Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by

ball grid array A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be p ...

packages which can achieve even higher densities. The prime application for this technology is memory. SRAM,

flash memory Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed. The two main types of flash memory, NOR flash and NAND flash, are named for the NOR and NAND logic gates. Both us ...

, FSRAM and

E2PROM EEPROM (also called E2PROM) stands for electrically erasable programmable read-only memory and is a type of non-volatile memory used in computers, usually integrated in microcontrollers such as smart cards and remote keyless systems, or as ...

manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules,

PC card In computing, PC Card is a configuration for computer parallel communication peripheral interface, designed for laptop computers. Originally introduced as PCMCIA, the PC Card standard as well as its successors like CardBus were defined and devel ...

s (PCMCIA cards), wireless, netbooks and countless other product applications. TSOP is the smallest leaded form factor for flash memory.

History

The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card.

Physical properties

TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages. SiliconFarEast: "TSOP - Thin Small Outline Package"

Type I

Type II

HTSOP

The HTSOP is a TSOP with an exposed pad on the bottom side. The

exposed pad Expose, exposé, or exposed may refer to: News sources * Exposé (journalism), a form of investigative journalism * '' The Exposé'', a British conspiracist website Film and TV Film * ''Exposé'' (film), a 1976 thriller film * ''Exposed'' (1932 ...

will be soldered on the

pcb PCB may refer to: Science and technology * Polychlorinated biphenyl, an organic chlorine compound, now recognized as an environmental toxin and classified as a persistent organic pollutant * Printed circuit board, a board used in electronics * ...

to transfer heat from the package to the pcb.

Similar packages

There are a variety of small form-factor IC carrier available other than TSOPs *

Small-outline integrated circuit A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generall ...

(SOIC) * Plastic small-outline package (PSOP) *

Shrink small-outline package A small outline integrated circuit (SOIC) is a Surface-mount technology, surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% ...

(SSOP) * Thin-shrink small outline package (TSSOP)

References

External links

TSOP Package Information
from

Amkor Technology Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Tempe, Arizona, since 2005, when it was moved from West Chester, Pennsylvania. The company was founded in 1968 and, , ha ...

{{Semiconductor packages Chip carriers