NAND flash memory

3D integrated circuit technology

3D integrated circuit (3D IC) technology stacks integrated circuit (IC) chips vertically into a single 3D IC package. Toshiba introduced 3D IC technology to NAND flash memory in April 2007, when they debuted a 16 GB eMMC compliant (product number THGAM0G7D8DBAI6, often abbreviated THGAM on consumer websites) embedded NAND flash memory package, which was manufactured with eight stacked 2 GB NAND flash chips. In September 2007, Hynix Semiconductor (now SK Hynix) introduced 24-layer 3D IC technology, with a 16 GB flash memory package that was manufactured with 24 stacked NAND flash chips using a wafer bonding process. Toshiba also used an eight-layer 3D IC for their 32 GB THGBM flash package and in 2008. In 2010, Toshiba used a 16-layer 3D IC for their 128 GB THGBM2 flash package, which was manufactured with 16 stacked 8 GB chips. In the 2010s, 3D ICs came into widespread commercial use for NAND flash memory in mobile devices.