Multibeam is an American corporation that engages in the design, manufacture, and sale of
semiconductor
A semiconductor is a material which has an electrical resistivity and conductivity, electrical conductivity value falling between that of a electrical conductor, conductor, such as copper, and an insulator (electricity), insulator, such as glas ...
processing equipment used in the
fabrication of integrated circuits. Headquartered in
Santa Clara, in the
Silicon Valley
Silicon Valley is a region in Northern California that serves as a global center for high technology and innovation. Located in the southern part of the San Francisco Bay Area, it corresponds roughly to the geographical areas San Mateo County ...
, Multibeam is led by
Dr. David K. Lam, the founder and first CEO of
Lam Research
Lam Research Corporation is an American supplier of wafer fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active c ...
.
Technology
Multibeam developed miniature, all-electrostatic columns for
e-beam lithography
Electron-beam lithography (often abbreviated as e-beam lithography, EBL) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing). The electron b ...
, that provide a mask-less and high throughput platform for writing nanoscale IC patterns seamlessly across full wafers. Arrays of e-beam columns operate simultaneously and in parallel to increase
wafer
A wafer is a crisp, often sweet, very thin, flat, light and dry biscuit, often used to decorate ice cream, and also used as a garnish on some sweet dishes. Wafers can also be made into cookies with cream flavoring sandwiched between them. They ...
processing speed. With over 35 patents issued,
these multi-column e-beam lithography (MEBL) systems enable an array of direct write lithography applications, including Complementary E-Beam Lithography (CEBL), Secure Chip ID, Advanced Packaging Interposers, Photonics, and other applications where precise, nanometer-scale features are required.
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Applications
* Complementary Electron Beam Lithography (CEBL) works with optical lithography to pattern cuts (of lines in "lines-and-cuts" layout) and holes (i.e., contacts
Contact lenses, or simply contacts, are thin lenses placed directly on the surface of the eyes. Contact lenses are ocular prosthetic devices used by over 150 million people worldwide, and they can be worn to correct vision or for cosmetic ...
and vias
The Vias GmbH (stylized VIAS) is a rail service company based in Frankfurt (Germany). The name of the company was taken from the Latin word via for ''way'' and the letter ''S'' for service. It operates rail services in the states of Hesse, Rhine ...
) with no masks.
* Secure Chip ID embeds unique security information in each IC including chip ID, IP or MAC address, and chip-specific information such as keys
Key or The Key may refer to:
Common meanings
* Key (cryptography), a piece of information that controls the operation of a cryptography algorithm
* Key (lock), device used to control access to places or facilities restricted by a lock
* Key (map ...
used in encryption
In cryptography, encryption is the process of encoding information. This process converts the original representation of the information, known as plaintext, into an alternative form known as ciphertext. Ideally, only authorized parties can decip ...
. Chip ID is used for supply chain traceability and to detect counterfeits. Hardware-embedded encryption keys are used to authenticate software. Chip-specific information written into bit registers is non-volatile.
* Advanced Packaging Interposers can be used in chip fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are pres ...
in semiconductor chip packaging applications where high performance, low power, long battery life and compact size are needed. Patterns can be varied on a small scale over a large field with nanometer resolutions. Used in high volume or batch production of System in Package (SiP), MEMS & Sensor Packaging, Fan Out Packaging, and 2.5D/3D IC Packaging.
References
External links
*{{Official website, http://www.multibeamcorp.com
Equipment semiconductor companies
Nanotechnology companies
Technology companies established in 2010
Companies based in Santa Clara, California
Technology companies based in the San Francisco Bay Area
American companies established in 2010