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Nanolithography
Nanolithography (NL) is a growing field of techniques within nanotechnology dealing with the engineering (patterning e.g. etching, depositing, writing, printing etc) of nanometer-scale structures on various materials. The modern term reflects on a design of structures built in range of 10−9 to 10−6 meters, i.e. nanometer scale. Essentially, the field is a derivative of lithography, only covering very small structures. All NL methods can be categorized into four groups: photo lithography, scanning lithography, soft lithography and other miscellaneous techniques. History The NL has evolved from the need to increase the number of sub-micrometer features (e.g. transistors, capacitors etc.) in an integrated circuit in order to keep up with Moore's Law. While lithographic techniques have been around since the late 18th century, none were applied to nanoscale structures until the mid-1950s. With evolution of the semiconductor industry, demand for techniques capable of producing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dip-Pen Nanolithography
Dip pen nanolithography (DPN) is a scanning probe lithography technique where an atomic force microscope, atomic force microscope (AFM) tip is used to create patterns directly on a range of substances with a variety of inks. A common example of this technique is exemplified by the use of Thiol, alkane thiolates to imprint onto a gold surface. This technique allows surface patterning on scales of under 100 Nano-, nanometers. DPN is the nanotechnology analog of the dip pen (also called the quill pen), where the tip of an atomic force microscope cantilever acts as a "pen," which is coated with a chemical compound or mixture acting as an "ink," and put in contact with a substrate, the "paper." DPN enables direct deposition of nanoscale materials onto a substrate in a flexible manner. Recent advances have demonstrated massively parallel patterning using two-dimensional arrays of 55,000 tips. Applications of this technology currently range through chemistry, materials science, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Scanning Probe Lithography
Scanning probe lithography (SPL) describes a set of nanolithographic methods to pattern material on the nanoscale using scanning probes. It is a direct-write, mask-less approach which bypasses the diffraction limit and can reach resolutions below 10 nm. It is considered an alternative lithographic technology often used in academic and research environments. The term ''scanning probe lithography'' was coined after the first patterning experiments with scanning probe microscopes (SPM) in the late 1980s. Classification The different approaches towards SPL can be classified by their goal to either add or remove material, by the general nature of the process either chemical or physical, or according to the driving mechanisms of the probe-surface interaction used in the patterning process: mechanical, thermal, diffusive and electrical. Overview Mechanical/thermo-mechanical Mechanical scanning probe lithography (m-SPL) is a nanomachining or ''nano-scratching'' top-down a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Scanning Probe Lithography
Thermal scanning probe lithography (t-SPL) is a form of scanning probe lithography (SPL) whereby material is structured on the nanoscale using scanning probes, primarily through the application of thermal energy. Related fields are ''thermo-mechanical'' ''SPL'' (see also Millipede memory), ''thermochemical'' ''SPL'' (or thermochemical nanolithography) where the goal is to influence the local chemistry, and ''thermal'' dip-pen lithography as an additive technique. History Scientists around Daniel Rugar and John Mamin at the IBM research laboratories in Almaden have been the pioneers in using heated AFM (atomic force microscope) probes for the modification of surfaces. In 1992, they used microsecond laser pulses to heat AFM tips to write indents as small as 150 nm into the polymer PMMA at rates of 100 kHz. In the following years, they developed cantilevers with resonance frequencies above 4 MHz and integrated resistive heaters and piezoresistive sensors for ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Maskless Lithography
Maskless lithography (MPL) is a photomask-less photolithography-like technology used to project or focal-spot write the image pattern onto a chemical resist-coated substrate (e.g. wafer) by means of UV radiation or electron beam. In microlithography, typically UV radiation casts an image of a time constant mask onto a photosensitive emulsion (or photoresist). Traditionally, mask aligners, steppers, scanners, and other kinds of non-optical techniques are used for high speed microfabrication of microstructures, but in case of MPL, some of these become redundant. Maskless lithography has two approaches to project a pattern: rasterized and vectorized. In the first one it utilizes generation of a time-variant intermittent image on an electronically modifiable (virtual) mask that is projected with known means (also known as Laser Direct Imaging and other synonyms). In the vectored approach, direct writing is achieved by radiation that is focused to a narrow beam that is scanned in vec ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Extreme Ultraviolet Lithography
