Soitec is an international company, based in France, that manufactures high performance substrates used in the manufacture of semiconductors.
Soitec's semiconductor materials are used to manufacture
chips
''CHiPs'' is an American crime drama television series created by Rick Rosner and originally aired on NBC from September 15, 1977, to May 1, 1983. It follows the lives of two motorcycle officers of the California Highway Patrol (CHP). The se ...
which equip
smartphones
A smartphone is a portable computer device that combines mobile telephone and computing functions into one unit. They are distinguished from feature phones by their stronger hardware capabilities and extensive mobile operating systems, which ...
computers
A computer is a machine that can be programmed to carry out sequences of arithmetic or logical operations (computation) automatically. Modern digital electronic computers can perform generic sets of operations known as programs. These prog ...
, IT servers, and data centres. Soitec's products are also found in electronic components used in cars, connected objects (Internet of Things), as well as industrial and medical equipment.
Soitec's flagship product is silicon on insulator (SOI). Materials produced by Soitec come in the form of substrates (also called "
wafers
A wafer is a crisp, often sweet, very thin, flat, light and dry biscuit, often used to decorate ice cream, and also used as a garnish on some sweet dishes. Wafers can also be made into cookies with cream flavoring sandwiched between them. They ...
"). These are produced as ultra-thin disks that are 200 to 300 mm in diameter and are less than 1 mm thick. These wafers are then etched and cut to be used for
microchips
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Transistor count, Large ...
in electronics.
History
Soitec was founded in 1992 near Grenoble in France by two researchers from CEA Leti, an institute for micro- and
nanotechnologies
Nanotechnology, also shortened to nanotech, is the use of matter on an atomic, molecular, and supramolecular scale for industrial purposes. The earliest, widespread description of nanotechnology referred to the particular technological goal o ...
Bernin
Bernin () is a commune in the Isère department in southeastern France.
Population
Twin towns
Bernin is twinned with:
* Kieselbronn, Germany, since 1987
See also
*Communes of the Isère department
The following is a list of the 512 c ...
, in the
Isère
Isère ( , ; frp, Isera; oc, Isèra, ) is a landlocked department in the southeastern French region of Auvergne-Rhône-Alpes. Named after the river Isère, it had a population of 1,271,166 in 2019.solar energy and lighting markets, exploiting new openings for its materials and technologies. In 2015, the company announced that it would be refocusing its efforts on its core business: electronics.
Soitec employs about 2000 people throughout the world and currently has production units in France and in Singapore. The company also has R&D centers and commercial offices in France, the United States ( Arizona and California), China, South Korea, Japan and Taiwan.
Key dates
*1963:
SOS
is a Morse code distress signal (), used internationally, that was originally established for maritime use. In formal notation is written with an overscore line, to indicate that the Morse code equivalents for the individual letters of "SOS" ...
is invented at North American Aviation.
*1965: The first MEMS device is invented at Westinghouse.
*1978: Hewlett-Packard develops SPER.
*1979: NOSC starts researching thin-film SOS.
*1988: NOSC publishes their SOS findings.
*1989: IBM starts researching SOI.
*1990:
Peregrine Semiconductor
Peregrine Semiconductor, known as pSemi, is a San Diego-based manufacturer of high-performance RF (radio frequency) CMOS integrated circuits. A Murata Manufacturing company since December 2014, the company's products are used in aerospace and defe ...
is founded.
*1991: Peregrine Semiconductor launches the commercialization of SOS (UltraCMOS).
*1992: Creation of Soitec by researchers from CEA Leti in Grenoble, France.
*1995: Peregrine Semiconductor delivers its first product.
*1995: IBM commercializes SOI.
*1997: CEA Leti spins off Tronics Microsystems to commercialize SOI MEMS.
*1997: Soitec shifts to mass production after the signature of a Smart Cut™ technology licensing agreement with Shin Etsu Handotai (SEH).
*1999: Construction of Soitec's first production site in Bernin (Bernin 1), and launch of Soitec's initial public offering.
*2001: IBM unveils RF-SOI technology
*2001: CEA Leti and Motorola start collaborating on the development of high aspect ratio SOI MEMS.
