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Quilt Packaging (QP) is an
Quilt Packaging (QP) is an integrated circuit packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. ...
and chip-to-chip interconnect packaging
Packaging is the science, art and technology of enclosing or protecting products for distribution, storage, sale, and use. Packaging also refers to the process of designing, evaluating, and producing packages. Packaging can be described as a co ...
technology that utilizes “ nodule” structures that extend out horizontally from the edges of microchips to make electrically and mechanically robust chip-to-chip interconnections.
QP nodules are created as an integral part of the microchip using standard back end of the line semiconductor
A semiconductor is a material which has an electrical resistivity and conductivity, electrical conductivity value falling between that of a electrical conductor, conductor, such as copper, and an insulator (electricity), insulator, such as glas ...
device fabrication techniques. Solder is then electroplated
Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the redox, reduction of cations of that metal by means of a direct current, direct electric cur ...
on top of the nodules to enable the chip to chip interconnection with sub-micron alignment accuracy.
Small high yielding “chiplets
A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single electronic packaging, package. A set of chiplets can be implemented in ...
” made from any semiconductor
A semiconductor is a material which has an electrical resistivity and conductivity, electrical conductivity value falling between that of a electrical conductor, conductor, such as copper, and an insulator (electricity), insulator, such as glas ...
material (Silicon
Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic tab ...
, Gallium Arsenide
Gallium arsenide (GaAs) is a III-V direct band gap semiconductor with a Zincblende (crystal structure), zinc blende crystal structure.
Gallium arsenide is used in the manufacture of devices such as microwave frequency integrated circuits, monoli ...
, Silicon Carbide
Silicon carbide (SiC), also known as carborundum (), is a hard chemical compound containing silicon and carbon. A semiconductor, it occurs in nature as the extremely rare mineral moissanite, but has been mass-produced as a powder and crystal sin ...
, Gallium Nitride
Gallium nitride () is a binary III/ V direct bandgap semiconductor commonly used in blue light-emitting diodes since the 1990s. The compound is a very hard material that has a Wurtzite crystal structure. Its wide band gap of 3.4 eV affords it ...
, etc.), can be “quilted” together to create larger multi-function meta-chip. Thus, QP technology can integrate multiple chips with dissimilar technologies or substrate materials in planar, 2.5D and 3D configurations.
RF Analog Performance
Multiple measuredinsertion loss
In telecommunications, insertion loss is the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).
If the power transmitted to the load before insertion ...
on QP interconnects have been conducted on quilted chipsets with sets of homogeneous and heterogeneous semiconductor materials. Radio frequency
Radio frequency (RF) is the oscillation rate of an alternating electric current or voltage or of a magnetic, electric or electromagnetic field or mechanical system in the frequency range from around to around . This is roughly between the upp ...
S-parameter
Scattering parameters or S-parameters (the elements of a scattering matrix or S-matrix) describe the electrical behavior of linear electrical networks when undergoing various steady state stimuli by electrical signals.
The parameters are useful f ...
measurements were made from DC to 220 GHz. QP interconnects have demonstrated less than 0.1 dB insertion loss from DC to 100 GHz between silicon and silicon chips, and less than 0.8 dB insertion loss up to 220 GHz between Silicon and Gallium Arsenide.
Digital Performance
QP interconnects have a achieved 12 gigabit/sec (Gbps)bit-rate
In telecommunications and computing, bit rate (bitrate or as a variable ''R'') is the number of bits that are conveyed or processed per unit of time.
The bit rate is expressed in the unit bit per second (symbol: bit/s), often in conjunction w ...
throughput with no distortion with 10 µm nodules on a 10 µm pitch on the edge of the chip.
Optics/Photonics
Preliminary opticalcoupling loss
Coupling loss, also known as connection loss, is the loss that occurs when energy is transferred from one electrical circuit, circuit, circuit element, or medium to another. Coupling loss is usually expressed in the same units of measurement, uni ...
simulations and measurements indicate that inter-chip coupling loss is < 6 dB for a gap of less than 4 µm. Loss rapidly improves as the gap approaches zero, which is achievable with Quilt Packaging assembly tolerances.
References
{{Semiconductor packages Packaging (microfabrication)