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TO-126 is a type of
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TO-126 Package
EESemi.com Semiconductor packages {{Electronics-stub
TO-126 is a type of semiconductor package
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. ...
for devices with three pins, such as transistors
upright=1.4, gate (G), body (B), source (S) and drain (D) terminals. The gate is separated from the body by an insulating layer (pink).
A transistor is a semiconductor device used to Electronic amplifier, amplify or electronic switch, switch ...
. The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, th ...
. On one side of the package typically a metal sheet is exposed, with the transistor die bonded to the other side of the metal sheet inside the package. This allows for an efficient heat transfer from the transistor die to an external heat sink but also implies that the metal sheet is electrically connected to the die (for a bipolar junction transistor
A bipolar junction transistor (BJT) is a type of transistor that uses both electrons and electron holes as charge carriers. In contrast, a unipolar transistor, such as a field-effect transistor, uses only one kind of charge carrier. A bipola ...
usually the collector is connected to this metal sheet).
History and origin
TheJEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in Arlington County, Virginia, United States.
JEDEC has over 300 members, including some of the w ...
TO-126 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 126. In the updated JEDEC outline system, the package is numbered as TO-225AA.
STMicroelectronics refers to this package style as SOT-32.
National Standards
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, Rosstandart
Federal Technical Regulation and Metrology Agency (Rosstandart) (russian: Федеральное агентство по техническому регулированию и метрологии (Росстандарт)) is the Russian federal ...
, GOST
GOST (russian: ГОСТ) refers to a set of International standard, international Technical standard, technical Standardization, standards maintained by the ''Euro-Asian Council for Standardization, Metrology and Certification (EASC)'', a region ...
R 57439—2017
, -
, rowspan=2, Kombinat Mikroelektronik Erfurt
VEB Kombinat Mikroelektronik Erfurt was an important manufacturer of active electronic components in East Germany. It should not be confused with the more well-known VEB Kombinat Robotron Dresden which used integrated circuits from Kombinat ...
, TGL 11811
, N
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, TGL 26713/09
, H1B
See also
*TO-66
TO-66 is a type of semiconductor package for devices with three connections, such as transistors. The shape is similar to the TO-3 package, but the size is smaller. The TO-66 package is made entirely of metal and is commonly used by silicon ...
, a metal package with similar power ratings
* TO-220
The TO-220 is a style of electronic package used for high-powered, through-hole components with pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven ...
, a plastic package with higher power ratings
References
External links
TO-126 Package
EESemi.com Semiconductor packages {{Electronics-stub