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Thermal Interface Material
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink). At each interface, a thermal boundary resistance exists to impede heat dissipation. In addition, the electronic performance and device lifetime can degrade dramatically under continuous overheating and large thermal stress at the interfaces. Therefore, for the last several decades, there have been intensive efforts in developing various TIMs with the aim of minimizing the thermal boundary resistance between layers and enhancing thermal management performance, as well as tackling application requirements such as low thermal stress between materials of different thermal expansion coefficients, low elastic modulus or viscosity, flexibility, and reusability: *T ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Paste
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a mechanical fixation mechanism such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste. Composition Thermal paste consists of a polymerizable liquid matrix and large volu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Pastes
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a mechanical fixation mechanism such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste. Composition Thermal paste consists of a polymerizable liquid matrix and large volu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Exchangers
A heat exchanger is a system used to transfer heat between a source and a working fluid. Heat exchangers are used in both cooling and heating processes. The fluids may be separated by a solid wall to prevent mixing or they may be in direct contact. They are widely used in space heating, refrigeration, air conditioning, power stations, chemical plants, petrochemical plants, petroleum refineries, natural-gas processing, and sewage treatment. The classic example of a heat exchanger is found in an internal combustion engine in which a circulating fluid known as engine coolant flows through radiator coils and air flows past the coils, which cools the coolant and heats the incoming air. Another example is the heat sink, which is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant. Flow arrangement Image:Heat_exc_1-1.svg, Fig. 1: Shell and tube heat exchanger, single pass (1–1 parallel f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer Hardware Cooling
A computer is a machine that can be programmed to carry out sequences of arithmetic or logical operations (computation) automatically. Modern digital electronic computers can perform generic sets of operations known as programs. These programs enable computers to perform a wide range of tasks. A computer system is a nominally complete computer that includes the hardware, operating system (main software), and peripheral equipment needed and used for full operation. This term may also refer to a group of computers that are linked and function together, such as a computer network or computer cluster. A broad range of industrial and consumer products use computers as control systems. Simple special-purpose devices like microwave ovens and remote controls are included, as are factory devices like industrial robots and computer-aided design, as well as general-purpose devices like personal computers and mobile devices like smartphones. Computers power the Internet, which links bi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Spreader
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat transfer with expenditure of energy as work supplied by an external source. A heat pipe uses fluids inside a sealed case. The fluids circulate either passively, by spontaneous convection, triggered when a threshold temperature difference occurs; or actively, because of an impeller driven by an external source of work. Without sealed circulation, energy can be carried by transfer of fluid matter, for example externally supplied colder air, driven by an external source of work, from a hotter body to another external body, though this is not exactly heat transfer as defined in physics. Exemplifying increase of entropy according to the second ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Conductivity
The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by k, \lambda, or \kappa. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity and are very efficient at conducting heat, while the opposite is true for insulating materials like Rockwool or Styrofoam. Correspondingly, materials of high thermal conductivity are widely used in heat sink applications, and materials of low thermal conductivity are used as thermal insulation. The reciprocal of thermal conductivity is called thermal resistivity. The defining equation for thermal conductivity is \mathbf = - k \nabla T, where \mathbf is the heat flux, k is the thermal conductivity, and \nabla T is the temperature gradient. This is known as Fourier's Law for heat conduction. Although commonly expressed as a scalar, the most general form of th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Phase-change Materials
A phase change material (PCM) is a substance which releases/absorbs sufficient energy at phase transition to provide useful heat or cooling. Generally the transition will be from one of the first two fundamental states of matter - solid and liquid - to the other. The phase transition may also be between non-classical states of matter, such as the conformity of crystals, where the material goes from conforming to one crystalline structure to conforming to another, which may be a higher or lower energy state. The energy released/absorbed by phase transition from solid to liquid, or vice versa, the heat of fusion is generally much higher than the sensible heat. Ice, for example, requires 333.55 J/g to melt, but then water will rise one degree further with the addition of just 4.18 J/g. Water/ice is therefore a very useful phase change material and has been used to store winter cold to cool buildings in summer since at least the time of the Achaemenid Empire. By melting and soli ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Resistance
Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. * (Absolute) thermal resistance ''R'' in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. * Specific thermal resistance or thermal resistivity ''Rλ'' in kelvin–metres per watt (K⋅m/W), is a material constant. * Thermal insulance has the units square metre kelvin per watt (m2⋅K/W) in SI units or square foot degree Fahrenheit– hours per British thermal unit (ft2⋅°F⋅h/Btu) in imperial units. It is the thermal resistance of unit area of a material. In terms of insulation, it is measured by the R-value. Absolute thermal resistance Absolute thermal resistance is the temperature difference across a structure when a unit of heat energy flows through it in unit time. It is the reciprocal of thermal conductance. Th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Tape
A thermal column (or thermal) is a rising mass of buoyant air, a convective current in the atmosphere, that transfers heat energy vertically. Thermals are created by the uneven heating of Earth's surface from solar radiation, and are an example of convection, specifically atmospheric convection. Thermals on Earth The Sun warms the ground, which in turn warms the air directly above. The warm air near the surface expands, becoming less dense than the surrounding air. The lighter air rises and cools due to its expansion in the lower pressure at higher altitudes. It stops rising when it has cooled to the same temperature, thus density, as the surrounding air. Associated with a thermal is a downward flow surrounding the thermal column. The downward-moving exterior is caused by colder air being displaced at the top of the thermal. The size and strength of thermals are influenced by the properties of the lower atmosphere (the ''troposphere''). When the air is cold, bubbles of warm ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicone
A silicone or polysiloxane is a polymer made up of siloxane (−R2Si−O−SiR2−, where R = organic group). They are typically colorless oils or rubber-like substances. Silicones are used in sealants, adhesives, lubricants, medicine, cooking utensils, thermal insulation, and electrical insulation. Some common forms include silicone oil, silicone grease, silicone rubber, silicone resin, and silicone caulk. Chemistry More precisely called polymerized siloxanes or polysiloxanes, silicones consist of an inorganic silicon–oxygen backbone chain (⋯−Si−O−Si−O−Si−O−⋯) with two organic groups attached to each silicon center. Commonly, the organic groups are methyl. The materials can be cyclic or polymeric. By varying the −Si−O− chain lengths, side groups, and crosslinking, silicones can be synthesized with a wide variety of properties and compositions. They can vary in consistency from liquid to gel to rubber to hard plastic. The most common siloxan ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
