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List Of Intel Core I3 Microprocessors
The following is a list of Intel Core i3 brand microprocessors. These processors are designed with cheap price points, while still retaining the power of the Intel Core line. As such they (along with Intel's i5 series) are often found in laptops and low-end desktop computers. Desktop processors Westmere microarchitecture (1st generation) " Clarkdale" ( MCP, 32 nm) * All models support: '' MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-Threading, Smart Cache.'' * FSB has been replaced with DMI. * Contains a GPU on a secondary die manufactured in 45 nm codenamed " Ironlake". ** Graphics and Integrated Memory Controller transistors: 177 million ** Graphics and Integrated Memory Controller die size: 114 mm² * Transistors:947 million * Die size: 81 mm² * Stepping: C2, K0 Sandy Bridge microarchitecture (2nd generation) "Sandy Bridge" (32 nm) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Core I3 (11th Generation, Logo)
The following is a list of Intel Core i3 brand microprocessors. These processors are designed with cheap price points, while still retaining the power of the Intel Core line. As such they (along with Intel's List of Intel Core i5 microprocessors, i5 series) are often found in laptops and low-end desktop computers. Desktop processors Westmere (microarchitecture), Westmere microarchitecture (1st generation) "Clarkdale (microprocessor), Clarkdale" (Multi-chip package, MCP, 32 nm) * All models support: ''MMX (instruction set), MMX, Streaming SIMD Extensions, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-Threading, Smart Cache.'' * Front-side bus, FSB has been replaced with Direct Media Interface, DMI. * Contains a graphics processing unit, GPU on a secondary Die (integrated circuit), die manufactured in 45 nm codenamed "Intel Graphics Technology#Westmere, Ironlake". ** Graphi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hyper-Threading
Hyper-threading (officially called Hyper-Threading Technology or HT Technology and abbreviated as HTT or HT) is Intel's proprietary simultaneous multithreading (SMT) implementation used to improve parallelization of computations (doing multiple tasks at once) performed on x86 microprocessors. It was introduced on Xeon server processors in February 2002 and on Pentium 4 desktop processors in November 2002. Since then, Intel has included this technology in Itanium, Atom, and Core 'i' Series CPUs, among others. For each processor core that is physically present, the operating system addresses two virtual (logical) cores and shares the workload between them when possible. The main function of hyper-threading is to increase the number of independent instructions in the pipeline; it takes advantage of superscalar architecture, in which multiple instructions operate on separate data in parallel. With HTT, one physical core appears as two processors to the operating system, a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Haswell (microarchitecture)
Haswell is the codename for a processor microarchitecture developed by Intel as the "fourth-generation core" successor to the Ivy Bridge (which is a die shrink/tick of the Sandy Bridge microarchitecture). Intel officially announced CPUs based on this microarchitecture on June 4, 2013, at Computex Taipei 2013, while a working Haswell chip was demonstrated at the 2011 Intel Developer Forum. With Haswell, which uses a 22 nm process, Intel also introduced low-power processors designed for convertible or "hybrid" ultrabooks, designated by the "U" suffix. Haswell CPUs are used in conjunction with the Intel 8 Series chipsets, Intel 9 Series chipsets, and Intel C220 series chipsets. At least one Haswell-based processor is still being sold as of 2022, the Pentium G3420. Design The Haswell architecture is specifically designed to optimize the power savings and performance benefits from the move to FinFET (non-planar, "3D") transistors on the improved 22 nm pr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ivy Bridge (microarchitecture)
Ivy Bridge is the codename for Intel's 22 nm microarchitecture used in the third generation of the Intel Core processors (Core i7, i5, i3). Ivy Bridge is a die shrink to 22 nm process based on FinFET ("3D") Tri-Gate transistors, from the former generation's 32 nm Sandy Bridge microarchitecture—also known as tick–tock model. The name is also applied more broadly to the Xeon and Core i7 Ivy Bridge-E series of processors released in 2013. Ivy Bridge processors are backward compatible with the Sandy Bridge platform, but such systems might require a firmware update (vendor specific). In 2011, Intel released the 7-series Panther Point chipsets with integrated USB 3.0 and SATA 3.0 to complement Ivy Bridge. Volume production of Ivy Bridge chips began in the third quarter of 2011. Quad-core and dual-core-mobile models launched on April 29, 2012 and May 31, 2012 respectively. Core i3 desktop processors, as well as the first 22 nm Pentium, wer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Insider
Intel Graphics Technology (GT) is the collective name for a series of integrated graphics processors (IGPs) produced by Intel that are manufactured on the same package or die as the central processing unit (CPU). It was first introduced in 2010 as Intel HD Graphics and renamed in 2017 as Intel UHD Graphics. Intel Iris Graphics and Intel Iris Pro Graphics are the IGP series introduced in 2013 with some models of Haswell processors as the high-performance versions of HD Graphics. Iris Pro Graphics was the first in the series to incorporate embedded DRAM. Since 2016 Intel refers to the technology as Intel Iris Plus Graphics with the release of Kaby Lake. In the fourth quarter of 2013, Intel integrated graphics represented, in units, 65% of all PC graphics processor shipments. However, this percentage does not represent actual adoption as a number of these shipped units end up in systems with discrete graphics cards. History Before the introduction of Intel HD Graphics, Intel ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hyper-threading
