A redistribution layer (RDL) is an extra metal layer on an
integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny ...
that makes its
IO pads available in other locations of the chip, for better access to the pads where necessary.
When an integrated circuit is manufactured, it usually has a set of IO pads that are
wirebonded to the pins of the package. A redistribution layer is an extra layer of wiring on the chip that enables bond out from different locations on the chip, making chip-to-chip bonding simpler. Another example of the use for RDL is for spreading the contact points around the
die
Die, as a verb, refers to death, the cessation of life.
Die may also refer to:
Games
* Die, singular of dice, small throwable objects used for producing random numbers
Manufacturing
* Die (integrated circuit), a rectangular piece of a semicondu ...
so that
solder balls can be applied, and the
thermal stress of mounting can be spread.
References
External links
Redistribution tutorial
Semiconductor device fabrication
Packaging (microfabrication)
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