COM-HPC
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COM-HPC is a
computer-on-module A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of System on a chip, system on chip (SoC) and system in package (SiP), COM lies between a full-up computer ...
form factor standard that targets high performance compute and high I/O levels. Each COM-HPC module integrates core
CPU A central processing unit (CPU), also called a central processor, main processor, or just processor, is the primary processor in a given computer. Its electronic circuitry executes instructions of a computer program, such as arithmetic, log ...
and memory functionality and input and output including
USB Universal Serial Bus (USB) is an industry standard, developed by USB Implementers Forum (USB-IF), for digital data transmission and power delivery between many types of electronics. It specifies the architecture, in particular the physical ...
up to Gen 4, audio ( MIPI SoundWire, I2S and DMIC), graphics, (
PCI Express PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe, is a high-speed standard used to connect hardware components inside computers. It is designed to replace older expansion bus standards such as Peripher ...
) up to Gen. 5, and
Ethernet Ethernet ( ) is a family of wired computer networking technologies commonly used in local area networks (LAN), metropolitan area networks (MAN) and wide area networks (WAN). It was commercially introduced in 1980 and first standardized in 198 ...
up to 25 Gbit/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.


History

The
PICMG PICMG, or PCI Industrial Computer Manufacturers Group, is a consortium of over 140 companies in the fields of computer science and engineering. Founded in 1994, the group was originally formed to adapt PCI technology for use in high-performanc ...
work-group officially started in October 23, 2018. *Rev. 1.00 Release date: Feb 19, 2021 *Rev. 1.10 added HD Audio as alternative for
SoundWire MIPI Alliance is a global business alliance that develops technical specifications for the mobile ecosystem, particularly smart phones but including mobile-influenced industries. MIPI was founded in 2003 by Arm, Intel, Nokia, Samsung, STMicro ...
, functional safetey signals and a second 5V standby power pin. Release date: Jan 21, 2022 *Rev. 1.20 added definition for the Mini. Release date: Oct. 3, 2023 *Rev. 1.30 work started June 25, 2024. Major topics for the workgroup are: **Signal integrity for PCIe Gen 6 **
Modern Standby InstantGo, also known as InstantOn or Modern Standby (formerly Connected Standby), is a Microsoft specification for Windows 8 (and later) hardware and software that aims to bring smartphone-type power management capabilities to the PC platform, as ...
S0ix ** CXL


Types

There are 3 different pin outs defined in the specification.


Size

The specification defines 6 module sizes: * Size Mini: The sizes A, B and C are typical Client Type sizes. * Size A: * Size B: * Size C: The larger D and E sizes are typical Server Type sizes to support full size DRAM modules * Size D: * Size E:


Specification

The COM-HPC specification is hosted by
PICMG PICMG, or PCI Industrial Computer Manufacturers Group, is a consortium of over 140 companies in the fields of computer science and engineering. Founded in 1994, the group was originally formed to adapt PCI technology for use in high-performanc ...
. It is not freely available but may be purchased from the PICMG website. PICMG provides a preview version for free download. The COM-HPC hardware specification will be released Jan 2021. Further COM-HPC related documents will be released in 2021 * Carrier Board Design Guide for Ethernet KR * Full Carrier Board Design Guide * Platform Management Specification * Embedded EEPROM Specification (EEEP)


See also

* ETX * XTX *
Qseven Qseven, a computer-on-module (COM) form factor, is a small, highly integrated computer module that can be used in a design application much like an integrated circuit component. It is smaller than other computer-on-module standards such as COM E ...
*
SMARC Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices. Specification Th ...
*
COM Express COM Express is a form factor for computer-on-modules (COMs), which are highly integrated and compact computers that can be used in design applications much like integrated circuit components. Each module integrates core CPU and memory functionali ...


References


External links


COM-HPC Overview PICMG

COM-HPC Overview ADLINK

COM-HPC Overview congatec

COM-HPC Overview Kontron

COM-HPC Overview Samtec

COM-HPC Overview Advantech

COM-HPC Overview Avnet

COM-HPC Overview Comtel

COM-HPC Overview Eurotech

COM-HPC Overview Seco

COM-HPC Overview Trenz
{{Computer form factors Motherboard form factors Computer hardware standards