Wave solderingWave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount.
Printed circuit boardA printed circuit board (PCB), also known as a printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or "wire" components to one another in an electronic circuit.
Through-hole technologyIn electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines. HistoryThrough-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction.
Reflow ovenA reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. For prototyping or hobbyist use PCBs can be placed in a small oven with a door. Commercial conveyorised reflow ovens contain multiple individually heated zones, which can be individually controlled for temperature.
Ball grid arrayA ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.Lead (electronics)In electronics, a lead () or pin is an electrical connector consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically.
Saturn V instrument unitThe Saturn V instrument unit (IU) is a ring-shaped structure fitted to the top of the Saturn V rocket's third stage (S-IVB) and the Saturn IB's second stage (also an S-IVB). It was immediately below the SLA (Spacecraft/Lunar Module Adapter) panels that contained the Apollo Lunar Module. The instrument unit contains the guidance system for the Saturn V rocket.
Solder ballIn integrated circuit packaging, a solder ball, also known as a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps (μbumps, ubumps), since they are usually significantly smaller than the former.
IBMAmerican multinational technology companyInternational Business Machines Corporation, doing business asIBM (nicknamed Big Blue), is an American multinationaltechnology company headquartered in Armonk, New York, and present in over 175 countries. It is a publicly traded company and one of the 30 companies in the Dow Jones Industrial Average.
Saturn VAmerican super heavy-lift expendable rocketThe Saturn V is a retired American super heavy-lift launch vehicle developed by NASA under the Apollo program for human exploration of the Moon. The rocket was human-rated, had three stages, and was liquid-fueled. Thirteen Saturn V vehicles were launched, from 1967 to 1973, all from Kennedy Space Center Launch Complex 39, nine of which launched 24 astronauts toward the Moon from Apollo 8 to Apollo 17.
Saturn IBThe Saturn IB (also known as the uprated Saturn I) was an American launch vehicle commissioned by the National Aeronautics and Space Administration (NASA) for the Apollo program. It uprated the Saturn I by replacing the S-IV second stage (90,000 pounds-force [400 kN], 43,380,000 lb-sec total impulse), with the S-IVB (200,000 pounds-force [890 kN], 96,000,000 lb-sec total impulse).
Launch Vehicle Digital ComputerThe Launch Vehicle Digital Computer (LVDC) was a computer that provided the autopilot for the Saturn V rocket from launch, through Earth orbit insertion, and the trans-lunar injection burn that would send the Apollo spacecraft to the Moon. Designed and manufactured by IBM's Electronics Systems Center in Owego, New York, it was one of the major components of the instrument unit, fitted to the S-IVB stage of the Saturn V and Saturn IB rockets.*As an Amazon Associate I earn from qualifying purchases.