HOME TheInfoList.com
Providing Lists of Related Topics to Help You Find Great Stuff
[::MainTopicLength::#1500] [::ListTopicLength::#1000] [::ListLength::#15] [::ListAdRepeat::#3]

picture info

Die (integrated Circuit)
A DIE (pronunciation: /dʌɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography . The wafer is cut (“diced ”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: dice, dies, and die. CONTENTS * 1 Images * 2 See also * 3 References * 4 External links IMAGES* Single NPN bipolar junction transistor die. * Close-up of an RGB
RGB
light-emitting diode , showing the three individual dice. * A small-scale integrated circuit die, with bond wires attached. * A VLSI integrated-circuit die. * Two dice bonded onto one chip carrier
[...More...]

"Die (integrated Circuit)" on:
Wikipedia
Google
Yahoo

picture info

Wire Bonding
WIRE BONDING is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication . Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz
[...More...]

"Wire Bonding" on:
Wikipedia
Google
Yahoo

picture info

Ball Bonding
BALL BONDING is a type of wire bonding , and is the most common way to make the electrical interconnections between a chip and the outside world as part of semiconductor device fabrication . Gold
Gold
or copper wire can be used, though gold is more common because its oxide is not as problematic in making a weld. If copper wire is used, nitrogen must be used as a cover gas to prevent the copper oxides from forming during the wire bonding process. Copper
Copper
is also harder than gold, which makes damage to the surface of the chip more likely. However copper is cheaper than gold and has superior electrical properties, and so remains a compelling choice. Almost all modern ball bonding processes use a combination of heat, pressure, and ultrasonic energy to make a weld at each end of the wire. The wire used can be as small as 15 µm in diameter — such that several welds could fit across the width of a human hair
[...More...]

"Ball Bonding" on:
Wikipedia
Google
Yahoo

picture info

Die Preparation
DIE PREPARATION is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing . The process of die preparation typically consists of two steps: wafer mounting and wafer dicing . CONTENTS * 1 Wafer mounting * 2 Semiconductor-die cutting * 3 Types of blades * 4 Further reading WAFER MOUNTINGWafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication . During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies . The adhesive film upon which the wafer is mounted ensures that the individual dies remain firmly in place during 'dicing', as the process of cutting the wafer is called. The picture on the right shows a 300 mm wafer after it was mounted and diced. The blue plastic is the adhesive tape. The wafer is the round disc in the middle
[...More...]

"Die Preparation" on:
Wikipedia
Google
Yahoo

picture info

Semiconductor Fabrication
SEMICONDUCTOR DEVICE FABRICATION is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon
Silicon
is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process, from start to packaged chips ready for shipment, takes six to eight weeks and is performed in highly specialized facilities referred to as fabs
[...More...]

"Semiconductor Fabrication" on:
Wikipedia
Google
Yahoo

picture info

Integrated Circuit Design
INTEGRATED CIRCUIT DESIGN, or IC DESIGN, is a subset of electronics engineering , encompassing the particular logic and circuit design techniques required to design integrated circuits , or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography . IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors , FPGAs , memories (RAM , ROM , and flash ) and digital ASICs . Digital design focuses on logical correctness, maximizing circuit density, and placing circuits so that clock and timing signals are routed efficiently. Analog IC design also has specializations in power IC design and RF IC design. Analog IC design is used in the design of op-amps , linear regulators , phase locked loops , oscillators and active filters
[...More...]

"Integrated Circuit Design" on:
Wikipedia
Google
Yahoo

Semiconductor Intellectual Property Core
In electronic design a SEMICONDUCTOR INTELLECTUAL PROPERTY CORE, IP CORE, or IP BLOCK is a reusable unit of logic, cell, or integrated circuit (commonly called a "chip") layout design that is the intellectual property of one party. IP cores may be licensed to another party or can be owned and used by a single party alone. The term is derived from the licensing of the patent and/or source code copyright that exist in the design. IP cores can be used as building blocks within application-specific integrated circuit (ASIC) designs or field-programmable gate array (FPGA) logic designs. CONTENTS * 1 History * 2 Types of IP cores * 2.1 Soft cores * 2.2 Hard cores * 3 Sources of IP cores * 3.1 Licensed functionality * 3.2 Vendors * 3.2.1 IP hardening * 3.3 Free and open-source * 3.4 Aggregators * 4 See also * 5 References * 6 External links HISTORYThe licensing and use of IP cores in chip design came into common practice in the 1990s
[...More...]

"Semiconductor Intellectual Property Core" on:
Wikipedia
Google
Yahoo

picture info

International Standard Book Number
The INTERNATIONAL STANDARD BOOK NUMBER (ISBN) is a unique numeric commercial book identifier. An ISBN is assigned to each edition and variation (except reprintings) of a book. For example, an e-book , a paperback and a hardcover edition of the same book would each have a different ISBN. The ISBN is 13 digits long if assigned on or after 1 January 2007, and 10 digits long if assigned before 2007. The method of assigning an ISBN is nation-based and varies from country to country, often depending on how large the publishing industry is within a country. The initial ISBN configuration of recognition was generated in 1967 based upon the 9-digit STANDARD BOOK NUMBERING (SBN) created in 1966. The 10-digit ISBN format was developed by the International Organization for Standardization (ISO) and was published in 1970 as international standard ISO 2108 (the SBN code can be converted to a ten digit ISBN by prefixing it with a zero)
[...More...]

