Integrated circuit An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny ...

s are put into protective packages to allow easy handling and assembly onto

printed circuit boards A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich struc ...

and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as

JEDEC The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in Arlington County, Virginia, United States. JEDEC has over 300 members, including some of the w ...

and

Pro Electron Pro Electron or EECA is the European type designation and registration system for active components (such as semiconductors, liquid crystal displays, sensor devices, electronic tubes and cathode ray tubes). Pro Electron was set up in 1966 in Br ...

. Other types are proprietary designations that may be made by only one or two manufacturers.

Integrated circuit packaging In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. ...

is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In

flip chip Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to extern ...

systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.

Through-hole packages

Through-hole technology uses holes drilled through the

printed circuit board A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich str ...

(PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three IC circuit chips

Surface mount

Chip on board Chip on board (COB) is a method of circuit board manufacturing in which the integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. By eliminating the pa ...

is a packaging technique that directly connects a die to a PCB, without an

interposer An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection. Interposer comes from t ...

or lead frame.

Chip carrier

chip carrier In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for moun ...

is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

Pin grid arrays

Flat packages

Small outline packages

Chip-scale packages

Ball grid array

Ball grid array (BGA) uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.

Transistor, diode, small-pin-count IC packages

MELF Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device that is metallized at its ends. MELF devices are usually diodes and resistors A resistor is a passive two-terminal electrical compo ...

: Metal electrode leadless face (usually for resistors and diodes) * SOD: Small-outline diode. * SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323). * TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. **

TO-3 In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits. ''TO'' stands for "Transistor Outline" and relate ...

: Panel-mount with leads **

TO-5 In electronics, TO-5 is a designation for a standardized metal semiconductor package used for transistors and some integrated circuits. The ''TO'' element stands for "transistor outline" and refers to a series of technical drawings produced by J ...

: Metal can package with radial leads **

TO-18 In electronics, TO-18 is a designation for a style of transistor metal case. The case is more expensive than the similarly sized plastic TO-92 package. The name is from JEDEC, signifying ''Transistor Outline Package, Case Style 18''. Constructi ...

: Metal can package with radial leads ** TO-39 **

TO-46 In electronics, TO-18 is a designation for a style of transistor metal case. The case is more expensive than the similarly sized plastic TO-92 package. The name is from JEDEC, signifying ''Transistor Outline Package, Case Style 18''. Constructi ...

TO-66 TO-66 is a type of semiconductor package for devices with three connections, such as transistors. The shape is similar to the TO-3 package, but the size is smaller. The TO-66 package is made entirely of metal and is commonly used by silicon ...

: Similar shape to the TO-3 but smaller ** TO-92: Plastic-encapsulated package with three leads ** TO-99: Metal can package with eight radial leads ** TO-100 **

TO-126 TO-126 is a type of semiconductor package for devices with three pins, such as transistors. The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink. On one side of the package typically a metal sh ...

: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink **

TO-220 The TO-220 is a style of electronic package used for high-powered, through-hole components with pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven ...

: Through-hole plastic package with a (usually) metal heat sink tab and three leads ** TO-226 ** TO-247: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink ** TO-251: Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting ** TO-252: (also called SOT428, DPAK): SMT package similar to the DPAK but smaller ** TO-262: Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting **

TO-263 The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style ...

: Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole ** TO-274: Also called Super-247: SMT package similar to the TO-247 without the mounting hole

Dimension reference

Surface-mount

; C: Clearance between IC body and PCB ; H: Total height ; T: Lead thickness ; L: Total carrier length ; L_W: Lead width ; L_L: Lead length ; P: Pitch

Through-hole

; C: Clearance between IC body and board ; H: Total height ; T: Lead thickness ; L: Total carrier length ; L_W: Lead width ; L_L: Lead length ; P: Pitch ; W_B: IC body width ; W_L: Lead-to-lead width

Package dimensions

All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil). ; C: Clearance between package body and PCB. ; H: Height of package from pin tip to top of package. ; T: Thickness of pin. ; L: Length of package body only. ; L_W: Pin width. ; L_L: Pin length from package to pin tip. ; P: Pin pitch (distance between conductors to the PCB). ; W_B: Width of the package body only. ; W_L: Length from pin tip to pin tip on the opposite side.

Dual row

Quad rows

LGA

Multi-chip packages

A variety of techniques for interconnecting several chips within a single package have been proposed and researched: * SiP (

system in package A system in a package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, ...

) * PoP ( package on package) * 3D-SICs, Monolithic 3D ICs, and other

three-dimensional integrated circuit A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or ...

s *

Multi-chip module A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are in ...

* WSI ( wafer-scale integration) * Proximity communication

By terminal count

Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is

). The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of , but the imperial 01005 name is already being used for the package. These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective.

Two-terminal packages

Rectangular passive components

Mostly

resistor A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used to reduce current flow, adjust signal levels, to divide voltages, bias active e ...

s and

capacitor A capacitor is a device that stores electrical energy in an electric field by virtue of accumulating electric charges on two close surfaces insulated from each other. It is a passive electronic component with two terminals. The effect of ...

