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Shallow Trench Isolation
Shallow trench isolation (STI), also known as box isolation technique, is an integrated circuit feature which prevents electric current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller. Older CMOS technologies and non-MOS technologies commonly use isolation based on LOCOS. STI is created early during the semiconductor device fabrication process, before transistors are formed. The key steps of the STI process involve etching a pattern of trenches in the silicon, depositing one or more dielectric materials (such as silicon dioxide) to fill the trenches, and removing the excess dielectric using a technique such as chemical-mechanical planarizationbr> Certain semiconductor fabrication technologies also include deep trench isolation, a related feature often found in analog integrated circuits. The effect of the trench edge has given rise to what has recently been termed the "reverse ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Isolation Pitch Vs Design Rule
Isolation is the near or complete lack of social contact by an individual. Isolation or isolated may also refer to: Sociology and psychology *Isolation (health care), various measures taken to prevent contagious diseases from being spread **Isolation ward, a separate ward used to isolate patients with infectious diseases * Isolation (psychology), a defense mechanism in psychoanalytic theory *Emotional isolation, a feeling of isolation despite a functioning social network *Isolation effect, a psychological effect of distinctive items more easily remembered Mathematics * Real-root isolation * Isolation lemma, a technique used to reduce the number of solutions to a computational problem. Natural sciences *Electrical or galvanic isolation, isolating functional sections of electrical systems to prevent current flowing between them *An isolated system, a system without any external exchange *Isolating language, a type of language with a low morpheme-per-word ratio *Isolation (datab ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chemical-mechanical Planarization
Chemical mechanical polishing (CMP) or planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. Description The process uses an abrasive and corrosive chemical slurry (commonly a colloid) in conjunction with a polishing pad and retaining ring, typically of a greater diameter than the wafer. The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the wafer for the formation of additional circuit elements. For example, CMP can bring the entire surface within the depth of field of a photolithography system, or selectively remove material based on its position. Typical ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
FEOL
The front-end-of-line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in the semiconductor. FEOL generally covers everything up to (but not including) the deposition of metal interconnect layers. For the CMOS process, FEOL contains all fabrication steps needed to form isolated CMOS elements: # Selecting the type of wafer to be used; Chemical-mechanical planarization and cleaning of the wafer. # Shallow trench isolation (STI) (or LOCOS in early processes, with feature size > 0.25 μm) # Well formation # Gate module formation # Source and drain module formation See also *Back end of line *Integrated circuit An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny ... References Further reading ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chemical-mechanical Polishing
Chemical mechanical polishing (CMP) or planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. Description The process uses an abrasive and corrosive chemical slurry (commonly a colloid) in conjunction with a polishing pad and retaining ring, typically of a greater diameter than the wafer. The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the wafer for the formation of additional circuit elements. For example, CMP can bring the entire surface within the depth of field of a photolithography system, or selectively remove material based on its position. Typical depth- ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reactive-ion Etching
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it. Equipment A typical (parallel plate) RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber. The wafer platter is electrically isolated from the rest of the chamber. Gas enters through small inlets in the top of the chamber, and exits to the vacuum pump system through the bottom. The types and amount of gas used vary depending upon the etch process; for instance, sulfur hexafluoride is commonly used for etching silicon. Gas pressure is typically maintained in a range between a few millitorr and a few hundred millitorr by ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lithography
Lithography () is a planographic method of printing originally based on the immiscibility of oil and water. The printing is from a stone (lithographic limestone) or a metal plate with a smooth surface. It was invented in 1796 by the German author and actor Alois Senefelder and was initially used mostly for musical scores and maps.Meggs, Philip B. A History of Graphic Design. (1998) John Wiley & Sons, Inc. p 146 Carter, Rob, Ben Day, Philip Meggs. Typographic Design: Form and Communication, Third Edition. (2002) John Wiley & Sons, Inc. p 11 Lithography can be used to print text or images onto paper or other suitable material. A lithograph is something printed by lithography, but this term is only used for fine art prints and some other, mostly older, types of printed matter, not for those made by modern commercial lithography. Originally, the image to be printed was drawn with a greasy substance, such as oil, fat, or wax onto the surface of a smooth and flat limestone pla ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Subthreshold Leakage
