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Photoresists
A photoresist (also known simply as a resist) is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface. This process is crucial in the electronic industry. The process begins by coating a substrate with a light-sensitive organic material. A patterned mask is then applied to the surface to block light, so that only unmasked regions of the material will be exposed to light. A solvent, called a developer, is then applied to the surface. In the case of a positive photoresist, the photo-sensitive material is degraded by light and the developer will dissolve away the regions that were exposed to light, leaving behind a coating where the mask was placed. In the case of a negative photoresist, the photosensitive material is strengthened (either polymerized or cross-linked) by light, and the developer will dissolve away only the regions that were not exposed to light, leaving behind a coating in areas w ...
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Photoresist Of Photolithography
A photoresist (also known simply as a resist) is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface. This process is crucial in the electronic industry. The process begins by coating a substrate with a light-sensitive organic material. A patterned mask is then applied to the surface to block light, so that only unmasked regions of the material will be exposed to light. A solvent, called a developer, is then applied to the surface. In the case of a positive photoresist, the photo-sensitive material is degraded by light and the developer will dissolve away the regions that were exposed to light, leaving behind a coating where the mask was placed. In the case of a negative photoresist, the photosensitive material is strengthened (either polymerized or cross-linked) by light, and the developer will dissolve away only the regions that were not exposed to light, leaving behind a coating in areas w ...
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Tetramethylammonium Hydroxide
Tetramethylammonium hydroxide (TMAH or TMAOH) is a quaternary ammonium salt with molecular formula N(CH3)4+ OH−. It is commonly encountered in form of concentrated solutions in water or methanol. TMAH in solid state and its aqueous solutions are all colorless, but may be yellowish if impure. Although TMAH has virtually no odor when pure, samples often have a strong fishy smell due to presence of trimethylamine which is a common impurity. TMAH has several diverse industrial and research applications. Chemical properties Structure TMAH is most commonly encountered as an aqueous solution, in concentrations from ~2–25%, and less frequently as solutions in methanol. These solutions are identified by CAS numbe75-59-2 Several hydrates such as N(CH3)4OH·xH2O. have been crystallized. These salts contain well separated Me4N+ cations and hydroxide anions ( Me is an abbreviation of methyl group). The hydroxide groups are linked by hydrogen bonds to the water of crystallization ...
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Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical (photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultraviolet, extreme ultraviolet, or X-ray. The wavelength of light used determines the minimum feature si ...
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Photoengraving
Photoengraving is a process that uses a light-sensitive photoresist applied to the surface to be engraved to create a mask that protects some areas during a subsequent operation which etches, dissolves, or otherwise removes some or all of the material from the unshielded areas of a substrate. Normally applied to metal, it can also be used on glass, plastic and other materials. A photoresist is selected which is resistant to the particular acid or other etching compound to be used. It may be a liquid applied by brushing, spraying, pouring or other means and then allowed to set, or it may come in sheet form and be applied by laminating. It is then exposed to light—usually strong ultraviolet (UV) light—through a photographic, mechanically printed, or manually created image or pattern on transparent film. Alternatively, a lens may be used to project an image directly onto it. Typically, the photoresist is hardened where it receives sufficient exposure to light, but some photoresis ...
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SU-8 For Negative Photoresist
SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. As shown in the structural diagram, SU-8 derives its name from the presence of 8 epoxy groups. This is a statistical average per moiety. It is these epoxies that cross-link to give the final structure. It can be made into a viscous polymer that can be spun or spread over a thickness ranging from below 1 micrometer up to above 300 micrometers, or Thick Film Dry Sheets (TFDS) for lamination up to above 1 millimetre thick. Up to 500 µm the resist can be processed with standard contact lithography. Above 500 µm absorption leads to increasing sidewall undercuts and poor curing at the substrate interface. It can be used to pattern high aspect ratio structures. An aspect ratio of (> 20) has been achieved with the solution formulation a ...
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SU-8
SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. As shown in the structural diagram, SU-8 derives its name from the presence of 8 epoxy groups. This is a statistical average per moiety. It is these epoxies that cross-link to give the final structure. It can be made into a viscous polymer that can be spun or spread over a thickness ranging from below 1 micrometer up to above 300 micrometers, or Thick Film Dry Sheets (TFDS) for lamination up to above 1 millimetre thick. Up to 500 µm the resist can be processed with standard contact lithography. Above 500 µm absorption leads to increasing sidewall undercuts and poor curing at the substrate interface. It can be used to pattern high aspect ratio structures. An aspect ratio of (> 20) has been achieved with the solution formulation a ...