*2002: OKI ships the first commercial FD-SOI LSI.
*2002: Inauguration of Bernin 2, a Soitec manufacturing unit dedicated to 300-mm diameter wafers.
*2003: Soitec acquires Picogiga International, a company specializing in technologies for III-V composite materials, and the first foray into materials other than SOI.
*2005: Freescale introduces HARMEMS.
*2006: Soitec acquires Tracit Technologies, a company specializing in molecular adhesion and mechanical and chemical thinning processes, enabling diversification into new applications for Smart Cut™ technology.
*2008: Soitec opens a production unit in Asia, in Singapore. In 2012, this unit housed the SOI wafer recycling business. In 2013, production stopped at the unit to prepare for the company's new Fully Depleted Silicon on Insulator (FD-SOI) technology.
*2009: Soitec acquires Concentrix Solar, a German supplier of concentrator photovoltaic (CPV) systems, Soitec thus entering the solar energy market.
*2011: Soitec acquires Altatech Semiconductor, a company specialized in developing equipment for producing semiconductors.
*2012: Soitec opens a production unit for CPV modules in San Diego, California, with a capacity of 140 MW, upgradeable to 280 MW.
*2012: GlobalFoundries and STMicroelectronics sign a sourcing agreement for 28 nm and 20 nm FD-SOI devices. GlobalFoundries agreed to manufacture wafers for STMicroelectronics using the latter's CMOS28FDSOI. The FD-SOI technology originates from the cooperation between Soitec, ST and CEA Leti.
*2013: Soitec signs a Smart Cut™ licensing agreement with
Sumitomo Electric
is a manufacturer of electric wire and optical fiber cables. Its headquarters are in Chūō-ku, Osaka, Japan. The company's shares are listed in the first section of the Tokyo, Nagoya Stock Exchanges, and the Fukuoka Stock Exchange. In the ...
to develop the gallium nitride (GaN) wafer market for LED lighting applications. Signature of another agreement, with GT Advanced Technologies, to develop and commercialize equipment for producing wafers for manufacturing LEDs and other industrial applications.
*2014: Samsung and STMicroelectronics sign a foundry and license agreement. It enables Samsung to use the FD-SOI technology to produce 28 nm integrated circuits. Soitec solar energy division also inaugurates the first 50% of South African Touwsrivier solar plant, which will have a final total capacity of 44 MWp. The plant was never completed.
*2015: Samsung qualifies their 28FDS process.
*2015: After the stoppage of some important solar projects in the United States, Soitec announces a strategic shift toward its electronics business and a plan to leave the solar energy business.
* 2015: Peregrine Semiconductor and GlobalFoundries announce in July the first 300mm RF-SOI platform (130 nm).
* 2015: GlobalFoundries announces in July the implementation of a technological platform for producing 22-nm FD-SOI chips (22FDX).
* 2015: Soitec and Simgui announce the first Chinese production of 200mm SOI wafers.
* 2015: CEA Leti demos MEMS on 300mm SOI wafers.
* 2016: Soitec starts volume manufacturing of 300mm RF-SOI wafers.
* 2017: GlobalFoundries announces 45RFSOI.
* 2017: Samsung announces 18FDS.
* 2017: IBM and GlobalFoundries announce a custom FinFET-on-SOI process (14HP).
* 2017: Soitec signs a five-year agreement to supply GlobalFoundries with FD-SOI wafers.
* 2018: STMicroelectronics adopts GlobalFoundries' 22FDX.
* 2018: Soitec and MBDA acquire the Dolphin Integration assets.
* 2019: Soitec signs a high-volume agreement to supply Samsung with FD-SOI wafers.
* 2019: Soitec acquires EpiGaN
* 2019: Soitec signs high-volume agreements to supply GlobalFoundries with SOI wafers.
* 2020: GlobalFoundries announces the 22FDX+ platform.
* 2020: Soitec signs a multi-year agreement to supply GlobalFoundries with 300mm RF-SOI wafers.
* 2022: start of building of the Bernin 4 facility for
SiC
The Latin adverb ''sic'' (; "thus", "just as"; in full: , "thus was it written") inserted after a quoted word or passage indicates that the quoted matter has been transcribed or translated exactly as found in the source text, complete with any e ...
wafers, intended to start production in 2024.
