AMD Phenom II X6 1090T (HDT90ZFBK6DGR) CPU-pins PNr°0295

A pin grid array (PGA) is a type of

integrated circuit packaging In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. ...

. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on

printed circuit board A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich str ...

s using the through hole method or inserted into a

socket Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexag ...

. PGAs allow for more pins per integrated circuit than older packages, such as

dual in-line package In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board ( ...

(DIP).

PGA variants

Plastic

Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core

Celeron Celeron is Intel's brand name for low-end IA-32 and x86-64 computer microprocessor models targeted at low-cost personal computers. Celeron processors are compatible with IA-32 software. They typically offer less performance per clock speed co ...

processors based on Socket 370. Some pre-Socket 8 processors also used a similar form factor, although they were not officially referred to as PPGA. Pentium 4 Underside Demonstrating PGA Socket

Pentium 4 Underside Demonstrating PGA Socket

Flip chip

A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the

die Die, as a verb, refers to death, the cessation of life. Die may also refer to: Games * Die, singular of dice, small throwable objects used for producing random numbers Manufacturing * Die (integrated circuit), a rectangular piece of a semicondu ...

faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the

heatsink A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, ...

or other cooling mechanism. The FC-PGA was introduced by

Intel Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 ser ...

with the Coppermine core

Pentium III The Pentium III (marketed as Intel Pentium III Processor, informally PIII or P3) brand refers to Intel's 32-bit x86 desktop and mobile CPUs based on the sixth-generation P6 microarchitecture introduced on February 28, 1999. The brand's initia ...

and

processors based on Socket 370, and was later used for

Socket 478 Socket 478, also known as mPGA478 or mPGA478B, is a 478-contact CPU socket used for Intel's Pentium 4 and Celeron series CPUs. Socket 478 was launched in August 2001 in advance of the Northwood core to compete with AMD's 462-pin Socket A a ...

-based

Pentium 4 Pentium 4 is a series of single-core CPUs for desktops, laptops and entry-level servers manufactured by Intel. The processors were shipped from November 20, 2000 until August 8, 2008. The production of Netburst processors was active from 2000 ...

and Celeron processors. FC-PGA processors fit into zero insertion force (ZIF) Socket 370 and Socket 478-based motherboard sockets; similar packages have also been used by AMD. It is still used today for mobile Intel processors.

Staggered pin

The staggered pin grid array (SPGA) is used by Intel processors based on Socket 5 and

Socket 7 Socket 7 is a physical and electrical specification for an x86-style CPU socket on a personal computer motherboard. It was released in June 1995. The socket supersedes the earlier Socket 5, and accepts P5 Pentium microprocessors manufactured by ...

Socket 8 The Socket 8 CPU socket was used exclusively with the Intel Pentium Pro and Pentium II Overdrive computer processors. Intel discontinued Socket 8 in favor of Slot 1 with the introduction of the Pentium II and Slot 2 with the release of ...

used a partial SPGA layout on half the processor. Socket 7

It consists of two square arrays of pins, offset in both directions by half the minimum distance between pins in one of the arrays. Put differently: within a square boundary the pins form a diagonal square lattice. There is generally a section in the center of the package without any pins. SPGA packages are usually used by devices that require a higher pin density than what a PGA can provide, such as

microprocessor A microprocessor is a computer processor where the data processing logic and control is included on a single integrated circuit, or a small number of integrated circuits. The microprocessor contains the arithmetic, logic, and control circ ...

Ceramic

A ceramic pin grid array (CPGA) is a type of packaging used by

integrated circuits An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tin ...

. This type of packaging uses a ceramic substrate with pins arranged in a pin grid array. Some

CPU A central processing unit (CPU), also called a central processor, main processor or just processor, is the electronic circuitry that executes instructions comprising a computer program. The CPU performs basic arithmetic, logic, controlling, a ...

s that use CPGA packaging are the AMD Socket A Athlons and the

Duron Duron is a line of budget x86-compatible microprocessors manufactured by AMD. Released on June 19, 2000 as a lower-cost offering to complement AMD's then mainstream performance Athlon processor line, it also competed with rival chipmaker In ...

. A CPGA was used by AMD for Athlon and Duron processors based on Socket A, as well as some AMD processors based on Socket AM2 and Socket AM2+. While similar form factors have been used by other manufacturers, they are not officially referred to as CPGA. This type of packaging uses a

ceramic A ceramic is any of the various hard, brittle, heat-resistant and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature. Common examples are earthenware, porcelain, ...

substrate with pins arranged in an array. File:VIA C3 C5XL CPGA.jpg, A 1.2 GHz VIA C3 microprocessor in a ceramic package File:Pentium P54 Socket7 PGA.jpg, 133 MHz Pentium chip in a ceramic package

Organic

An organic pin grid array (OPGA) is a type of connection for

integrated circuit An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny ...

s, and especially CPUs, where the

silicon Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic ...

is attached to a plate made out of an

organic Organic may refer to: * Organic, of or relating to an organism, a living entity * Organic, of or relating to an anatomical organ Chemistry * Organic matter, matter that has come from a once-living organism, is capable of decay or is the product ...

plastic Plastics are a wide range of synthetic or semi-synthetic materials that use polymers as a main ingredient. Their plasticity makes it possible for plastics to be moulded, extruded or pressed into solid objects of various shapes. This adapta ...

which is pierced by an array of pins which make the requisite connections to the

. File:SL3A2down.JPG, The underside of a

-400 in a PPGA File:AMD Athlon XP 2000 - Socket A - OPGA.jpg, An OPGA CPU. Note the brown color – many OPGA parts are colored green. The die is in the center of the device, and the four gray circles are foam spacers to relieve pressure from the die, caused by the heat sink.

Stud

A stud grid array (SGA) is a short-pinned pin grid array chip scale package for use in surface-mount technology. The polymer stud grid array or plastic stud grid array was developed jointly by the Interuniversity Microelectronics Centre (IMEC) and

Laboratory for Production Technology A laboratory (; ; colloquially lab) is a facility that provides controlled conditions in which scientific or technological research, experiments, and measurement may be performed. Laboratory services are provided in a variety of settings: physicia ...

, Siemens AG.

rPGA

The reduced pin grid array was used by the socketed mobile variants of Intel's Core i3/5/7 processors and features a reduced pin pitch of 1mm, as opposed to the 1.27mm pin pitch used by contemporary AMD processors and older Intel processors. It is used in the G1, G2, and G3 sockets.

References

Sources

* * *

External links

Intel CPU Processor Identification

Ball Grid Arrays: the High-Pincount Workhorses
John Baliga, associate editor, '' Semiconductor International'', 9/1/1999
Spot on component packaging
08/1998, '' Elektronik, Produktion & Prüftechnik''
Terminology
{{Semiconductor packages Chip carriers