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{{Unreferenced, date=June 2020 Chassis Air Guide or CAG in abbreviation, is
Intel Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 seri ...
's
thermal system A thermodynamic system is a body of matter and/or radiation, confined in space by walls, with defined permeabilities, which separate it from its surroundings. The surroundings may include other thermodynamic systems, or physical systems that are ...
to PC chassis. The system includes an
air duct Ducts are conduits or passages used in heating, ventilation, and air conditioning (HVAC) to deliver and remove air. The needed airflows include, for example, ''supply air'', ''return air'', and ''exhaust air''. Ducts commonly also deliver '' ...
for CPU, because in an environment of increasing
thermal load A thermal column (or thermal) is a rising mass of buoyant air, a convective current in the atmosphere, that transfers heat energy vertically. Thermals are created by the uneven heating of Earth's surface from solar radiation, and are an example ...
s, the
processor Processor may refer to: Computing Hardware * Processor (computing) **Central processing unit (CPU), the hardware within a computer that executes a program *** Microprocessor, a central processing unit contained on a single integrated circuit (I ...
is generally the most demanding component in terms of system thermal design. It also describes optimal locations for
intake An intake (also inlet) is an opening, structure or system through which a fluid is admitted to a space or machine as a consequence of a pressure differential between the outside and the inside. The pressure difference may be generated on the ins ...
and
exhaust Exhaust, exhaustive, or exhaustion may refer to: Law *Exhaustion of intellectual property rights, limits to intellectual property rights in patent and copyright law **Exhaustion doctrine, in patent law ** Exhaustion doctrine under U.S. law, in p ...
fans Fan commonly refers to: * Fan (machine), a machine for producing airflow, often used for cooling ** Hand fan, an implement held and waved by hand to move air for cooling * Fan (person), short for fanatic; an enthusiast or supporter, especially wit ...
. Lower chassis temperature brings lower processor die temperature, while most computer enclosures typically provide an internal thermal environment of approximately 40-45
°C The degree Celsius is the unit of temperature on the Celsius scale (originally known as the centigrade scale outside Sweden), one of two temperature scales used in the International System of Units (SI), the other being the Kelvin scale. The ...
at a 35
°C The degree Celsius is the unit of temperature on the Celsius scale (originally known as the centigrade scale outside Sweden), one of two temperature scales used in the International System of Units (SI), the other being the Kelvin scale. The ...
room In a building or large vehicle, like a ship, a room is any enclosed space within a number of walls to which entry is possible only via a door or other dividing structure that connects it to either a passage (architecture), passageway, another roo ...
,
Intel Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California. It is the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 seri ...
claims. CAG provides a system to lower processor's thermal environment. The initial revision known as CAG 1.0 was released in May 2002. The recent version known as CAG 1.1 was then released in September 2003.


See also

*
Thermally Advantaged Chassis A Thermally Advantaged Chassis (TAC) is a computer enclosure that complies with the Thermally Advantaged Chassis specifications created by Intel. It is capable of maintaining an internal ambient temperature below 38 degrees Celsius when functioning ...


External links


Chassis Air Guide Design Guide, Version 1.0, May 2002Chassis Air Guide Design Guide, Version 1.1, September 2003Chassis Air Guide Design Guide, Version 2.0, February 2008
Computer hardware cooling Computer enclosure