The FeaturePak standard defines a small
form factor card for
I/O expansion of
embedded systems
An embedded system is a computer system—a combination of a computer processor, computer memory, and input/output peripheral devices—that has a dedicated function within a larger mechanical or electronic system. It is ''embedded'' ...
and other space-constrained computing applications. The cards are intended to be used for adding a wide range of capabilities, such as
A/D,
D/A, digital I/O, counter/timers,
serial I/O
In telecommunication and data transmission, serial communication is the process of sending data one bit at a time, sequentially, over a communication channel or computer bus. This is in contrast to parallel communication, where several bits are s ...
,
wired
''Wired'' (stylized as ''WIRED'') is a monthly American magazine, published in print and online editions, that focuses on how emerging technologies affect culture, the economy, and politics. Owned by Condé Nast, it is headquartered in San ...
or
wireless
Wireless communication (or just wireless, when the context allows) is the transfer of information between two or more points without the use of an electrical conductor, optical fiber or other continuous guided medium for the transfer. The most ...
networking,
image processing
An image is a visual representation of something. It can be two-dimensional, three-dimensional, or somehow otherwise feed into the visual system to convey information. An image can be an artifact, such as a photograph or other two-dimensio ...
,
GPS
The Global Positioning System (GPS), originally Navstar GPS, is a satellite-based radionavigation system owned by the United States government and operated by the United States Space Force. It is one of the global navigation satellite sy ...
, etc. to their host systems.
FeaturePak cards plug into edgecard sockets, parallel to the mainboard, similarly to how
SO-DIMM
A DIMM () (Dual In-line Memory Module), commonly called a RAM stick, comprises a series of dynamic random-access memory integrated circuits. These memory modules are mounted on a printed circuit board and designed for use in personal computers ...
memory modules install in laptop or desktop PCs.
Socket Interface
The FeaturePak socket consists of a 230-pin
"MXM" connector, which provides all connections to the FeaturePak card, including the host interface, external I/O signals, and power. (Note, however, that the FeaturePak specification's use of the MXM connector differs from that of Nvidia's MXM specification.)
Host interface connections include:
*
PCI Express
PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common ...
-- up to two PCI Express x1 lanes
*
USB -- up to two USB 1.1 or 2.0 channels
*Serial—one logic-level
UART
A universal asynchronous receiver-transmitter (UART ) is a computer hardware device for asynchronous serial communication in which the data format and transmission speeds are configurable. It sends data bits one by one, from the least significan ...
interface
*
SMBus The System Management Bus (abbreviated to SMBus or SMB) is a single-ended simple two-wire bus for the purpose of lightweight communication. Most commonly it is found in computer motherboards for communication with the power source for ON/OFF instru ...
*
JTAG
JTAG (named after the Joint Test Action Group which codified it) is an Technical standard, industry standard for verifying designs and testing printed circuit boards after manufacture.
JTAG implements standards for on-chip instrumentation in ele ...
*PCI Express Reset
*Several auxiliary signals
*3V and 5V power and ground
*Reserved lines (for future enhancements)
The balance of the 230-pin FeaturePak socket is allocated to I/O, in two groups:
*Primary I/O—50 general purpose I/O lines, of which 34 pairs have enhanced isolation
*Secondary I/O—50 general purpose I/O lines
The FeaturePak socket's MXM connector is claimed capable of 2.5 Gbit/s bandwidth on each pin, thereby supporting high-speed interfaces such as PCI Express,
gigabit Ethernet
In computer networking, Gigabit Ethernet (GbE or 1 GigE) is the term applied to transmitting Ethernet frames at a rate of a gigabit per second. The most popular variant, 1000BASE-T, is defined by the IEEE 802.3ab standard. It came into use i ...
,
USB 2.0
Universal Serial Bus (USB) is an industry standard that establishes specifications for cables, connectors and protocols for connection, communication and power supply (interfacing) between computers, peripherals and other computers. A broad ...
, among others. Enhanced I/O signal isolation within the Primary I/O group is accomplished by leaving alternate pins on the MXM connector interface unused.
FeaturePak cards are powered by 3.3V and use standard 3.3V
logic level
In digital circuits, a logic level is one of a finite number of states that a digital signal can inhabit. Logic levels are usually represented by the voltage difference between the signal and ground, although other standards exist. The range of ...
s. The socket also provides a 5V input option, for cards that require the additional voltage to power auxiliary functions.
Other than the provision of extra isolation for 34 signal pairs, there is no defined allocation of the signals within the Primary I/O and Secondary I/O groups, leaving each FeaturePak to define its own utilization of the I/O signals. Consequently, there is little limitation as to what can be implemented on a FeaturePak card.
Card size
Overall FeaturePak horizontal dimensions are 1.75 x 2.55 inches (43 x 65 mm). There are two options for topside component thickness: "tall" FeaturePak modules may have topside components of up to 0.4 inch (10 mm) thick; "standard" modules are limited to 0.19 inch (4.8 mm) topside component thickness.
History
The FeaturePak standard was launched by the FeaturePak Initiative at Embedded World 2010 in Nuremberg, Germany, in March 2010. At launch, the Initiative consisted of FeaturePak originato
Diamond Systems plus FeaturePak Initiative charter member
Arbor TechnologyCogent Computer SystemscongatecConnect TechDouglas ElectronicsHectronic an
IXXAT Automation
The FeaturePak Initiative subsequently was superseded by a California nonprofit corporation known as the FeaturePak Trade Association (FPTA), which assumed ownership of the FeaturePak specification and other IP (intellectual property) and became responsible for maintaining, extending, and promoting the FeaturePak standard and established restrictions and guidelines pertaining to the use of the FeaturePak trademark and logos.
Openness
The FeaturePak specification is freely available by application on the FeaturePak Trade Association's website. As stated on FeaturePak.org, "You need not join the FPTA or be otherwise licensed, in order to develop or manufacture products based on or incorporating FPTA specifications. However, use of FPTA-owned logos is restricted to FPTA members in good standing or to those explicitly licensed by the FPTA to use them. Please contact the FPTA for details regarding non-member licensing of FPTA logos."
External links
FeaturePak Initiative Website
References
{{DEFAULTSORT:Featurepak
Motherboard form factors
Computer buses
Embedded systems