The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a
Technical Field Award established by the
IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of
components
Circuit Component may refer to:
•Are devices that perform functions when they are connected in a circuit.
In engineering, science, and technology Generic systems
* System components, an entity with discrete structure, such as an assem ...
,
electronic packaging or
manufacturing technologies.
The award may be presented to an individual or a team of up to three recipients.
Recipients of this award receive a bronze medal, certificate and an
honorarium.
Recipients
Recipients of the award for each year include:
* 2021: Chin C. Lee
* 2020: Mitsumasa Koyanagi and Peter Ramm
* 2019: Ephraim Suhir
* 2018: William Chen
* 2017: Paul S. Ho and King-Ning Tu
* 2016: Michael Pecht
* 2015: Nasser Borozorg-Grayeli
* 2014: Avram Bar-Cohen
* 2013: John Lau
* 2012: Mauro Walker
* 2011: Rao R. Tummala
* 2010: Herbert Reichl
* 2009: George G. Harman
* 2008: Karl Puttlitz and Paul A. Totta
* 2007: Dimitry Grabbe
* 2006: C. P. Wong
C. P. Wong, Regent's Professor
Georgia Inst. Technology
* 2005: Yutaka Tsukada
* 2004: John W. Balde
References
External links
Electronics Packaging Award
Awards established in 2002
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