Hyper-threading (officially called Hyper-Threading Technology or HT Technology and abbreviated as HTT or HT) is Intel's proprietary simultaneous multithreading (SMT) implementation used to improve parallelization of computations (doing multiple tasks at once) performed on x86 microprocessors. It was introduced on Xeon server processors in February 2002 and on Pentium 4 desktop processors in November 2002. Since then, Intel has included this technology in Itanium, Atom, and Core 'i' Series CPUs, among others. For each processor core that is physically present, the operating system addresses two virtual (logical) cores and shares the workload between them when possible. The main function of hyper-threading is to increase the number of independent instructions in the pipeline; it takes advantage of superscalar architecture, in which multiple instructions operate on separate data in parallel. With HTT, one physical core appears as two processors to the operating system, a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Advanced Vector Extensions
Advanced Vector Extensions (AVX) are extensions to the x86 instruction set architecture for microprocessors from Intel and Advanced Micro Devices (AMD). They were proposed by Intel in March 2008 and first supported by Intel with the Sandy Bridge processor shipping in Q1 2011 and later by AMD with the Bulldozer processor shipping in Q3 2011. AVX provides new features, new instructions and a new coding scheme. AVX2 (also known as Haswell New Instructions) expands most integer commands to 256 bits and introduces new instructions. They were first supported by Intel with the Haswell processor, which shipped in 2013. AVX-512 expands AVX to 512-bit support using a new EVEX prefix encoding proposed by Intel in July 2013 and first supported by Intel with the Knights Landing co-processor, which shipped in 2016. In conventional processors, AVX-512 was introduced with Skylake server and HEDT processors in 2017. Advanced Vector Extensions AVX uses sixteen YMM registers to perform a sin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sandy Bridge
Sandy Bridge is the codename for Intel's 32 nm microarchitecture used in the second generation of the Intel Core processors (Core i7, i5, i3). The Sandy Bridge microarchitecture is the successor to Nehalem and Westmere microarchitecture. Intel demonstrated a Sandy Bridge processor in 2009, and released first products based on the architecture in January 2011 under the Core brand. Sandy Bridge is manufactured in the 32 nm process and has a soldered contact with the die and IHS (Integrated Heat Spreader), while Intel's subsequent generation Ivy Bridge uses a 22 nm die shrink and a TIM (Thermal Interface Material) between the die and the IHS. Technology Intel demonstrated a Sandy Bridge processor with A1 stepping at 2 GHz during the Intel Developer Forum in September 2009. Upgraded features from Nehalem include: CPU * Intel Turbo Boost 2.0 * 32 KB data + 32 KB instruction L1 cache and 256 KB L2 cache per core * Shared L3 cache which inclu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Stepping (version Numbers)
In integrated circuits, the stepping level or revision level is a version number that refers to the introduction or revision of one or more photolithographic photomasks within the set of photomasks that is used to pattern an integrated circuit. The term originated from the name of the equipment ( "steppers") that exposes the photoresist to light. Integrated circuits have two primary classes of mask sets: firstly, "base" layers that are used to build the structures, such as transistors, that comprise circuit logic and, secondly, "metal" layers that connect the circuit logic. Typically, when an integrated circuit manufacturer such as Intel or AMD produces a new stepping (i.e. a revision to the masks), it is because it has found bugs in the logic, has made improvements to the design that permit faster processing, has found a way to increase yield or improve the "bin splits" (i.e. create faster transistors and thus faster CPUs), has improved maneuverability to more easily identify ma ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Graphics Technology
Intel Graphics Technology (GT) is the collective name for a series of integrated graphics processors (IGPs) produced by Intel that are manufactured on the same package or die as the central processing unit (CPU). It was first introduced in 2010 as Intel HD Graphics and renamed in 2017 as Intel UHD Graphics. Intel Iris Graphics and Intel Iris Pro Graphics are the IGP series introduced in 2013 with some models of Haswell processors as the high-performance versions of HD Graphics. Iris Pro Graphics was the first in the series to incorporate embedded DRAM. Since 2016 Intel refers to the technology as Intel Iris Plus Graphics with the release of Kaby Lake. In the fourth quarter of 2013, Intel integrated graphics represented, in units, 65% of all PC graphics processor shipments. However, this percentage does not represent actual adoption as a number of these shipped units end up in systems with discrete graphics cards. History Before the introduction of Intel HD Graphics, Intel ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphics Processing Unit
A graphics processing unit (GPU) is a specialized electronic circuit designed to manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display device. GPUs are used in embedded systems, mobile phones, personal computers, workstations, and game consoles. Modern GPUs are efficient at manipulating computer graphics and image processing. Their parallel structure makes them more efficient than general-purpose central processing units (CPUs) for algorithms that process large blocks of data in parallel. In a personal computer, a GPU can be present on a video card or embedded on the motherboard. In some CPUs, they are embedded on the CPU die. In the 1970s, the term "GPU" originally stood for ''graphics processor unit'' and described a programmable processing unit independently working from the CPU and responsible for graphics manipulation and output. Later, in 1994, Sony used the term (now standing for ''graphics processing unit'' ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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