E-Material, also called E Material, is a

metal matrix composite In materials science, a metal matrix composite (MMC) is a composite material with fibers or particles dispersed in a metallic matrix, such as copper, aluminum, or steel. The secondary phase is typically a ceramic (such as alumina or silicon carb ...

consisting of

beryllium Beryllium is a chemical element with the symbol Be and atomic number 4. It is a steel-gray, strong, lightweight and brittle alkaline earth metal. It is a divalent element that occurs naturally only in combination with other elements to form mi ...

matrix with

beryllium oxide Beryllium oxide (BeO), also known as beryllia, is an inorganic compound with the formula BeO. This colourless solid is a notable electrical insulator with a higher thermal conductivity than any other non-metal except diamond, and exceeds that of m ...

particles. It has high

thermal conductivity The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by k, \lambda, or \kappa. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal ...

(210-230 W/m K), and its

thermal expansion Thermal expansion is the tendency of matter to change its shape, area, volume, and density in response to a change in temperature, usually not including phase transitions. Temperature is a monotonic function of the average molecular kinetic ...

can be adjusted to match other materials, e.g.

silicon Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic tab ...

and

gallium arsenide Gallium arsenide (GaAs) is a III-V direct band gap semiconductor with a Zincblende (crystal structure), zinc blende crystal structure. Gallium arsenide is used in the manufacture of devices such as microwave frequency integrated circuits, monoli ...

chips and various

ceramic A ceramic is any of the various hard, brittle, heat-resistant and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature. Common examples are earthenware, porcelain ...

s. It is chiefly used in

microelectronics Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre-sc ...

as substrate for

power semiconductor device A power semiconductor device is a semiconductor device used as a switch or rectifier in power electronics (for example in a switch-mode power supply). Such a device is also called a power device or, when used in an integrated circuit, a power IC. ...

s and high density

multi-chip module A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are int ...

s, where it aids with removal of

waste heat Waste heat is heat that is produced by a machine, or other process that uses energy, as a byproduct of doing work. All such processes give off some waste heat as a fundamental result of the laws of thermodynamics. Waste heat has lower utility ...

. E-materials have low weight and high strength, making them especially suitable for

aerospace Aerospace is a term used to collectively refer to the atmosphere and outer space. Aerospace activity is very diverse, with a multitude of commercial, industrial and military applications. Aerospace engineering consists of aeronautics and astrona ...

technology. Their high

elastic modulus An elastic modulus (also known as modulus of elasticity) is the unit of measurement of an object's or substance's resistance to being deformed elastically (i.e., non-permanently) when a stress is applied to it. The elastic modulus of an object is ...

is favorable for absorbing vibrations and lowering material fatigue of attached modules and wire bonds. Several variants exist: * E-20, containing 80 vol.% of beryllium and 20 vol.% (25.8-32.25 w.%) beryllium oxide. Its thermal conductivity is 210 W/(m·K). Its thermal expansion coefficient is 8.7. Its density at 25 °C is 2.045 g/cm³. * E-40, containing 60 vol.% of beryllium and 40 vol.% (49.5-54.8 w.%) beryllium oxide. Its thermal conductivity is 220 W/(m·K). Its thermal expansion coefficient is 7.5. Its density at 25 °C is 2.277 g/cm³. * E-60, containing 40 vol.% of beryllium and 60 vol.% (69.4-73.2 w.%) beryllium oxide. Its thermal conductivity is 230 W/(m·K). Its thermal expansion coefficient is 6.1. Its density at 25 °C is 2.513 g/cm³. E-materials are prepared by impact grinding and then

hot isostatic pressing Hot isostatic pressing (HIP) is a manufacturing process, used to reduce the porosity of metals and increase the density of many ceramic materials. This improves the material's mechanical properties and workability. The process can be used to pro ...

into a block. The block is then sliced to cards, sawn to required shape, polished, machined, and optionally plated with e.g.

nickel Nickel is a chemical element with symbol Ni and atomic number 28. It is a silvery-white lustrous metal with a slight golden tinge. Nickel is a hard and ductile transition metal. Pure nickel is chemically reactive but large pieces are slow to ...

cadmium Cadmium is a chemical element with the symbol Cd and atomic number 48. This soft, silvery-white metal is chemically similar to the two other stable metals in group 12, zinc and mercury. Like zinc, it demonstrates oxidation state +2 in most of ...

