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The front-end-of-line (FEOL) is the first portion of IC fabrication where the individual components (
transistor upright=1.4, gate (G), body (B), source (S) and drain (D) terminals. The gate is separated from the body by an insulating layer (pink). A transistor is a semiconductor device used to Electronic amplifier, amplify or electronic switch, switch ...
s,
capacitor A capacitor is a device that stores electrical energy in an electric field by virtue of accumulating electric charges on two close surfaces insulated from each other. It is a passive electronic component with two terminals. The effect of ...
s,
resistor A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used to reduce current flow, adjust signal levels, to divide voltages, bias active e ...
s, etc.) are patterned in the
semiconductor A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way ...
. FEOL generally covers everything up to (but not including) the deposition of metal interconnect layers. For the
CMOS Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", ) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSF ...
process, FEOL contains all fabrication steps needed to form isolated CMOS elements: # Selecting the type of wafer to be used;
Chemical-mechanical planarization Chemical mechanical polishing (CMP) or planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. Description The pr ...
and cleaning of the wafer. #
Shallow trench isolation Shallow trench isolation (STI), also known as box isolation technique, is an integrated circuit feature which prevents electric current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology ...
(STI) (or LOCOS in early processes, with feature size > 0.25 μm) # Well formation #
Gate A gate or gateway is a point of entry to or from a space enclosed by walls. The word derived from old Norse "gat" meaning road or path; But other terms include ''yett and port''. The concept originally referred to the gap or hole in the wall ...
module formation # Source and drain module formation


See also

*
Back end of line The back end of line (BEOL) is the second portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) get interconnected with wiring on the wafer, the metalization layer. Common metals are copper and alum ...
*
Integrated circuit An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny ...


References


Further reading

*"CMOS: Circuit Design, Layout, and Simulation" Wiley-IEEE, 2010.
pages 177-178
(Chapter 7.2 CMOS Process Integration); pages 180-199 (7.2.1 Frontend-of-the-line integration) Electronics manufacturing Semiconductor device fabrication {{compu-hardware-stub