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The Info List - Die (integrated Circuit)


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A die (pronunciation: /dʌɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. To simplify handling and integration onto a printed circuit board, most dice are packaged in various forms. There are three commonly used plural forms: dice, dies, and die.[1][2]

Contents

1 Images 2 See also 3 References 4 External links

Images[edit]

Single NPN bipolar junction transistor die.

Close-up of an RGB
RGB
light-emitting diode, showing the three individual dice.

A small-scale integrated circuit die, with bond wires attached.

A VLSI integrated-circuit die.

Two dice bonded onto one chip carrier.

The "naked" die without chip carrier of a Cell processor.

Intel Xeon E7440 die, mounted on heat spreader. Die is 22×23 mm (506 mm2), and contains 7009190000000000000♠1900000000 transistors.

See also[edit]

Integrated circuit
Integrated circuit
design Semiconductor fabrication Wafer dicing Die preparation Chip carrier Wire bonding
Wire bonding
and Ball bonding Semiconductor intellectual property core – functionality block, that can be mixed with others

References[edit]

^ John E. Ayers (2004). Digital Integrated Circuits. CRC Press. ISBN 0-8493-1951-X. Archived from the original on 2017-01-31.  ^ Robert Allen Meyers (2000). Encyclopedia of Physical Science and Technology. Academic Press. ISBN 0-12-226930-6. Archived from the original on 2017-01-31. 

External links[edit]

Wedge Bonding Process on YouTube
YouTube
– animation Industrial Bonder on YouTube
YouTube
– the video shows bonding not brazing

Electronics portal

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