Tantalum capacitors

Aluminum capacitors

Small-outline diode (SOD)

Metal electrode leadless face (MELF)

Mostly

s and

diode A diode is a two-terminal electronic component that conducts current primarily in one direction (asymmetric conductance); it has low (ideally zero) resistance in one direction, and high (ideally infinite) resistance in the other. A diod ...

s; barrel shaped components, dimensions do not match those of rectangular references for identical codes.

DO-214

Commonly used for rectifier, Schottky, and other diodes.

Three- and four-terminal packages

Small-outline transistor (SOT)

Other

*DPAK (TO-252, SOT-428): Discrete Packaging. Developed by

Motorola Motorola, Inc. () was an American multinational telecommunications company based in Schaumburg, Illinois, United States. After having lost $4.3 billion from 2007 to 2009, the company split into two independent public companies, Motorola ...

to house higher powered devices. Comes in three or five-terminal versions. * D2PAK (TO-263, SOT-404): Bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions. *D3PAK (TO-268): Even larger than D2PAK.

Five- and six-terminal packages

Small-outline transistor (SOT)

Packages with more than six terminals

Dual-in-line

* Flatpack was one of the earliest surface-mounted packages. *

Small-outline integrated circuit A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generall ...

(SOIC): dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm. * Small-outline package, J-leaded (SOJ): The same as SOIC except J-leaded. *

Thin small-outline package Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and ...

(TSOP): thinner than SOIC with smaller pin spacing of 0.5 mm. *

Shrink small-outline package A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generall ...

(SSOP): pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm. * Thin shrink small-outline package (TSSOP). * Quarter-size small-outline package (QSOP): with pin spacing of 0.635 mm. * Very small outline package (VSOP): even smaller than QSOP; 0.4-, 0.5-, or 0.65-mm pin spacing. * Dual flat no-lead (DFN): smaller footprint than leaded equivalent.

Quad-in-line

Quad-in-line: * Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm *Quad flat package ( QFP): various sizes, with pins on all four sides *Low-profile quad flat-package ( LQFP): 1.4 mm high, varying sized and pins on all four sides *Plastic quad flat-pack ( PQFP), a square with pins on all four sides, 44 or more pins *Ceramic quad flat-pack ( CQFP): similar to PQFP *Metric quad flat-pack ( MQFP): a QFP package with metric pin distribution *Thin quad flat-pack (

TQFP A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 ...

), a thinner version of LQFP *Quad flat no-lead ( QFN): smaller footprint than leaded equivalent * Leadless chip carrier (LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration. *Micro leadframe package ( MLP, MLF): with a 0.5 mm contact pitch, no leads (same as QFN) *Power quad flat no-lead ( PQFN): with exposed die-pads for heatsinking

Grid arrays

Ball grid array A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be pu ...

(BGA): A square or rectangular array of solder balls on one surface, ball spacing typically ** Fine-pitch ball grid array ( FBGA): A square or rectangular array of solder balls on one surface ** Low-profile fine-pitch ball grid array ( LFBGA): A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm ** Micro ball grid array ( μBGA): Ball spacing less than 1 mm ** Thin fine-pitch ball grid array ( TFBGA): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm *

Land grid array The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a ...

(LGA): An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder. * Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. ** Ceramic column grid array (CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic. * Lead-less package (LLP): A package with metric pin distribution (0.5 mm pitch).

Non-packaged devices

Although surface-mount, these devices require specific process for assembly. * Chip-on-board (COB), a bare

silicon Silicon is a chemical element with the symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic luster, and is a tetravalent metalloid and semiconductor. It is a member of group 14 in the periodic ...

chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with

epoxy Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also co ...

) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top". *Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a

flex circuit Flexible electronics, also known as ''flex circuits'', is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film. Additi ...

. Tape-automated bonding process is also a chip-on-flex process as well. *Chip-on-glass (COG), a variation of COB, where a chip, typically a

liquid crystal display A liquid-crystal display (LCD) is a flat-panel display or other electronically modulated optical device that uses the light-modulating properties of liquid crystals combined with polarizers. Liquid crystals do not emit light directly but ...

(LCD) controller, is mounted directly on glass. *Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic textiles. There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.

References

External links

JEDEC JEP95
official list of all (over 500) standard electronic packages
Fairchild Index of Package Information

* ttps://web.archive.org/web/20120418031551/http://www.intersil.com/design/packages/ Intersil packaging information
ICpackage.org

Solder Pad Layout Dimensions

International Microelectronics And Packaging Society
{{DEFAULTSORT:Integrated circuit packaging types Semiconductor packages Electronics lists

Through-hole packages

Surface mount

Chip carrier

Pin grid arrays

Flat packages

Small outline packages

Chip-scale packages

Ball grid array

Transistor, diode, small-pin-count IC packages

Dimension reference

Surface-mount

Through-hole

Package dimensions

Dual row

Quad rows

LGA

Multi-chip packages

By terminal count

Two-terminal packages

Rectangular passive components

Tantalum capacitors

Aluminum capacitors

Small-outline diode (SOD)

Metal electrode leadless face (MELF)

DO-214

Three- and four-terminal packages

Small-outline transistor (SOT)

Other

Five- and six-terminal packages

Small-outline transistor (SOT)

Packages with more than six terminals

Dual-in-line

Quad-in-line

Grid arrays

Non-packaged devices

See also

References

External links