Extreme ultraviolet lithography (also known as EUV or EUVL) is an optical lithography technology used in steppers, machines that make integrated circuits (ICs) for computers and other electronic devices. It uses a range of extreme ultraviolet (EUV) wavelengths, roughly spanning a 2% FWHM bandwidth about 13.5 nm, to produce a pattern by exposing reflective photomask to UV light which gets reflected onto a substrate covered by photoresist. It is widely applied in semiconductor device fabrication process. As of 2022, ASML Holding is the only company who produces and sells EUV systems for chip production, targeting 5 nm and 3 nm. At the 2019 International Electron Devices Meeting (IEDM), TSMC reported use of EUV for 5 nm in contact, via, metal line, and cut layers, where the cuts can be applied to fins, gates or metal lines. At IEDM 2020, TSMC reported their 5 nm minimum metal pitch to be reduced 30% from that of 7 nm, which was 40 nm. Samsung's ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical ( photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultraviolet, extreme ultraviolet, or X-ray. The wavelength of light used determines the minimum feature ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical ( photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultraviolet, extreme ultraviolet, or X-ray. The wavelength of light used determines the minimum feature ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electron-beam Lithography
Electron-beam lithography (often abbreviated as e-beam lithography, EBL) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing). The electron beam changes the solubility of the resist, enabling selective removal of either the exposed or non-exposed regions of the resist by immersing it in a solvent (developing). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching. The primary advantage of electron-beam lithography is that it can draw custom patterns (direct-write) with Semiconductor device fabrication, sub-10 nm resolution. This form of maskless lithography has high resolution and low throughput, limiting its usage to photomask fabrication, low-volume production of semiconductor devices, and research and development. Systems Electron-beam lithography system ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Soft Lithography
In technology, soft lithography is a family of techniques for fabricating or replicating structures using "elastomeric stamps, molds, and conformable photomasks". It is called "soft" because it uses elastomeric materials, most notably PDMS. Soft lithography is generally used to construct features measured on the micrometer to nanometer scale. According to Rogers and Nuzzo (2005), development of soft lithography expanded rapidly from 1995 to 2005. Soft lithography tools are now commercially available. Types * PDMS stamp * Microcontact printing * Multilayer soft lithography Advantages Soft lithography has some unique advantages over other forms of lithography (such as photolithography and electron beam lithography). They include the following: *Lower cost than traditional photolithography in mass production *Well-suited for applications in biotechnology *Well-suited for applications in plastic electronics *Well-suited for applications involving large or nonplanar (nonf ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Next-generation Lithography
Next-generation lithography or NGL is a term used in integrated circuit manufacturing to describe the photolithography, lithography technologies in development which are intended to replace current techniques. The term applies to any lithography method which uses a shorter-wavelength light or beam type than the current state of the art, such as X-ray lithography, electron beam lithography, focused ion beam lithography, and nanoimprint lithography. The term may also be used to describe techniques which achieve finer resolution features from an existing light wavelength. Many technologies once termed "next generation" have entered commercial production, and open-air photolithography, with visible light projected through hand-drawn photomasks, has gradually progressed to deep-UV immersion lithography using optical proximity correction, inverse lithography technology, off-axis illumination, phase-shift masks, double patterning, and multiple patterning. In the late 2010s, the combinati ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Moore's Law
Moore's law is the observation that the number of transistors in a dense integrated circuit (IC) doubles about every two years. Moore's law is an observation and projection of a historical trend. Rather than a law of physics, it is an empirical relationship linked to gains from experience in production. The observation is named after Gordon Moore, the co-founder of Fairchild Semiconductor and Intel (and former CEO of the latter), who in 1965 posited a doubling every year in the number of components per integrated circuit, and projected this rate of growth would continue for at least another decade. In 1975, looking forward to the next decade, he revised the forecast to doubling every two years, a compound annual growth rate (CAGR) of 41%. While Moore did not use empirical evidence in forecasting that the historical trend would continue, his prediction held since 1975 and has since become known as a "law". Moore's prediction has been used in the semiconductor industry t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Poly(methyl Methacrylate)
Poly(methyl methacrylate) (PMMA) belongs to a group of materials called engineering plastics. It is a transparent thermoplastic. PMMA is also known as acrylic, acrylic glass, as well as by the trade names and brands Crylux, Plexiglas, Acrylite, Astariglas, Lucite, Perclax, and Perspex, among several others ( see below). This plastic is often used in sheet form as a lightweight or shatter-resistant alternative to glass. It can also be used as a casting resin, in inks and coatings, and for many other purposes. Although not a type of familiar silica-based glass, the substance, like many thermoplastics, is often technically classified as a type of glass, in that it is a non-crystalline vitreous substance—hence its occasional historic designation as ''acrylic glass''. Chemically, it is the synthetic polymer of methyl methacrylate. It was developed in 1928 in several different laboratories by many chemists, such as William Chalmers, Otto Röhm, and Walter Bauer, and first brough ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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