Subthreshold conduction or subthreshold leakage or subthreshold drain current is the current between the source and drain of a MOSFET when the transistor is in subthreshold region, or weak-inversion region, that is, for gate-to-source voltages below the threshold voltage. The amount of subthreshold conduction in a transistor is set by its threshold voltage, which is the minimum gate voltage required to switch the device between ''on'' and ''off'' states. However, as the drain current in a MOS device varies exponentially with gate voltage, the conduction does not immediately become zero when the threshold voltage is reached. Rather it continues showing an exponential behavior with respect to the subthreshold gate voltage. When plotted against the applied gate voltage, this subthreshold drain current exhibits a log-linear slope, which is defined as the subthreshold slope. Subthreshold slope is used as a figure of merit for the switching efficiency of a transistor.''Physics of S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Threshold Voltage
The threshold voltage, commonly abbreviated as Vth or VGS(th), of a field-effect transistor (FET) is the minimum gate-to-source voltage (VGS) that is needed to create a conducting path between the source and drain terminals. It is an important scaling factor to maintain power efficiency. When referring to a junction field-effect transistor (JFET), the threshold voltage is often called pinch-off voltage instead. This is somewhat confusing since ''pinch off'' applied to insulated-gate field-effect transistor (IGFET) refers to the channel pinching that leads to current saturation behaviour under high source–drain bias, even though the current is never off. Unlike ''pinch off'', the term ''threshold voltage'' is unambiguous and refers to the same concept in any field-effect transistor. Basic principles In n-channel ''enhancement-mode'' devices, a conductive channel does not exist naturally within the transistor, and a positive gate-to-source voltage is necessary to create one s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electric Field
An electric field (sometimes E-field) is the physical field that surrounds electrically charged particles and exerts force on all other charged particles in the field, either attracting or repelling them. It also refers to the physical field for a system of charged particles. Electric fields originate from electric charges and time-varying electric currents. Electric fields and magnetic fields are both manifestations of the electromagnetic field, one of the four fundamental interactions (also called forces) of nature. Electric fields are important in many areas of physics, and are exploited in electrical technology. In atomic physics and chemistry, for instance, the electric field is the attractive force holding the atomic nucleus and electrons together in atoms. It is also the force responsible for chemical bonding between atoms that result in molecules. The electric field is defined as a vector field that associates to each point in space the electrostatic ( Coulomb) for ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Analog Chip
A linear integrated circuit or analog chip is a set of miniature electronic analog circuits formed on a single piece of semiconductor material. Description The voltage and current at specified points in the circuits of analog chips vary continuously over time. In contrast, digital chips only assign meaning to voltages or currents at discrete levels. In addition to transistors, analog chips often include a larger number of passive elements (capacitors, resistors, and inductors) than digital chips. Inductors tend to be avoided because of their large physical size, and difficulties incorporating them into monolithic semiconductor ICs. Certain circuits such as gyrators can often act as equivalents of inductors, while constructed only from transistors and capacitors. Analog chips may also contain digital logic elements to replace some analog functions, or to allow the chip to communicate with a microprocessor. For this reason, and since logic is commonly implemented using CMOS techno ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Deep Trench Isolation
Deep or The Deep may refer to: Places United States * Deep Creek (Appomattox River tributary), Virginia * Deep Creek (Great Salt Lake), Idaho and Utah * Deep Creek (Mahantango Creek tributary), Pennsylvania * Deep Creek (Mojave River tributary), California * Deep Creek (Pine Creek tributary), Pennsylvania * Deep Creek (Soque River tributary), Georgia * Deep Creek (Texas), a tributary of the Colorado River * Deep Creek (Washington), a tributary of the Spokane River * Deep River (Indiana), a tributary of the Little Calumet River * Deep River (Iowa), a minor tributary of the English River * Deep River (North Carolina) * Deep River (Washington), a minor tributary of the Columbia River * Deep Voll Brook, New Jersey, also known as Deep Brook Elsewhere * Deep Creek (Bahamas) * Deep Creek (Melbourne, Victoria), Australia, a tributary of the Maribyrnong River * Deep River (Western Australia) People * Deep (given name) * Deep (rapper), Punjabi rapper from Houston, Texas * Ravi Deep ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon Dioxide
Silicon dioxide, also known as silica, is an oxide of silicon with the chemical formula , most commonly found in nature as quartz and in various living organisms. In many parts of the world, silica is the major constituent of sand. Silica is one of the most complex and most abundant families of materials, existing as a compound of several minerals and as a synthetic product. Notable examples include fused quartz, fumed silica, silica gel, opal and aerogels. It is used in structural materials, microelectronics (as an electrical insulator), and as components in the food and pharmaceutical industries. Structure In the majority of silicates, the silicon atom shows tetrahedral coordination, with four oxygen atoms surrounding a central Si atomsee 3-D Unit Cell. Thus, SiO2 forms 3-dimensional network solids in which each silicon atom is covalently bonded in a tetrahedral manner to 4 oxygen atoms. In contrast, CO2 is a linear molecule. The starkly different structures of the d ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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