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Backside Power Delivery
Backside power delivery (BPD) is an advanced semiconductor technology that relocates the power delivery network from the frontside to the backside of a silicon wafer. This technique aims to improve power efficiency, performance, and design flexibility in integrated circuits (ICs). Overview Traditionally, power and signal interconnects are both placed on the frontside of the silicon wafer. BPD separates these functions by placing power delivery interconnects on the backside of the wafer, thereby freeing up more space for signal interconnects on the frontside. This separation can lead to improved power integrity, reduced signal interference, and enhanced performance. Development and adoption Intel's PowerVia technology Intel has been a pioneer in BPD with its so-called PowerVia technology, scheduled for introduction in its 20A process node in 2024. ''PowerVia'' has demonstrated significant benefits, including a 6% increase in operating frequency, 30% reduction in power loss ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories (such as Random-access memory, RAM and flash memory). It is a multiple-step Photolithography, photolithographic and physico-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer (electronics), wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. This article focuses on the manufacture of integrated circuits, however steps such as etching and photolithography can be used to manufacture other devices such as LCD and OLED displays. The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the cen ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer (electronics)
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for Semiconductor device fabrication, the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate (materials science), substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping (semiconductor), doping, ion implantation, Etching (microfabrication), etching, thin-film deposition of various materials, and Photolithography, photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and Integrated circuit packaging, packaged as an integrated circuit. History In the semiconductor industry, the term wafer appeared in the 1950s to describe a thin round slice of semiconductor material, typically germanium or silicon. The round shape characteristic of these wafers comes f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Performance Per Watt
In computing, performance per watt is a measure of the energy efficiency of a particular computer architecture or computer hardware. Literally, it measures the rate of computation that can be delivered by a computer for every watt of power consumed. This rate is typically measured by performance on the LINPACK benchmark when trying to compare between computing systems: an example using this is the Green500 list of supercomputers. Performance per watt has been suggested to be a more sustainable measure of computing than Moore's law. System designers building parallel computers often pick CPUs based on their performance per watt of power, because the cost of powering the CPU outweighs the cost of the CPU itself. Spaceflight computers have hard limits on the maximum power available and also have hard requirements on minimum real-time performance. A ratio of processing speed to required electrical power is more useful than raw processing speed. D. J. Shirley; and M. K. McLellan ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and Delaware General Corporation Law, incorporated in Delaware. Intel designs, manufactures, and sells computer components such as central processing units (CPUs) and related products for business and consumer markets. It is one of the world's List of largest semiconductor chip manufacturers, largest semiconductor chip manufacturers by revenue, and ranked in the Fortune 500, ''Fortune'' 500 list of the List of largest companies in the United States by revenue, largest United States corporations by revenue for nearly a decade, from 2007 to 2016 Fiscal year, fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the List of Fortune 500 computer software and information companies, 7th-largest technology company in the ranking. It was one of the first companies listed on Nasdaq. Intel supplies List of I ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel 20A
In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors. According to the projections contained in the 2021 update of the International Roadmap for Devices and Systems published by the Institute of Electrical and Electronics Engineers (IEEE), a "2.1 nm node range label" is expected to have a contacted gate pitch of 45 nanometers and a tightest metal pitch of 20 nanometers. As such, 2 nm is used primarily as a marketing term by the semiconductor industry to refer to a new, improved generation of chips in terms of increased transistor density (a higher degree of miniaturization), increased speed, and reduced power consumption compared to the previous 3 nm ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IEEE