Operations
Historically, Soitec has marketed Silicon on Insulator (SOI) as a high performance material for manufacturing electronic chips for computers, game consoles and servers, as well as the automotive industry.
With the explosion of mobile products (tablets, smartphones, etc.) on the consumer electronics market, Soitec has also developed new materials for radio-frequency components, multimedia processors, and power electronics.
With the rapid growth of the Internet of Things,
wearables
A wearable computer, also known as a body-borne computer, is a computing device worn on the body. The definition of 'wearable computer' may be narrow or broad, extending to smartphones or even ordinary wristwatches.
Wearables may be for general ...
, and other mobile devices, new needs have arisen in terms of performance and energy efficiency of electronic components. For this market, Soitec offers materials that help reduce the energy consumed by chips, improve their information processing speed, and support the needs of high-speed Internet.
In the solar energy market Soitec acquired Concentrix Solar, then manufactured and supplied Concentrator Photovoltaic (CPV) systems from 2009 to 2015. Research to create a new generation of four-junction solar cells led Soitec to set a world record in December 2014 with a cell capable of converting 46% of solar rays into electricity. Soitec announced in January 2015 that it would be leaving the solar market after several important solar plant projects ended.
In the lighting industry, Soitec operates upstream and downstream of the LED value chain.
Upstream, the company uses its expertise in semiconductor materials to develop substrates made from gallium nitride (GaN), the base material used in
LEDs
A light-emitting diode (LED) is a semiconductor device that emits light when current flows through it. Electrons in the semiconductor recombine with electron holes, releasing energy in the form of photons. The color of the light (cor ...
.
Downstream, Soitec is developing a range of industrial partnerships to commercialize new professional lighting solutions (urban, office and transport infrastructure lighting).
Technologies
Soitec is developing numerous technologies for its different sectors of activity.
Smart Cut™
Developed by CEA-Leti in collaboration with Soitec, this technology has been patented by researcher Michel Bruel.Patent n°US5374564 /ref> It makes possible the transfer of a thin layer of monocristalline material from a donor substrate to another by combining ion implantation and bonding by molecular adhesion. Soitec uses Smart Cut™ technology to mass-produce SOI wafers. Compared with classic bulk silicon, SOI enables a significant reduction in energy leakage in the substrate, and improves the performance of the circuit in which it is used.
Smart Stacking™
This technology involves the transfer of partially or fully processed wafers onto other wafers. It can be adapted to wafer diameters of 150 mm to 300 mm and is compatible with a wide variety of substrates, such as silicon, glass and sapphire.
Smart Stacking™ technology is used for back-side illuminated image sensors, where it improves sensitivity and enables a smaller pixel size, as well as in smartphone radio-frequency circuits. It also opens new doors to 3D integration.
Epitaxy
Soitec has epitaxy expertise in III-IV materials across the following fields:
molecular beam epitaxy
Molecular-beam epitaxy (MBE) is an epitaxy method for thin-film deposition of single crystals. MBE is widely used in the manufacture of semiconductor devices, including transistors, and it is considered one of the fundamental tools for the dev ...
, metal organic vapor phase epitaxy deposition and hydride vapor phase epitaxy. The company manufactures wafers of gallium arsenide (GaAs) and gallium nitride (GaN) for developing and manufacturing compound semiconductor systems.
These materials are used in Wi-Fi and high-frequency electronic devices (mobile telecommunications, infrastructure networks, satellite communications, fiber optic networks and radar detection), as well as in energy management and optoelectronic systems, such as LEDs.
Capital increases
Soitec has carried out three capital increases:
*The first in July 2011 to finance investments, especially for developing its solar energy and LED businesses.
*The second in July 2013 to contribute to the refinancing of bonds convertible and/or exchangeable into new or existing shares (“OCEANEs”) due in 2014 and strengthen the company's financial structure. In addition, Soitec opened a further bond issue in September 2013.
*The third in June 2014 to strengthen Soitec's financial profile and its cash position and support the FD-SOI substrates industrial mass production.