A chip scale package or chip-scale package (CSP) is a type of
integrated circuit
An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. These components a ...
package.
Originally, CSP was the acronym for ''chip-size packaging.'' Since only a few packages are chip size, the meaning of the acronym was adapted to ''chip-scale packaging''. According to
IPC
IPC may refer to:
Businesses and organizations Arts and media
* Intellectual Property Committee, a coalition of US corporations with intellectual property interests
* International Panorama Council, an international network of specialists in ...
's standard J-STD-012, ''Implementation of Flip Chip and Chip Scale Technology'', in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the
die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
The concept was first proposed by Junichi Kasai of
Fujitsu and Gen Murakami of
Hitachi Cable in 1993. The first concept demonstration however came from
Mitsubishi Electric
is a Japanese Multinational corporation, multinational electronics and electrical equipment manufacturing company headquartered in Tokyo, Japan. The company was established in 1921 as a spin-off from the electrical machinery manufacturing d ...
.
The die may be mounted on an
interposer
An interposer is an electrical interface routing between one socket or connection and another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection.[flip chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to exter ...]
ball grid array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be pu ...
(BGA) packaging, or the pads may be etched or printed directly onto the
silicon wafer
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells.
The ...
, resulting in a package very close to the size of the silicon die: such a package is called a
wafer-level package
Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where Packaging (microfabrication), packaging components are attached to an integrated circuit (IC) ''before'' the Wafer (electronics), wafer – on which the IC is fabr ...
(WLP) or a wafer-level chip-scale package (WL-CSP). WL-CSP had been in development since 1990s, and several companies begun volume production in early 2000, such as
Advanced Semiconductor Engineering (ASE).
Types
Chip scale packages can be classified into the following groups:
# Customized leadframe-based CSP (LFCSP)
# Flexible substrate-based CSP
# Flip-chip CSP (FCCSP)
# Rigid substrate-based CSP
# Wafer-level redistribution CSP (WL-CSP)
References
External links
Definitionby
JEDEC
The Joint Electron Device Engineering Council (JEDEC) Solid State Technology Association is a consortium of the semiconductor industry headquartered in Arlington County, Virginia, Arlington, United States. It has over 300 members and is focused ...
The Nordic Electronics Packaging Guideline, Chapter D: Chip Scale Packaging
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