LGA 1700 (Socket V) is a

zero insertion force Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is mo ...

flip-chip Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to exter ...

land grid array The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a ...

(LGA)

socket Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexag ...

, compatible with

Intel Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 seri ...

desktop

processors A central processing unit (CPU), also called a central processor, main processor or just processor, is the electronic circuitry that executes instructions comprising a computer program. The CPU performs basic arithmetic, logic, controlling, ...

Alder Lake Alder Lake is Intel's codename for the 12th generation of Intel Core processors based on a hybrid architecture utilizing Golden Cove performance cores and Gracemont efficient cores. It is fabricated using Intel's Intel 7 process, previousl ...

and

Raptor Lake Raptor Lake is Intel's codename for the 13th-generation of Intel Core processors based on a hybrid architecture, utilizing Raptor Cove performance cores and Gracemont efficient cores. Raptor Lake launched on October 20, 2022. Mobile versions ...

, which was first released in November 2021. LGA 1700 is designed as a replacement for

LGA 1200 LGA 1200 is a zero insertion force flip-chip land grid array (LGA) CPU socket, socket, compatible with Intel desktop Central processing unit, processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 202 ...

(known as ''Socket H5'') and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of

LGA 775 LGA 775 (land grid array 775), also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the ...

in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs.

Heatsink design

Since the introduction of

Land grid array The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a ...

(LGA)-based sockets in the consumer hardware space in 2004, the thermal solution ''hole pattern'' (the distance between the screw-holes for the heatsink) has changed three times for Intel's mainstream platforms: * For

, it is 72 mm × 72 mm * For

LGA 1156 LGA 1156 (land grid array 1156), also known as Socket H or H1, is an Intel desktop CPU socket. Its incompatible successor is LGA 1155. The last processors supporting it ceased production in 2011. LGA 1156, along with LGA 1366, were designed ...

LGA 1155 LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge (2nd Gen) and Ivy Bridge (3rd Gen) microarchitectures. It is the successor of L ...

LGA 1150 LGA 1150, also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwe ...

LGA 1151 LGA 1151, also known as Socket H4, zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in two distinct versions: the first revision which supports both Intel's Skylake and Kaby Lake CPUs, ...

and

it is 75 mm × 75 mm * For LGA 1700, it is 78 mm × 78 mm While some motherboards do offer additional mounting holes for using older coolers, e.g. for using an LGA115x cooler on an LGA1700 motherboard, differences in Z-height and the mounting pressure will result in worse than expected cooling performance. For best results it is recommended to either change the cooling solution to a model certified for this platform or request an updated mounting-kit for one of the higher-end solutions on the market. For heatsinks to be interchangeable, not only the hole pattern, but also the socket seating plane height, the maximum thermal solution center of gravity height from the

IHS IHS may refer to: Religious * Christogram IHS or ΙΗΣ, a monogram symbolizing Jesus Christ * ''In hoc signo'', used by Roman emperor Constantine the Great Organizations * Indian Health Service, an operating division of the US Department of Hea ...

or the static total compressive minimum need to match.

Issues

Even though some CPU cooler manufacturers are providing adapter kits (usually in the form of different screws) to go with existing LGA115x retention brackets, there have been reports of the CPU bending or bowing due to uneven mounting pressure from the LGA 1700 Integrated Loading Mechanism (ILM). This leads to the CPU having reduced contact with the cooler plate, which in turn leads to increased temperatures. LGA 1700 contact frames to replace the stock ILM have been released by Thermal Grizzly and Thermalright to ensure even CPU mounting pressure and cooler contact.

Alder Lake chipsets (600 series)

Raptor Lake chipsets (700 series)

References

{{Intelsock Intel CPU sockets

Heatsink design

Issues

Alder Lake chipsets (600 series)

Raptor Lake chipsets (700 series)

See also

References