Wafer backgrinding is a

semiconductor device fabrication Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are p ...

step during which wafer thickness is reduced to allow stacking and high-density packaging of

integrated circuits An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny ...

(IC). ICs are produced on semiconductor

wafers A wafer is a crisp, often sweet, very thin, flat, light and dry biscuit, often used to decorate ice cream, and also used as a garnish on some sweet dishes. Wafers can also be made into cookies with cream flavoring sandwiched between them. They ...

that undergo a multitude of processing steps. The

silicon Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic ta ...

wafers predominantly used today have diameters of 200 and 300 mm. They are roughly 750 μm thick to ensure a minimum of mechanical stability and to avoid warping during high-temperature processing steps. Smartcards, USB memory sticks, smartphones, handheld music players, and other ultra-compact electronic products would not be feasible in their present form without minimizing the size of their various components along all dimensions. The backside of the wafers are thus ground prior to

wafer dicing In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sa ...

(separation of the individual microchips). Wafers thinned down to 75 to 50 μm are common today.International Technology
Roadmap for Semiconductors 2009 edition, page 12-53. Prior to grinding, wafers are commonly laminated with UV-curable back-grinding tape, which ensures against wafer surface damage during back-grinding and prevents wafer surface contamination caused by infiltration of grinding fluid and/or debris.BG Tape
by Lintec of America. The wafers are also washed with

deionized water Purified water is water that has been mechanically filtered or processed to remove impurities and make it suitable for use. Distilled water was, formerly, the most common form of purified water, but, in recent years, water is more frequently puri ...

throughout the process, which helps prevent contamination.Wafer Preparation
by Syagrus Systems. The process is also known as "backlap",Introduction to Semiconductor Technology
by STMicroelectronics, page 6. "backfinish" or "wafer thinning".
at Silicon Far East.

References

{{Reflist Semiconductor device fabrication

See also

References