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Thermal Adhesive
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available. The glue is typically a two-part epoxy resin (usually for paste products) or cyanoacrylate (for tapes). The thermally conductive material can vary including metals, metal oxides, silica or ceramic microspheres. The latter are found in products that have much higher dielectric strength, although this comes at the cost of lower thermal conductivity. End-user modding heatsinks may be supplied with thermal adhesive attached (usually a piece of tape). For products sold through electronic components distributors this is rarely the case; the adhesives are sold separately to professionals. See also * Computer cooling * Hot-melt adhesive * Phase-change material * Thermally conductiv ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Glue
Adhesive, also known as glue, cement, mucilage, or paste, is any non-metallic substance applied to one or both surfaces of two separate items that binds them together and resists their separation. The use of adhesives offers certain advantages over other binding techniques such as sewing, mechanical fastenings, and welding. These include the ability to bind different materials together, the more efficient distribution of stress across a joint, the cost-effectiveness of an easily mechanized process, and greater flexibility in design. Disadvantages of adhesive use include decreased stability at high temperatures, relative weakness in bonding large objects with a small bonding surface area, and greater difficulty in separating objects during testing. Adhesives are typically organized by the method of adhesion followed by ''reactive'' or ''non-reactive'', a term which refers to whether the adhesive chemically reacts in order to harden. Alternatively, they can be organized eithe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Conductivity
The thermal conductivity of a material is a measure of its ability to heat conduction, conduct heat. It is commonly denoted by k, \lambda, or \kappa and is measured in W·m−1·K−1. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity and are very efficient at conducting heat, while the opposite is true for insulating materials such as mineral wool or Styrofoam. Metals have this high thermal conductivity due to free electrons facilitating heat transfer. Correspondingly, materials of high thermal conductivity are widely used in heat sink applications, and materials of low thermal conductivity are used as thermal insulation. The reciprocal of thermal conductivity is called thermal resistivity. The defining equation for thermal conductivity is \mathbf = - k \nabla T, where \mathbf is the heat flux, k is the thermal conductivity, and \nabla ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Thermal Conductivities
In heat transfer, the thermal conductivity of a substance, ''k'', is an intensive property that indicates its ability to conduct heat. For most materials, the amount of heat conducted varies (usually non-linearly) with temperature. Thermal conductivity is often measured with laser flash analysis. Alternative measurements are also established. Mixtures may have variable thermal conductivities due to composition. Note that for gases in usual conditions, heat transfer by advection (caused by convection or turbulence for instance) is the dominant mechanism compared to conduction. This table shows thermal conductivity in SI units of watts per metre-kelvin (W·m−1·K−1). Some measurements use the imperial unit BTUs per foot per hour per degree Fahrenheit ( = Sortable list This concerns materials at atmospheric pressure and around . Analytical list Thermal conductivities have been measured with longitudinal heat flow methods where the experimental arrangement is so designe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Paste
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste. Composition Thermal paste consists of a polymerizable liquid matrix and large volume fractions of e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermally Conductive Pad
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact;AMD - Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease Accessed 23 February 2014 they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Phase-change Material
A phase-change material (PCM) is a substance which releases/absorbs sufficient energy at phase transition to provide useful heat or cooling. Generally the transition will be from one of the first two fundamental states of matter - solid and liquid - to the other. The phase transition may also be between non-classical states of matter, such as the conformity of crystals, where the material goes from conforming to one crystalline structure to conforming to another, which may be a higher or lower energy state. The energy released/absorbed by phase transition from solid to liquid, or vice versa, the heat of fusion is generally much higher than the sensible heat. Ice, for example, requires 333.55 J/g to melt, but then water will rise one degree further with the addition of just 4.18 J/g. Water/ice is therefore a very useful phase change material and has been used to store winter cold to cool buildings in summer since at least the time of the Achaemenid Empire. By melting and sol ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hot-melt Adhesive
Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun. The gun uses a continuous-duty heating element to melt the plastic glue, which the user pushes through the gun either with a mechanical trigger mechanism on the gun, or with direct finger pressure. The glue squeezed out of the heated nozzle is initially hot enough to burn and even blister skin. The glue is sticky when hot, and solidifies in a few seconds to one minute. Hot-melt adhesives can also be applied by dipping or spraying, and are popular with hobbyists and crafters both for affixing and as an inexpensive alternative to resin casting. In industrial use, hot-melt adhesives provide several advantages over solvent-based adhesives. Volatile organic compounds are reduced or eliminated, and the drying or curing step is eliminated. Hot-melt adhesives have a long shelf life and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer Cooling
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, hard disk drives, and solid state drives (SSDs). Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling. Use of heatsinks cooled by airflow reduces the temperature rise produced by a given amount of heat. Attention to patterns of airflow can prevent the development of hotspots. Computer fans are widely used along with heatsink fans to reduce temperature by actively exhausting hot air. There are also other cooling te ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
:Category:Electronic Component Distributors
{{Portal, Electronics For distributors of electronic components. Distributors A distributor is an electric and mechanical device used in the ignition system of older spark-ignition engines. The distributor's main function is to route electricity from the ignition coil to each spark plug at the correct time. Design A ... Distributors ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Modding
Modding (from "modifying") is the act of modifying hardware, software, or anything else to perform a function not originally intended by the designer, or to achieve bespoke specification or appearance. The term is often used in reference to video game modding, particularly in regard to creating new or altered content and sharing that via the web. It may be applied to the overclocking of computers in order to increase the frequency at which the CPU operates. Case modding is a popular activity amongst many computer enthusiasts which involves the customization of a computer case or the installation of water cooling technology. In connection with automobiles, modding can connote engine tuning, remapping of a vehicle's engine control unit or customization of the coachwork. Computers and digital equipment Legal issues Modding may sometimes infringe the legal rights of the copyright owner. Some nations have laws prohibiting modding and accuse modders of attempting to overcome copy ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dielectric Strength
In physics, the term dielectric strength has the following meanings: *for a pure electrically insulating material, the maximum electric field that the material can withstand under ideal conditions without undergoing electrical breakdown and becoming electrically conductive (i.e. without failure of its insulating properties). *For a specific piece of dielectric material and location of electrodes, the minimum applied electric field (i.e. the applied voltage divided by electrode separation distance) that results in breakdown. This is the concept of breakdown voltage. The theoretical dielectric strength of a material is an intrinsic property of the bulk material, and is independent of the configuration of the material or the electrodes with which the field is applied. This "intrinsic dielectric strength" corresponds to what would be measured using pure materials under ideal laboratory conditions. At breakdown, the electric field frees bound electrons. If the applied electric field is ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Sinks
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is thermal management (electronics), dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks computer cooling, are used to cool central processing unit, CPUs, graphics processing unit, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as Transistor#Other transistor types, power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are fact ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
