A DIE (pronunciation: /dʌɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography . The wafer is cut (“diced ”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
There are three commonly used plural forms: dice, dies, and die.
* 1 Images * 2 See also * 3 References * 4 External links
Single NPN bipolar junction transistor die. *
Close-up of an
A small-scale integrated circuit die, with bond wires attached. *
A VLSI integrated-circuit die. *
Two dice bonded onto one chip carrier . *
The "naked" die without chip carrier of a Cell processor. *
Intel Xeon E7440 die, mounted on heat spreader. Die is 22×23 mm (506 mm2), and contains 7009190000000000000♠1900000000 transistors.
Integrated circuit design
* ^ John E. Ayers (2004). Digital Integrated Circuits. CRC Press. ISBN 0-8493-1951-X . * ^ Robert Allen Meyers (2000). Encyclopedia of Physical Science and Technology. Academic Press. ISBN 0-12-226930-6 .