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Thick-film
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. Main manufacturing technique is screen printing ( stenciling), which in addition to use in manufacturing electronic devices can also be used for various graphic reproduction targets. It became one of the key manufacturing/miniaturisation techniques of electronic devices/modules during 1950s. Typical film thickness – manufactured with thick film manufacturing processes for electronic devices – is 0.0001 to 0.1 mm. Thick-film circuits/modules are widely used in the automotive industry, both in sensors, e.g. mixture of fuel/air, pressure sensors, engine and gearbox controls, sensor for releasing airbags, ignitors to airbags; common is that high reliability is required, often extended temperature range also along massive thermocycling of circuits without failure. Other application areas ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photoimageable Thick-film Technology
Photoimageable thick-film technology is a combination of conventional thick film technology with elements of thin film technology, and it provides a low cost solution to producing high quality microwave circuits. The ability to directly photoimage the printed layers means that the technology can provide the high line and gap resolution required by high frequency planar components. It provides a feasible fabrication process to produce circuits operating at microwave and millimetre-wave frequencies. Circuits made using this technology meet the modern requirements for high density packaging, whilst yielding the high quality components required for very high frequency applications, including wireless communication, radar and measurement systems. This technology also enables both single-layer and multi-layer filters to be produced conveniently. Recent research work has investigated the combination of conventional thick film and fine line photoimageable technologies, in order to accom ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Resistor
A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used to reduce current flow, adjust signal levels, to divide voltages, bias active elements, and terminate transmission lines, among other uses. High-power resistors that can dissipate many watts of electrical power as heat may be used as part of motor controls, in power distribution systems, or as test loads for generators. Fixed resistors have resistances that only change slightly with temperature, time or operating voltage. Variable resistors can be used to adjust circuit elements (such as a volume control or a lamp dimmer), or as sensing devices for heat, light, humidity, force, or chemical activity. Resistors are common elements of electrical networks and electronic circuits and are ubiquitous in electronic equipment. Practical resistors as discrete components can be composed of various compounds and forms. Resis ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Laser Trimming
{{Unreferenced, date=June 2015 Laser trimming is the manufacturing process of using a laser to adjust the operating parameters of an electronic circuit. One of the most common applications uses a laser to burn away small portions of resistors, raising their resistance value. The burning operation can be conducted while the circuit is being tested by automatic test equipment, leading to optimum final values for the resistor(s) in the circuit. The resistance value of a film resistor is defined by its geometric dimensions (length, width, height) and the resistor material. A lateral cut in the resistor material by the laser narrows or lengthens the current flow path and increases the resistance value. The same effect is obtained whether the laser changes a thick-film or a thin-film resistor on a ceramic substrate or an SMD-resistor on a SMD circuit. The SMD-resistor is produced with the same technology and may be laser trimmed as well. Trimmable chip capacitors are built up as m ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heating Element
A heating element converts electrical energy into heat through the process of Joule heating. Electric current through the element encounters resistance, resulting in heating of the element. Unlike the Peltier effect, this process is independent of the direction of current. Heating elements types Metal Resistance wire: Metallic resistance heating elements may be wire or ribbon, straight or coiled. They are used in common heating devices like toasters and hair dryers, furnaces for industrial heating, floor heating, roof heating, pathway heating to melt snow, dryers, etc. The most common classes of materials used include: * Nichrome: Most resistance wire heating elements usually use nichrome 80/20 (80% Nickel, 20% Chromium) wire, ribbon, or strip. Nichrome 80/20 is an ideal material, because it has relatively high resistance and forms an adherent layer of chromium oxide when it is heated for the first time. Material beneath this layer will not oxidize, preventing the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Passive Devices
Integrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate. Sometimes integrated passives can also be called as embedded passives, and still the difference between integrated and embedded passives is technically unclear. In both cases passives are realized in between dielectric layers or on the same substrate. The earliest form of IPDs are resistor, capacitor, resistor-capacitor (RC) or resistor-capacitor-coil/inductor (RCL) networks. Passive transformers can also be realised as integrated passive devices like by putting two coils on top of each other separated by a thin dielectric layer. Sometimes diodes (PN, PIN, zener etc.) can be integrated on the same substrate with integrated passives ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Passive Devices
Integrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate. Sometimes integrated passives can also be called as embedded passives, and still the difference between integrated and embedded passives is technically unclear. In both cases passives are realized in between dielectric layers or on the same substrate. The earliest form of IPDs are resistor, capacitor, resistor-capacitor (RC) or resistor-capacitor-coil/inductor (RCL) networks. Passive transformers can also be realised as integrated passive devices like by putting two coils on top of each other separated by a thin dielectric layer. Sometimes diodes (PN, PIN, zener etc.) can be integrated on the same substrate with integrated passives ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface Mount Devices
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Squeegee
A squeegee or squilgee is a tool with a flat, smooth rubber blade, used to remove or control the flow of liquid on a flat surface. It is used for cleaning and in printing. The earliest written references to squeegees date from the mid-19th century and concern deck-cleaning tools, some with leather rather than rubber blades. The name "squeegee" may come from the word "squeege", meaning press or squeeze, which was first recorded in 1783. The closely related "squeedging" was reportedly first used in 1782, in the Covent Garden Theatre, during the performing of the comedy '' Which is the Man?'' by Hannah Cowley. Window cleaning The best-known of these tools is probably the hand-held window squeegee, used to remove the cleaning fluid or water from a glass surface. A soapy solution acts as a lubricant and breaks up the dirt, then the squeegee is used to draw the now water-borne dirt off the glass leaving a clean surface. Some squeegees are backed with a sponge which can soak up soa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Curing (chemistry)
Curing is a chemical process employed in polymer chemistry and process engineering that produces the toughening or hardening of a polymer material by cross-linking of polymer chains. Even if it is strongly associated with the production of thermosetting polymers, the term "curing" can be used for all the processes where a solid product is obtained from a liquid solution, such as with PVC plastisols. Curing process During the curing process, single monomers and oligomers, mixed with or without a curing agent, react to form a tridimensional polymeric network. In the very first part of the reaction Branching (polymer chemistry), branches of molecules with various architectures are formed, and their molecular weight increases in time with the extent of the reaction until the network size is equal to the size of the system. The system has lost its solubility and its viscosity tends to infinite. The remaining molecules start to coexist with the macroscopic network until they react wit ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ultraviolet
Ultraviolet (UV) is a form of electromagnetic radiation with wavelength from 10 nm (with a corresponding frequency around 30 PHz) to 400 nm (750 THz), shorter than that of visible light, but longer than X-rays. UV radiation is present in sunlight, and constitutes about 10% of the total electromagnetic radiation output from the Sun. It is also produced by electric arcs and specialized lights, such as mercury-vapor lamps, tanning lamps, and black lights. Although long-wavelength ultraviolet is not considered an ionizing radiation because its photons lack the energy to ionize atoms, it can cause chemical reactions and causes many substances to glow or fluoresce. Consequently, the chemical and biological effects of UV are greater than simple heating effects, and many practical applications of UV radiation derive from its interactions with organic molecules. Short-wave ultraviolet light damages DNA and sterilizes surfaces with which it comes into contact. F ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wire Bonding
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer Dicing
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a ''dicing saw'') or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips are encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc. During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Dicing saws may use a dicing blade with diamond particles, rotating at 30,000 RPM and cooled with deionized water. Once ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
