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Thin small outline package (TSOP) is a type of
TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages.
SiliconFarEast: "TSOP - Thin Small Outline Package"
TSOP Package Information
from Amkor Technology {{Semiconductor packages Chip carriers
surface mount
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred ...
IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).
They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory
Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed. The two main types of flash memory, NOR flash and NAND flash, are named for the NOR and NAND logic gates. Both use ...
, FSRAM and E2PROM
EEPROM (also called E2PROM) stands for electrically erasable programmable read-only memory and is a type of non-volatile memory used in computers, usually integrated in microcontrollers such as smart cards and remote keyless systems, or a ...
manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.
TSOP is the smallest leaded form factor for flash memory.
History
The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card.Physical properties
TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages.
Type I
Type II
HTSOP
The HTSOP is a TSOP with an exposed pad on the bottom side. The exposed pad will be soldered on the pcb to transfer heat from the package to the pcb.Similar packages
There are a variety of small form-factor IC carrier available other than TSOPs *Small-outline integrated circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generall ...
(SOIC)
* Plastic small-outline package (PSOP)
* Shrink small-outline package (SSOP)
* Thin-shrink small outline package (TSSOP)
See also
*Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny ...
* Chip carrier Chip packaging and package types list
References
External links
TSOP Package Information
from Amkor Technology {{Semiconductor packages Chip carriers