microelectronics Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre- ...

, a quadin-line package (QIP or QIL), is an electronic component package with a rectangular housing and four parallel rows of electrical connecting pins. The package may be through-hole mounted to a

printed circuit board A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich str ...

(PCB) or inserted in a socket. Rockwell used a QIP with 42 leads formed into staggered rows for their PPS-4 microprocessor family introduced in 1973, and other microprocessors and microcontrollers, some with higher lead counts, through the early 1990s. The QIP has the same dimensions as a

Dual in-line package In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board ( ...

(DIP), but the leads on each side are bent into an alternating zigzag configuration so as to fit four lines of solder pads (instead of two with a DIP but similar to

Zig-zag in-line package The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 4 ...

). The QIP design increased the spacing between solder pads without increasing package size, for two reasons: # First it allowed more reliable

soldering Soldering (; ) is a process in which two or more items are joined by melting and putting a filler metal ( solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not inv ...

. This may seem odd today, given the far closer solder pad spacing in use now, but in the 1970s, the heyday of the QIL, bridging of neighbouring solder pads on DIP ICs was an issue at times, # QIP also increased the possibility of running a

copper Copper is a chemical element with the symbol Cu (from la, cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pink ...

track between two solder pads. This was very handy on the then standard single sided single layer PCBs. Some QIP packaged ICs had added

heatsink A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, ...

ing tabs, such as the HA1306W. Zilog Z8 02 1

Intel Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 ser ...

and 3M developed the ceramic leadless quad in-line package (QUIP), introduced in 1979, to boost microprocessor density and economy.Intel & 3M Develop Package to Boost Microprocessor Density & Economy
''Intelligent Machines Journal'', March 14, 1979 The ceramic leadless QUIP is not designed for

surface-mount Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referre ...

use, and requires a socket. It was used by Intel for the

iAPX 432 The iAPX 432 (''Intel Advanced Performance Architecture'') is a discontinued computer architecture introduced in 1981. It was Intel's first 32-bit processor design. The main processor of the architecture, the ''general data processor'', is imp ...

microprocessor chip set, and by

Zilog Zilog, Inc. is an American manufacturer of microprocessors and 8-bit and 16-bit microcontrollers. It is also a supplier of application-specific embedded system-on-chip (SoC) products. Its most famous product is the Z80 series of 8-bit micropro ...

for the Z8-02 external-ROM

prototyping A prototype is an early sample, model, or release of a product built to test a concept or process. It is a term used in a variety of contexts, including semantics, design, electronics, and software programming. A prototype is generally used to ...

version of the Z8 microcontroller. Philips N4422 - drive unit - board 1 - SGS TAA611T12-2755.jpg, Phillips Audio power amplifier IC in QIP-14 LM8001E.jpg, Sanyo IC in QIP-36 Sharp I5352SA 1.jpg,

Sharp Sharp or SHARP may refer to: Acronyms * SHARP (helmet ratings) (Safety Helmet Assessment and Rating Programme), a British motorcycle helmet safety rating scheme * Self Help Addiction Recovery Program, a charitable organisation founded in 199 ...

I5352SA in QIP-42 K1573HM1.jpg,

Soviet The Soviet Union,. officially the Union of Soviet Socialist Republics. (USSR),. was a List of former transcontinental countries#Since 1700, transcontinental country that spanned much of Eurasia from 1922 to 1991. A flagship communist state, ...

IC in QIP-48 ΜPD768D(μCOM-1600)Chip (cropped).jpg, NEC ΜPD768D (μCOM-1600) in QIP-64

References

External links

{{Early CPU sockets Chip carriers CPU sockets