Topic summary
Bisphenol S
Bisphenol S (BPS, dioxydiphenylsulfone) is an organic compound with the formula(HOC6H4)2SO2. It has two phenolfunctional groups on either side of a sulfonyl group. It is commonly used in curing fast-drying epoxy resin adhesives. It is classified as a bisphenol, and a close molecular analog of bisphenol A (BPA). BPS differs from BPA in possessing a sulfone group (SO2) as the central linker in the molecule instead of the dimethylmethylene group (C(CH3)2) of bisphenol A.