The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages ( TSOPs), but are still in use. The

quad in-line package In microelectronics, a quadin-line package (QIP or QIL), is an Semiconductor package, electronic component package with a rectangular housing and four parallel rows of electrical connecting pins. The package may be through-hole technology, through ...

uses a smilar staggered

semiconductor package A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. ...

design. High-power devices (such as high-voltage op-amp ICs, voltage regulators, and motor driver ICs) are still being manufactured in a package with a zig-zag pinout (and normally screwed onto a

heatsink A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, th ...

). These zig-zag packages include variations on the TO220 such as "TO220S", "staggered leads TO-220-11", "staggered leads TO-220-15", and HZIP. The trademarks Pentawatt or Hexawatt are also used for chips in

multi-leaded power package The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrange ...

s like TDA2002/2003/2020/2030 and L200.http://www.st.com/st-web-ui/static/active/en/resource/technical/document/datasheet/CD00000053.pdf Image:Zip_chip_socket.jpg, ZIP chips in ZIP sockets Image:zip_chip.jpg, ZIP chips As for computers,

dynamic RAM Dynamic random-access memory (dynamic RAM or DRAM) is a type of random-access semiconductor memory that stores each bit of data in a memory cell, usually consisting of a tiny capacitor and a transistor, both typically based on metal-oxid ...

ZIP chips are now only to be found in obsolete computers, some of these are: *

Amiga 500 The Amiga 500, also known as the A500, is the first low-end version of the Amiga home computer. It contains the same Motorola 68000 as the Amiga 1000, as well as the same graphics and sound coprocessors, but is in a smaller case similar to th ...

expansion packs * Amiga 3000 on-board memory and some expansion boards * Commodore CDTV on-board memory *

Acorn Archimedes Acorn Archimedes is a family of personal computers designed by Acorn Computers of Cambridge, England. The systems are based on Acorn's own ARM architecture processors and the proprietary operating systems Arthur and RISC OS. The first mode ...

300 and 400 series on-board memory * Acorn Archimedes A3010 and A3020

References

Chip carriers {{compu-hardware-stub

See also

References