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High Bandwidth Memory

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High Bandwidth Memory (HBM) is a computer memory interface for 3D-stackedsynchronous dynamic random-access memory (SDRAM), initially developed by Samsung, AMD and SK Hynix. It is often used in conjunction with performance-oriented graphics accelerators, network devices, FPGAs and ASICs; some CPUs utilize HBM as on-packagecache or RAM, such as the NEC SX-Aurora TSUBASA and Fujitsu A64FX.

SK HynixSK HynixSK Hynix Inc. (Korean: 에스케이하이닉스 주식회사), stylized SK hynix, is a South Korean semiconductor company that manufactures dynamic random-access memory (DRAM) chips and flash memory chips. SK Hynix is one of the world's largest semiconductor vendors, and, along with Samsung Electronics and Micron, one of the "Big Three" memory manufacturers.Three-dimensional integrated circuitThree-dimensional integrated circuitIntegrated circuit composed of several vertically stacked chipsA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu (copper-copper) connections, so that they behave as a single device to achieve performance improvements at reduced power and with a smaller footprint than conventional two dimensional processes.Samsung ElectronicsSamsung ElectronicsSouth Korean multinational electronics corporationSamsung Electronics Co., Ltd. (SEC; stylized as SΛMSUNG; Korean: 삼성전자) is a South Korean multinational consumer electronics and semiconductor corporation founded in 1969 and headquartered in Yeongtong District, Suwon, South Korea. It is the flagship listed company of the Samsungchaebol and a major supplier of memory chips, displays, smartphones and home appliances.Central processing unitCentral processing unitCentral computer component that executes instructionsCore i9-14900KF, a 2023 CPU made by IntelInside a central processing unit: The integrated circuit of Intel's Xeon 3060, first manufactured in 2006A central processing unit (CPU), also known as a central processor, main processor, or simply processor, is the primary processor in a given computer.Synchronous dynamic random-access memorySynchronous dynamic random-access memorySynchronous dynamic random-access memory (synchronous dynamic RAM or SDRAM) is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal. DRAM integrated circuits (ICs) produced from the early 1970s to the early 1990s used an asynchronous interface, in which input control signals have a direct effect on internal functions delayed only by the trip across its semiconductor pathways.Computer memoryComputer memoryComputer memory stores information, such as data and programs, for immediate use in the computer; instructions fetched by the computer, and data fetched and stored by those instructions, are located in computer memory. The terms memory, main memory, and primary storage are also used for computer memory. Computer memory is often referred to as RAM, meaning random-access memory, although some older forms of computer memory, such as drum memory, are not random-access.Computer performanceComputer performanceIn computing, computer performance is the amount of useful work accomplished by a computer system. Outside specific contexts, computer performance is estimated in terms of accuracy, efficiency and speed of executing computer program instructions. When it comes to high computer performance, one or more of the following factors might be involved: Short response time for a given piece of work.High throughput (rate of processing work tasks).Low utilization of computing resources.Graphics processing unitGraphics processing unitA graphics processing unit (GPU) is a specialized electronic circuit designed for digital image processing and to accelerate computer graphics, being present either as a component on a discrete graphics card or embedded on motherboards, mobile phones, personal computers, workstations, and game consoles.Integrated circuit packagingIntegrated circuit packagingIntegrated circuit packaging is the final stage of semiconductor device fabrication, in which a die is encapsulated in a case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts that connect the device to a circuit board. The packaging stage is followed by testing of the integrated circuit.Application-specific integrated circuitApplication-specific integrated circuitAn application-specific integrated circuit (ASIC) is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec. Application-specific standard product chips are intermediate between ASICs and industry standard integrated circuits like the 7400 series or the 4000 series.AMDAMDAmerican multinational semiconductor companyAdvanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company headquartered in Santa Clara, California. It develops central processing units (CPUs), graphics processing units (GPUs), field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and high-performance computer components.Field-programmable gate arrayField-programmable gate arrayA field-programmable gate array (FPGA) is a type of configurable integrated circuit that can be repeatedly programmed after manufacturing. FPGAs are a subset of logic devices referred to as programmable logic devices (PLDs). They consist of a grid-connected array of programmable logic blocks that can be configured "in the field" to interconnect with other logic blocks to perform various digital functions.

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