, chrome,

silver Silver is a chemical element with the Symbol (chemistry), symbol Ag (from the Latin ', derived from the Proto-Indo-European wikt:Reconstruction:Proto-Indo-European/h₂erǵ-, ''h₂erǵ'': "shiny" or "white") and atomic number 47. A soft, whi ...

copper Copper is a chemical element with the symbol Cu (from la, cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkis ...

, or

gold Gold is a chemical element with the symbol Au (from la, aurum) and atomic number 79. This makes it one of the higher atomic number elements that occur naturally. It is a bright, slightly orange-yellow, dense, soft, malleable, and ductile met ...

. Without coatings, the

corrosion Corrosion is a natural process that converts a refined metal into a more chemically stable oxide. It is the gradual deterioration of materials (usually a metal) by chemical or electrochemical reaction with their environment. Corrosion engine ...

resistance of E-materials is similar to aluminium. E-materials are used in

technology, e.g. as laminated

s in

Iridium Iridium is a chemical element with the symbol Ir and atomic number 77. A very hard, brittle, silvery-white transition metal of the platinum group, it is considered the second-densest naturally occurring metal (after osmium) with a density of ...

and

Globalstar Globalstar, Inc. is an American satellite communications company that operates a low Earth orbit (LEO) satellite constellation for satellite phone and low-speed data communications. The Globalstar second-generation constellation consists of 24 l ...

satellites, as

heat sink A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, th ...

s, and in

avionics Avionics (a blend word, blend of ''aviation'' and ''electronics'') are the Electronics, electronic systems used on aircraft. Avionic systems include communications, Air navigation, navigation, the display and management of multiple systems, ...

F-22 Raptor The Lockheed Martin F-22 Raptor is an American single-seat, twin-engine, all-weather stealth tactical fighter aircraft developed for the United States Air Force (USAF). As the result of the USAF's Advanced Tactical Fighter (ATF) program, th ...

F-16 Fighting Falcon The General Dynamics F-16 Fighting Falcon is a single-engine multirole fighter aircraft originally developed by General Dynamics for the United States Air Force (USAF). Designed as an air superiority day fighter, it evolved into a successful ...

F/A-18 Hornet The McDonnell Douglas F/A-18 Hornet is an all-weather, twinjet, twin-engine, supersonic aircraft, supersonic, carrier-based aircraft, carrier-capable, Multirole combat aircraft, multirole combat aircraft, designed as both a Fighter aircraft, ...

, and the

Joint Strike Fighter Joint Strike Fighter (JSF) is a development and acquisition program intended to replace a wide range of existing fighter, strike, and ground attack aircraft for the United States, the United Kingdom, Italy, Canada, Australia, the Netherlands ...

. It is also used in SEM-E modules and

printed wiring board A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich struc ...

s. Care has to be taken during machining and handling of E-materials, as beryllium and its compounds are toxic. Gold-tin and gold-germanium alloys can be used for

brazing Brazing is a metal-joining process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal. Brazing differs from we ...

with

kovar Kovar (trademark of CRS Holdings, inc., Delaware) is a nickel–cobalt ferrous alloy compositionally identical to Fernico 1, designed to have substantially the same thermal expansion characteristics as borosilicate glass (~5 × 10−6 /K betwe ...

or CuMo and other electronics packaging alloys.
A similar material is

Dymalloy Dymalloy is a metal matrix composite consisting of 20% copper and 80% silver alloy matrix with type I diamond. It has very high thermal conductivity of 420 W/(m·K), and its thermal expansion can be adjusted to match other materials, e.g. sili ...

, with copper-silver alloy instead of beryllium and

diamond Diamond is a Allotropes of carbon, solid form of the element carbon with its atoms arranged in a crystal structure called diamond cubic. Another solid form of carbon known as graphite is the Chemical stability, chemically stable form of car ...

instead of beryllium oxide, or

AlSiC AlSiC, pronounced "alsick", is a metal matrix composite consisting of aluminium matrix with silicon carbide particles. It has high thermal conductivity (180–200 W/m K), and its thermal expansion can be adjusted to match other materials, e.g. silic ...

aluminium Aluminium (aluminum in American and Canadian English) is a chemical element with the symbol Al and atomic number 13. Aluminium has a density lower than those of other common metals, at approximately one third that of steel. I ...

with silicon carbide
.
Other materials are copper reinforced with carbon fiber, diamond-reinforced aluminium, reinforced carbon-carbon, and pyrolytic graphite. Another similar material is AlBeMet®, a metal-matrix composite of aluminium and beryllium.

References

{{reflist Beryllium alloys Metal matrix composites Chip carriers