The Institute of Electrical and Electronics Engineers (IEEE) is an American 501(c)(3) organization, 501(c)(3) public charity professional organization for electrical engineering, electronics engineering, and other related disciplines. The IEEE has a corporate office in New York City and an operations center in Piscataway, New Jersey. The IEEE was formed in 1963 as an amalgamation of the American Institute of Electrical Engineers and the Institute of Radio Engineers. History The IEEE traces its founding to 1884 and the American Institute of Electrical Engineers. In 1912, the rival Institute of Radio Engineers was formed. Although the AIEE was initially larger, the IRE attracted more students and was larger by the mid-1950s. The AIEE and IRE merged in 1963. The IEEE is headquartered in New York City, but most business is done at the IEEE Operations Center in Piscataway, New Jersey, opened in 1975. The Australian Section of the IEEE existed between 1972 and 1985, after which it s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Transistor
A transistor is a semiconductor device used to Electronic amplifier, amplify or electronic switch, switch electrical signals and electric power, power. It is one of the basic building blocks of modern electronics. It is composed of semiconductor material, usually with at least three terminal (electronics), terminals for connection to an electronic circuit. A voltage or Electric current, current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Some transistors are packaged individually, but many more in miniature form are found embedded in integrated circuits. Because transistors are the key active components in practically all modern electronics, many people consider them one of the 20th century's greatest inventions. Physicist Julius Edgar Lilienfeld proposed the concept of a field-effect transisto ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Through-silicon Via
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (Via (electronics), via) that passes completely through a silicon wafer or die (integrated circuit), die. TSVs are high-performance interconnect techniques used as an alternative to wire bond, wire-bond and flip chips to create 3D packages and Three-dimensional integrated circuit, 3D integrated circuits. Compared to alternatives such as Package on package, package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter. Classification Dictated by the manufacturing process, there exist three different types of TSVs: ''via-first TSVs'' are fabricated before the individual component (transistors, capacitors, resistors, etc.) are patterned (front end of line, FEOL), ''via-middle TSVs'' are fabricated after the individual component are patterned but before the metal layers (Back end of line, back-end-of-li ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TSMC
Taiwan Semiconductor Manufacturing Company Limited (TSMC or Taiwan Semiconductor) is a Taiwanese multinational semiconductor contract manufacturing and design company. It is one of the world's most valuable semiconductor companies, the world's largest Foundry model#Dedicated foundry, dedicated independent ("Pure play, pure-play") Foundry (electronics), semiconductor foundry, and Taiwan's largest company, with headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan. Although the government of Taiwan is the largest individual shareholder, the majority of TSMC is owned by foreign investors. In 2023, the company was ranked 44th in the Forbes Global 2000, ''Forbes'' Global 2000. Taiwan's exports of integrated circuits amounted to $184 billion in 2022, nearly 25 percent of Taiwan's GDP. TSMC constitutes about 30 percent of the Taiwan Stock Exchange's main index. TSMC was founded in 1987 by Morris Chang as the world's first dedicated semiconductor foun ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Voltage Drop
In electronics, voltage drop is the decrease of electric potential along the path of a current flowing in a circuit. Voltage drops in the internal resistance of the source, across conductors, across contacts, and across connectors are undesirable because some of the energy supplied is dissipated. The voltage drop across the load is proportional to the power available to be converted in that load to some other useful form of energy. For example, an electric space heater may have a resistance of 10 ohms, and the wires that supply it may have a resistance of 0.2 ohms, about 2% of the total circuit resistance. This means that approximately 2% of the supplied voltage is lost in the wire itself. An excessive voltage drop may result in the unsatisfactory performance of the space heater and the overheating of the wires and connections. National and local electrical codes may set guidelines for the maximum voltage drop allowed in electrical wiring to ensure efficiency of dist ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Voltage Droop
Voltage droop is the intentional loss in output voltage from a device as it drives a load. Adding droop in a Voltage regulator, voltage regulation circuit increases the headroom for load Transient (oscillation), transients. All electrical systems have some amount of resistance between the regulator output and the load. At high currents, even a small resistance results in substantial voltage drop between the regulator and the load. Conversely, when the output current is (near) zero, the voltage at the load is higher. This follows from Ohm's law. Rather than increasing output voltage at high current to try to maintain the same load voltage, droop instead simply allows this drop to take place and designs around it. The behaviour of the system with and without droop is as follows: In a regulator not employing droop, when the load is suddenly increased very rapidly (i.e. a transient), the output voltage will momentarily sag. Conversely, when a heavy load is suddenly disconnected, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
