs can be used either to reduce the size of a system, improve performance or to reduce costs. Some definitions of SiP exclude those that only use two-dimensional MCM.