Universal Chiplet Interconnect Express (UCIe) is an
open specification for a
die
Die, as a verb, refers to death, the cessation of life.
Die may also refer to:
Games
* Die, singular of dice, small throwable objects used for producing random numbers
Manufacturing
* Die (integrated circuit), a rectangular piece of a semicondu ...
-to-die
interconnect and
serial bus
In telecommunication and data transmission, serial communication is the process of sending data one bit at a time, sequentially, over a communication channel or computer bus. This is in contrast to parallel communication, where several bits are s ...
between
chiplet
A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "LEGO ...
s. It is co-developed by
AMD,
Arm
In human anatomy, the arm refers to the upper limb in common usage, although academically the term specifically means the upper arm between the glenohumeral joint (shoulder joint) and the elbow joint. The distal part of the upper limb between th ...
,
ASE Group
Advanced Semiconductor Engineering, Inc. (), also known as ASE Group (), is a provider of independent semiconductor assembling and test manufacturing services, with its headquarters in Kaohsiung, Taiwan.
Overview
The company was founded in 1984 ...
,
Google Cloud,
Intel
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 ser ...
,
Meta
Meta (from the Greek μετά, '' meta'', meaning "after" or "beyond") is a prefix meaning "more comprehensive" or "transcending".
In modern nomenclature, ''meta''- can also serve as a prefix meaning self-referential, as a field of study or end ...
,
Microsoft
Microsoft Corporation is an American multinational technology corporation producing computer software, consumer electronics, personal computers, and related services headquartered at the Microsoft Redmond campus located in Redmond, Washi ...
,
Qualcomm
Qualcomm () is an American multinational corporation headquartered in San Diego, California, and incorporated in Delaware. It creates semiconductors, software, and services related to wireless technology. It owns patents critical to the 5G, ...
,
Samsung
The Samsung Group (or simply Samsung) ( ko, 삼성 ) is a South Korean multinational manufacturing conglomerate headquartered in Samsung Town, Seoul, South Korea. It comprises numerous affiliated businesses, most of them united under the ...
, and
TSMC
Taiwan Semiconductor Manufacturing Company Limited (TSMC; also called Taiwan Semiconductor) is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's most valuable semiconductor company, the world' ...
.
In August 2022,
Alibaba Group and
NVIDIA
Nvidia CorporationOfficially written as NVIDIA and stylized in its logo as VIDIA with the lowercase "n" the same height as the uppercase "VIDIA"; formerly stylized as VIDIA with a large italicized lowercase "n" on products from the mid 1990s to ...
joined as board members.
Overview
A common chiplet interconnect specification enables construction of large
System-on-Chip
A system on a chip or system-on-chip (SoC ; pl. ''SoCs'' ) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include a central processing unit (CPU), memor ...
(SoC) packages that exceed maximum
reticle
A reticle, or reticule also known as a graticule, is a pattern of fine lines or markings built into the eyepiece of an optical device such as a telescopic sight, spotting scope, theodolite, optical microscope or the screen of an oscilloscop ...
size. It allows intermixing components from different silicon vendors within the same package and improves manufacturing yields by using smaller dies. Each chiplet can use different
silicon manufacturing process suitable for a specific device type or computing performance and power draw requirements.
Specifications
The UCIe 1.0 specification was released on March 2, 2022. It defines physical layer
In the seven-layer OSI model of computer networking, the physical layer or layer 1 is the first and lowest layer; The layer most closely associated with the physical connection between devices. This layer may be implemented by a PHY chip.
The ...
, protocol stack and software model, as well as procedures for compliance testing. The physical layer supports up to 32 GT/s
In computer technology, transfers per second and its more common secondary terms gigatransfers per second (abbreviated as GT/s) and megatransfers per second (MT/s) are informal language that refer to the number of operations transferring data that ...
with 16 to 64 lanes and uses a 256 byte Flow Control Unit (FLIT) for data, similar to PCIe
PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common ...
6.0; the protocol layer is based on Compute Express Link
Compute Express Link (CXL) is an open standard for high-speed central processing unit (CPU)-to-device and CPU-to-memory connections, designed for high performance data center computers. CXL is built on the PCI Express (PCIe) physical and electrica ...
with CXL.io (PCIe), CXL.mem and CXL.cache protocols.
Various on-die interconnect technologies are defined, like organic substrate for a 'standard' 2D package, or embedded silicon bridge (EMIB), silicon interposer, and fanout embedded bridge for 'advanced' 2.5D/3D packages.[ Physical specifications are based on Intel's Advanced Interface Bus (AIB).]SerDes
{{Use American English, date = March 2019
A Serializer/Deserializer (SerDes) is a pair of functional blocks commonly used in high speed communications to compensate for limited input/output. These blocks convert data between serial data and paral ...
, with bandwidth density up to 1.35 TByte/s per mm2 for a common bump pitch of 45 μm
The micrometre ( international spelling as used by the International Bureau of Weights and Measures; SI symbol: μm) or micrometer ( American spelling), also commonly known as a micron, is a unit of length in the International System of Uni ...
, and 3.24× higher density with a bump pitch of 25 μm.[
Future versions may include additional protocols, wider data links, and higher density connections.][https://www.uciexpress.org/_files/ugd/0c1418_c5970a68ab214ffc97fab16d11581449.pdf ]
References
External links
*
Open standards
Serial buses
{{Compu-hardware-stub