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Diazonaphthoquinone
Diazonaphthoquinone (DNQ) is a diazo derivative of naphthoquinone. Upon exposure to light, DNQ converts to a derivative that is susceptible to etching. In this way, DNQ has become an important reagent in photoresist technology in the semiconductor industry. Diazonaphthoquinone sulfonic acid esters are components of common photoresist materials. Such photoresists are used in the manufacture of semiconductors. In this application DNQs are mixed with Novolac resin, a type of phenolic polymer. The DNQ functions as a dissolution inhibitor. During the masking/patterning process, portions of the photoresist film are exposed to light while others remain unexposed. In the unexposed regions of the resist film, the DNQ acts as a dissolution inhibitor and the resist remains insoluble in the aqueous base developer. In the exposed regions, the DNQ forms a ketene, which, in turn, reacts with ambient water to form a base soluble indene carboxylic acid. The exposed regions of the photoresist f ...
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SU-8 Photoresist
SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. As shown in the structural diagram, SU-8 derives its name from the presence of 8 epoxy groups. This is a statistical average per moiety. It is these epoxies that cross-link to give the final structure. It can be made into a viscous polymer that can be spun or spread over a thickness ranging from below 1 micrometer up to above 300 micrometers, or Thick Film Dry Sheets (TFDS) for lamination up to above 1 millimetre thick. Up to 500 µm the resist can be processed with standard contact lithography. Above 500 µm absorption leads to increasing sidewall undercuts and poor curing at the substrate interface. It can be used to pattern high aspect ratio structures. An aspect ratio of (> 20) has been achieved with the solution formulation a ...
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Sensitometry
Sensitometry is the scientific study of light-sensitive materials, especially photographic film. The study has its origins in the work by Ferdinand Hurter and Vero Charles Driffield (circa 1876) with early black-and-white emulsions. They determined how the density of silver produced varied with the amount of light received, and the method and time of development. Details Plots of film density (log of opacity) versus the log of exposure are called characteristic curves, Hurter–Driffield curves, H–D curves, HD curves, H & D curves, D–logE curves, or D–logH curves. At moderate exposures, the overall shape is typically a bit like an "S" slanted so that its base and top are horizontal. There is usually a central region of the HD curve which approximates to a straight line, called the "linear" or "straight-line" portion; the slope of this region is called the gamma. The low end is called the "toe", and at the top, the curve rounds over to form the "shoulder". At extremely hi ...
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Valence Band
In solid-state physics, the valence band and conduction band are the bands closest to the Fermi level, and thus determine the electrical conductivity of the solid. In nonmetals, the valence band is the highest range of electron energies in which electrons are normally present at absolute zero temperature, while the conduction band is the lowest range of vacant electronic states. On a graph of the electronic band structure of a material, the valence band is located below the Fermi level, while the conduction band is located above it. The distinction between the valence and conduction bands is meaningless in metals, because conduction occurs in one or more partially filled bands that take on the properties of both the valence and conduction bands. Band gap In semiconductors and insulators the two bands are separated by a band gap, while in semimetals the bands overlap. A band gap is an energy range in a solid where no electron states can exist due to the quantization of ...
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Novolac
Novolaks (sometimes: novolacs) are low molecular weight polymers derived from phenols and formaldehyde. They are related to Bakelite, which is more highly crosslinked. The term comes from Swedish "lack" for lacquer and Latin "novo" for new, since these materials were envisioned to replace natural lacquers such as copal, copal resin. Typically novolaks are prepared by the condensation of phenol or a mixture of p- and m-cresol with formaldehyde (as formalin). The reaction is acid catalyzed. Oxalic acid is often used because it can be subsequently removed by thermal decomposition. Novolaks have a degree of polymerization of approximately 20-40. The branching density, determined by the processing conditions, m- vs p-cresol ratio, as well as CH2O/cresol ratio is typically around 15%. Novolaks are especially important in microelectronics where they are used as photoresist materials. They are also used as tackifiers in rubber. See also * Epoxy References

{{reflist Phenol form ...
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KTH Royal Institute Of Technology
The KTH Royal Institute of Technology ( sv, Kungliga Tekniska högskolan, lit=Royal Institute of Technology), abbreviated KTH, is a public research university in Stockholm, Sweden. KTH conducts research and education in engineering and technology and is Sweden's largest technical university. Currently, KTH consists of five schools with four campuses in and around Stockholm. KTH was established in 1827 as the ''Teknologiska institutet (Institute of Technology)'' and had its roots in the ''Mekaniska skolan (School of Mechanics)'' that was established in 1798 in Stockholm. But the origin of KTH dates back to the predecessor of the ''Mekaniska skolan'', the ''Laboratorium mechanicum'', which was established in 1697 by the Swedish scientist and innovator Christopher Polhem. The Laboratorium mechanicum combined education technology, a laboratory, and an exhibition space for innovations. In 1877 KTH received its current name, Kungliga Tekniska högskolan (KTH Royal Institute of Technol ...
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