"International Standard Book Number" on:
Wikipedia
Google
Yahoo

picture info

Die (integrated Circuit)
A DIE (pronunciation: /dʌɪ/) in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography . The wafer is cut (“diced ”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: dice, dies, and die. CONTENTS * 1 Images * 2 See also * 3 References * 4 External links IMAGES* Single NPN bipolar junction transistor die. * Close-up of an RGB
RGB
light-emitting diode , showing the three individual dice. * A small-scale integrated circuit die, with bond wires attached. * A VLSI integrated-circuit die. * Two dice bonded onto one chip carrier
[...More...]

"Die (integrated Circuit)" on:
Wikipedia
Google
Yahoo

picture info

Brazing
BRAZING is a metal -joining process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a lower melting point than the adjoining metal. Brazing
Brazing
differs from welding in that it does not involve melting the work pieces and from soldering in using higher temperatures for a similar process, while also requiring much more closely fitted parts than when soldering. The filler metal flows into the gap between close-fitting parts by capillary action . The filler metal is brought slightly above its melting (liquidus ) temperature while protected by a suitable atmosphere, usually a flux . It then flows over the base metal (known as wetting) and is then cooled to join the work pieces together. It is similar to soldering , except for the use of higher temperatures. A major advantage of brazing is the ability to join the same or different metals with considerable strength
[...More...]

"Brazing" on:
Wikipedia
Google
Yahoo

picture info

YouTube
YOUTUBE is an American video-sharing website headquartered in San Bruno, California . The service was created by three former PayPal employees— Chad Hurley
Chad Hurley
, Steve Chen , and Jawed Karim
Jawed Karim
—in February 2005. Google
Google
bought the site in November 2006 for US$1.65 billion; YouTube
YouTube
now operates as one of Google's subsidiaries . YouTube
YouTube
allows users to upload, view, rate, share, add to favorites, report, comment on videos, and subscribe to other users . It offers a wide variety of user-generated and corporate media videos. Available content includes video clips , TV show clips, music videos , short and documentary films, audio recordings, movie trailers , live streams , and other content such as video blogging , short original videos, and educational videos
[...More...]

"YouTube" on:
Wikipedia
Google
Yahoo

picture info

Special
SPECIAL or SPECIALS may refer to: CONTENTS * 1 Music * 2 Film and television * 3 Other uses * 4 See also MUSIC * Special (album) , a 1992 album by Vesta Williams * "Special" (Garbage song) , 1998 * "Special" (Mew song) , 2005 * "Special" (Stephen Lynch song) , 2000 * The Specials
The Specials
, a British band * "Special", a song by Violent Femmes on The Blind Leading the Naked * "Special", a song on
[...More...]

"Special" on:
Wikipedia
Google
Yahoo

picture info

Cell (microprocessor)
CELL is a multi-core microprocessor microarchitecture that combines a general-purpose Power Architecture core of modest performance with streamlined coprocessing elements which greatly accelerate multimedia and vector processing applications, as well as many other forms of dedicated computation. It was developed by Sony
Sony
, Toshiba
Toshiba
, and IBM
IBM
, an alliance known as "STI". The architectural design and first implementation were carried out at the STI Design Center in Austin, Texas
Austin, Texas
over a four-year period beginning March 2001 on a budget reported by Sony
Sony
as approaching US$ 400 million. Cell is shorthand for CELL BROADBAND ENGINE ARCHITECTURE, commonly abbreviated CBEA in full or Cell BE in part. The first major commercial application of Cell was in Sony's PlayStation 3
PlayStation 3
game console
[...More...]

"Cell (microprocessor)" on:
Wikipedia
Google
Yahoo

picture info

Chip Carrier
In electronics , a CHIP CARRIER is one of several kinds of surface mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; Compared to the internal cavity for mounting the integrated circuit, the package overall size is large. CONTENTS * 1 Types * 2 Plastic
Plastic
leaded chip carrier * 3 Leadless * 4 See also * 5 References TYPESChip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is "flat pack ". Chip carriers are smaller than dual in-line packages and since they use all four edges of the package can have a larger pin count. Chip carriers may be made of ceramic or plastic
[...More...]

"Chip Carrier" on:
Wikipedia
Google
Yahoo

picture info

Gallium Arsenide
GALLIUM ARSENIDE (GAAS) is a compound of the elements gallium and arsenic . It is a III -V direct bandgap semiconductor with a zinc blende crystal structure. Gallium
Gallium
arsenide is used in the manufacture of devices such as microwave frequency integrated circuits , monolithic microwave integrated circuits , infrared light-emitting diodes , laser diodes , solar cells and optical windows. GaAs is often used as a substrate material for the epitaxial growth of other III-V semiconductors including indium gallium arsenide , aluminum gallium arsenide and others
[...More...]

"Gallium Arsenide" on:
Wikipedia
Google
Yahoo

picture info

Photolithography
PHOTOLITHOGRAPHY, also termed OPTICAL LITHOGRAPHY or UV LITHOGRAPHY, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate . It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist ", or simply "resist," on the substrate. A series of chemical treatments then either engraves the exposure pattern into, or enables deposition of a new material in the desired pattern upon the material underneath the photo resist. For example, in complex integrated circuits , a modern CMOS
CMOS
wafer will go through the photolithographic cycle up to 50 times. Photolithography
Photolithography
shares some fundamental principles with photography in that the pattern in the etching resist is created by exposing it to light , either directly (without using a mask) or with a projected image using an optical mask
[...More...]

"Photolithography" on:
Wikipedia
Google
Yahoo
.