The Info List - Die (integrated Circuit)

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A DIE (pronunciation: /dʌɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography . The wafer is cut (“diced ”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

There are three commonly used plural forms: dice, dies, and die.


* 1 Images * 2 See also * 3 References * 4 External links



Single NPN bipolar junction transistor die. *

Close-up of an RGB
light-emitting diode , showing the three individual dice. *

A small-scale integrated circuit die, with bond wires attached. *

A VLSI integrated-circuit die. *

Two dice bonded onto one chip carrier . *

The "naked" die without chip carrier of a Cell processor. *

Intel Xeon E7440 die, mounted on heat spreader. Die is 22×23 mm (506 mm2), and contains 7009190000000000000♠1900000000 transistors.


* Integrated circuit design * Semiconductor fabrication * Wafer dicing * Die preparation * Chip carrier
Chip carrier
* Wire bonding and Ball bonding * Semiconductor intellectual property core – functionality block, that can be mixed with others


* ^ John E. Ayers (2004). Digital Integrated Circuits. CRC Press. ISBN 0-8493-1951-X . * ^ Robert Allen Meyers (2000). Encyclopedia of Physical Science and Technology. Academic Press. ISBN 0-12-226930-6 .