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Rework Station
Rework (or re-work) is the term for the refinishing operation or repair of an electronic printed circuit board (PCB) assembly, usually involving desoldering and re-soldering of surface-mounted electronic components (SMD). Mass processing techniques are not applicable to single device repair or replacement, and specialized manual techniques by expert personnel using appropriate equipment are required to replace defective components; area array packages such as ball grid array (BGA) devices particularly require expertise and appropriate tools. A hot air gun or hot air station is used to heat devices and melt solder, and specialised tools are used to pick up and position often tiny components. A rework station is a place to do this work—the tools and supplies for this work, typically on a workbench. Other kinds of rework require other tools. Reasons for rework Rework is practiced in many kinds of manufacturing when defective products are found. For electronics, defects may ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Stencil
Stencilling produces an image or pattern on a surface, by applying pigment to a surface through an intermediate object, with designed holes in the intermediate object, to create a pattern or image on a surface, by allowing the pigment to reach only some parts of the surface. The stencil is both the resulting image or pattern and the intermediate object; the context in which ''stencil'' is used makes clear which meaning is intended. In practice, the (object) stencil is usually a thin sheet of material, such as paper, plastic, wood or metal, with letters or a design cut from it, used to produce the letters or design on an underlying surface by applying pigment through the cut-out holes in the material. The key advantage of a stencil is that it can be reused to repeatedly and rapidly produce the same letters or design. Although aerosol or painting stencils can be made for one-time use, typically they are made with the intention of being reused. To be reusable, they must remain int ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Xbox 360
The Xbox 360 is a home video game console developed by Microsoft. As the successor to the original Xbox, it is the second console in the Xbox series. It competed with Sony's PlayStation 3 and Nintendo's Wii as part of the seventh generation of video game consoles. It was officially unveiled on MTV on May 12, 2005, with detailed launch and game information announced later that month at the 2005 Electronic Entertainment Expo (E3). The Xbox 360 features an online service, Xbox Live, which was expanded from its previous iteration on the original Xbox and received regular updates during the console's lifetime. Available in free and subscription-based varieties, Xbox Live allows users to: play games online; download games (through Xbox Live Arcade) and game demos; purchase and stream music, television programs, and films through the Xbox Music and Xbox Video portals; and access third-party content services through media streaming applications. In addition to online multimedia ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PlayStation 3
The PlayStation 3 (PS3) is a home video game console developed by Sony Interactive Entertainment, Sony Computer Entertainment. The successor to the PlayStation 2, it is part of the PlayStation brand of consoles. It was first released on November 11, 2006, in Japan, November 17, 2006, in North America, and March 23, 2007, in Europe and Australia. The PlayStation 3 competed primarily against Microsoft's Xbox 360 and Nintendo's Wii as part of the seventh generation of video game consoles. The console was first officially announced at E3 2005, and was released at the end of 2006. It was the first console to use Blu-ray Disk technology as its primary storage medium. The console was the first PlayStation to integrate social gaming services, including the PlayStation Network, as well as the first to be controllable from a handheld console, through its remote connectivity with PlayStation Portable and PlayStation Vita. In September 2009, the ''Slim'' model of the PlayStation 3 was rele ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Profiling
A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven). The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus (TAL), and peak. A thermal profile can be ranked on how it fits in a process window (the specification or tolerance limit). Raw temperature values are normalized in terms of a percentage relative to both the process mean and the window limits. The center of the process window is defined as zero, and the extreme edges of the process window are ±99%. A Process Window Index (PWI) greater than or equal to 100% indicates the profile is outside of the process limitations. A PWI of 99% indicates that the profile is within process limitations, but runs at the edge of the process window. For example, if the process mean is set at 200 °C with the process window calibrated at 180 °C and 220 °C respectively, then ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reflow Soldering
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (unconventionally) by soldering individual joints with a desoldering hot air pencil. Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology components or SMT to a printed circuit board or PCB. Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly. Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inse ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Operating Temperature
An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating temperature). Outside this range of safe operating temperatures the device may fail. It is one component of reliability engineering. Similarly, biological systems have a viable temperature range, which might be referred to as an "operating temperature". Ranges Most devices are manufactured in several temperature grades. Broadly accepted grades are: *Commercial: 0 ° to 70 °C *Industrial: −40 ° to 85 °C *Military: −55 ° to 125 °C Nevertheless, each manufacturer defines its own temperature grades so designers must pay close attention to actual datasheet spe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solder Mask
Solder mask, solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads. A solder bridge is an unintended electrical connection between two conductors by means of a small blob of solder. PCBs use solder masks to prevent this from happening. Solder mask is not always used for hand soldered assemblies, but is essential for mass-produced boards that are soldered automatically using reflow or wave soldering techniques. Once applied, openings must be made in the solder mask wherever components are soldered, which is accomplished using photolithography. Solder mask is traditionally green, but is also available in many other colors. Solder mask comes in different media depending upon the demands of the application. The lowest-cost solder mask is epoxy liquid that is silkscreened thr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Balls Of Solder
In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps (μbumps, ubumps), since they are usually significantly smaller than the former. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. The ball grid array, chip-scale package, and flip chip packages generally use solder balls. Underfill After the solder balls are used to attach an integrated circuit chip to a PCB, often the remaining air gap between them is underfilled with epoxy. In some cases, there may be multiple layers of solder balls—for exampl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Scale Package
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for ''chip-size packaging.'' Since only a few packages are chip size, the meaning of the acronym was adapted to ''chip-scale packaging''. According to IPC's standard J-STD-012, ''Implementation of Flip Chip and Chip Scale Technology'', in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm. The concept was first proposed by Junichi Kasai of Fujitsu and Gen Murakami of Hitachi Cable in 1993. The first concept demonstration however came from Mitsubishi Electric. The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or prin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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