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Photomask
A photomask is an opaque plate with holes or transparencies that allow light to shine through in a defined pattern. They are commonly used in photolithography and the production of integrated circuits (ICs or "chips") in particular. Masks are used to produce a pattern on a substrate, normally a thin slice of silicon known as a wafer in the case of chip manufacturing. Several masks are used in turn, each one reproducing a layer of the completed design, and together they are known as a mask set. Previously, photomasks used to be produced manually by using rubylith and mylar. As complexity continued to grow, manual processing of any sort became difficult. This was solved with the introduction of the optical pattern generator which automated the process of producing the initial large-scale pattern, and the step-and-repeat cameras that automated the copying of the pattern into a multiple-IC mask. The intermediate masks are known as reticles, and were initially copied to production m ...
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Contact Lithography
Contact lithography, also known as contact printing, is a form of photolithography whereby the image to be printed is obtained by illumination of a photomask in direct contact with a substrate coated with an imaging photoresist layer. History The first integrated circuits had features of 200 micrometres which were printed using contact lithography. This technique was popular in the 1960s until it was substituted by proximity printing, where a gap is introduced between the photomask and the substrate. Proximity printing had poorer resolution than contact printing (due to the gap allowing more diffraction to occur) but generated far less defects. The resolution was sufficient for down to 2 micrometre production. In 1978, the step-and-repeat projection system appeared. The platform gained wide acceptance due to the reduction of the mask image and is still in use today. Contact lithography is still commonly practiced today, mainly in applications requiring thick photoresist and/or dou ...
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Extreme Ultraviolet Lithography
Extreme ultraviolet lithography (also known as EUV or EUVL) is an optical lithography technology used in steppers, machines that make integrated circuits (ICs) for computers and other electronic devices. It uses a range of extreme ultraviolet (EUV) wavelengths, roughly spanning a 2% FWHM bandwidth about 13.5  nm, to produce a pattern by exposing reflective photomask to UV light which gets reflected onto a substrate covered by photoresist. It is widely applied in semiconductor device fabrication process. As of 2022, ASML Holding is the only company who produces and sells EUV systems for chip production, targeting 5 nm and 3 nm. At the 2019 International Electron Devices Meeting (IEDM), TSMC reported use of EUV for 5 nm in contact, via, metal line, and cut layers, where the cuts can be applied to fins, gates or metal lines. At IEDM 2020, TSMC reported their 5 nm minimum metal pitch to be reduced 30% from that of 7 nm, which was 40 nm. Samsung's ...
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Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical ( photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultraviolet, extreme ultraviolet, or X-ray. The wavelength of light used determines the minimum feature ...
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Electron Beam Lithography
Electron-beam lithography (often abbreviated as e-beam lithography, EBL) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing). The electron beam changes the solubility of the resist, enabling selective removal of either the exposed or non-exposed regions of the resist by immersing it in a solvent (developing). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching. The primary advantage of electron-beam lithography is that it can draw custom patterns (direct-write) with sub-10 nm resolution. This form of maskless lithography has high resolution and low throughput, limiting its usage to photomask fabrication, low-volume production of semiconductor devices, and research and development. Systems Electron-beam lithography systems used in commercial applicatio ...
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Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern compute ...
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Stepper
A stepper is a device used in the manufacture of integrated circuits (ICs) that is similar in operation to a slide projector or a photographic enlarger. ''Stepper'' is short for step-and-repeat camera. Steppers are an essential part of the complex process, called photolithography, which creates millions of microscopic circuit elements on the surface of chips of silicon. These chips form the heart of ICs such as computer processors, memory chips, and many other devices. The stepper emerged in the late 1970s but did not become widespread until the 1980s. This was because it was replacing an earlier technology, the mask aligner. Aligners imaged the entire surface of a wafer at the same time, producing many chips in a single operation. In contrast, the stepper imaged only one chip at a time, and was thus much slower to operate. The stepper eventually displaced the aligner when the relentless forces of Moore's Law demanded that smaller feature sizes be used. Because the stepper ima ...
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Node (semiconductor Fabrication)
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar diffusion and junction isolation) during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconductor fabrication plants, also called foundries or fabs. All fabrication takes place ...
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Semiconductor Photomask
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities (" doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabric ...
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Rubylith
image:Rubylith two rolls 2012.jpg, 200px, Rolls of lithographer's tape (these rolls are made by 3M). The roll in the back is 1/4 inch, the one in the front, 1/2 inch width. These products are often called "Rubylith" tape because Rubylith has become a generic term for coloured masking films. Rubylith is a brand of Photomask, masking film, invented and trademarked by the Ulano Corporation. Today the brand has become Genericized trademark, genericized to the point that it has become synonymous with all coloured masking films. Rubylith consists of two films sandwiched together. The bottom layer is a clear polyester backing sheet; the top layer is a translucent, red-(ruby-)coloured, sheet. The top layer can be cut and peeled away from the bottom layer. The top layer's colour is light-safe for orthochromatic films (which are sensitive to blue and green light but insensitive to red light). Rubylith is used in many areas of graphic design, typically to produce masks for various printing te ...
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Iron(III) Oxide
Iron(III) oxide or ferric oxide is the inorganic compound with the formula Fe2O3. It is one of the three main oxides of iron, the other two being iron(II) oxide (FeO), which is rare; and iron(II,III) oxide (Fe3O4), which also occurs naturally as the mineral magnetite. As the mineral known as hematite, Fe2O3 is the main source of iron for the steel industry. Fe2O3 is readily attacked by acids. Iron(III) oxide is often called rust, and to some extent this label is useful, because rust shares several properties and has a similar composition; however, in chemistry, rust is considered an ill-defined material, described as Hydrous ferric oxide. Structure Fe2O3 can be obtained in various polymorphs. In the main one, α, iron adopts octahedral coordination geometry. That is, each Fe center is bound to six oxygen ligands. In the γ polymorph, some of the Fe sit on tetrahedral sites, with four oxygen ligands. Alpha phase α-Fe2O3 has the rhombohedral, corundum (α-Al2O3) structure and ...
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Lamination
Lamination is the technique/process of manufacturing a material in multiple layers, so that the composite material achieves improved strength, stability, sound insulation, appearance, or other properties from the use of the differing materials, such as plastic. A laminate is a permanently assembled object created using heat, pressure, welding, or adhesives. Various coating machines, machine presses and calendering equipment are used. Materials There are different lamination processes, depending primarily on the type or types of materials to be laminated. The materials used in laminates can be identical or different, depending on the process and the object to be laminated. Textile Laminated fabric are widely used in different fields of human activity, including medical and military. Woven fabrics (organic and inorganic based) are usually laminated by different chemical polymers to give them useful properties like chemical resistance, dust, grease, windproofness, photolumi ...
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Fused Silica
Fused quartz, fused silica or quartz glass is a glass consisting of almost pure silica (silicon dioxide, SiO2) in amorphous (non- crystalline) form. This differs from all other commercial glasses in which other ingredients are added which change the glasses' optical and physical properties, such as lowering the melt temperature. Fused quartz, therefore, has high working and melting temperatures, making it less desirable for most common applications. The terms fused quartz and fused silica are used interchangeably, but can refer to different manufacturing techniques, as noted below, resulting in different trace impurities. However fused quartz, being in the glassy state, has quite different physical properties compared to crystalline quartz. Due to its physical properties it finds specialty uses in semiconductor fabrication and laboratory equipment, for instance. Compared to other common glasses, the optical transmission of pure silica extends well into the ultraviolet an ...
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