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GgNMOS
Grounded-gate NMOS, commonly known as ggNMOS, is an electrostatic discharge (ESD) protection device used within CMOS integrated circuits (ICs). Such devices are used to protect the inputs and outputs of an IC, which can be accessed off-chip ( wire-bonded to the pins of a package or directly to a printed circuit board) and are therefore subject to ESD when touched. An ESD event can deliver a large amount of energy to the chip, potentially destroying input/output circuitry; a ggNMOS device or other ESD protective devices provide a safe path for current to flow, instead of through more sensitive circuitry. ESD protection by means of such devices or other techniques is important to product reliability: 35% of all IC failures in the field are associated with ESD damage. Structure As the name implies, a ggNMOS device consists of a relatively wide NMOS device in which the gate, source, and body are tied together to ground. The drain of the ggNMOS is connected to the I/O pad under ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
GGNMOS CUTAWAY
Grounded-gate NMOS, commonly known as ggNMOS, is an electrostatic discharge (ESD) protection device used within CMOS integrated circuits (ICs). Such devices are used to protect the inputs and outputs of an IC, which can be accessed off-chip ( wire-bonded to the pins of a package or directly to a printed circuit board) and are therefore subject to ESD when touched. An ESD event can deliver a large amount of energy to the chip, potentially destroying input/output circuitry; a ggNMOS device or other ESD protective devices provide a safe path for current to flow, instead of through more sensitive circuitry. ESD protection by means of such devices or other techniques is important to product reliability: 35% of all IC failures in the field are associated with ESD damage. Structure As the name implies, a ggNMOS device consists of a relatively wide NMOS device in which the gate, source, and body are tied together to ground. The drain of the ggNMOS is connected to the I/O pad under ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
GGNMOS
Grounded-gate NMOS, commonly known as ggNMOS, is an electrostatic discharge (ESD) protection device used within CMOS integrated circuits (ICs). Such devices are used to protect the inputs and outputs of an IC, which can be accessed off-chip ( wire-bonded to the pins of a package or directly to a printed circuit board) and are therefore subject to ESD when touched. An ESD event can deliver a large amount of energy to the chip, potentially destroying input/output circuitry; a ggNMOS device or other ESD protective devices provide a safe path for current to flow, instead of through more sensitive circuitry. ESD protection by means of such devices or other techniques is important to product reliability: 35% of all IC failures in the field are associated with ESD damage. Structure As the name implies, a ggNMOS device consists of a relatively wide NMOS device in which the gate, source, and body are tied together to ground. The drain of the ggNMOS is connected to the I/O pad under ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
MOSFET
The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is a type of field-effect transistor (FET), most commonly fabricated by the controlled oxidation of silicon. It has an insulated gate, the voltage of which determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. A metal-insulator-semiconductor field-effect transistor (MISFET) is a term almost synonymous with MOSFET. Another synonym is IGFET for insulated-gate field-effect transistor. The basic principle of the field-effect transistor was first patented by Julius Edgar Lilienfeld in 1925.Lilienfeld, Julius Edgar (1926-10-08) "Method and apparatus for controlling electric currents" upright=1.6, Two power MOSFETs in V_in_the_''off''_state,_and_can_conduct_a_continuous_current_of_30 surface-mount_packages._Operating_as_switches,_each_of_these_components_can_su ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electrostatic Discharge
Electrostatic discharge (ESD) is a sudden and momentary flow of electric current between two electrically charged objects caused by contact, an electrical short or dielectric breakdown. A buildup of static electricity can be caused by tribocharging or by electrostatic induction. The ESD occurs when differently-charged objects are brought close together or when the dielectric between them breaks down, often creating a visible spark. ESD can create spectacular electric sparks (lightning, with the accompanying sound of thunder, is a large-scale ESD event), but also less dramatic forms which may be neither seen nor heard, yet still be large enough to cause damage to sensitive electronic devices. Electric sparks require a field strength above approximately 40 kV/cm in air, as notably occurs in lightning strikes. Other forms of ESD include corona discharge from sharp electrodes and brush discharge from blunt electrodes. ESD can cause harmful effects of importance in industry, inc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Avalanche Breakdown
Avalanche breakdown (or avalanche effect) is a phenomenon that can occur in both insulating and semiconducting materials. It is a form of electric current multiplication that can allow very large currents within materials which are otherwise good insulators. It is a type of electron avalanche. The avalanche process occurs when carriers in the transition region are accelerated by the electric field to energies sufficient to create mobile or free electron-hole pairs via collisions with bound electrons. Explanation Materials conduct electricity if they contain mobile charge carriers. There are two types of charge carriers in a semiconductor: free electrons (mobile electrons) and electron holes (mobile holes which are missing electrons from the normally occupied electron states). A normally bound electron (e.g., in a bond) in a reverse-biased diode may break loose due to a thermal fluctuation or excitation, creating a mobile electron-hole pair. If there is a voltage gradient (el ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electrical Conductivity
Electrical resistivity (also called specific electrical resistance or volume resistivity) is a fundamental property of a material that measures how strongly it resists electric current. A low resistivity indicates a material that readily allows electric current. Resistivity is commonly represented by the Greek letter (rho). The SI unit of electrical resistivity is the ohm- meter (Ω⋅m). For example, if a solid cube of material has sheet contacts on two opposite faces, and the resistance between these contacts is , then the resistivity of the material is . Electrical conductivity or specific conductance is the reciprocal of electrical resistivity. It represents a material's ability to conduct electric current. It is commonly signified by the Greek letter ( sigma), but (kappa) (especially in electrical engineering) and (gamma) are sometimes used. The SI unit of electrical conductivity is siemens per metre (S/m). Resistivity and conductivity are inte ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Parasitic Resistance
In electrical networks, a parasitic element is a circuit element ( resistance, inductance or capacitance) that is possessed by an electrical component but which it is not desirable for it to have for its intended purpose. For instance, a resistor is designed to possess resistance, but will also possess unwanted parasitic capacitance. Parasitic elements are unavoidable. All conductors possess resistance and inductance and the principles of duality ensure that where there is inductance, there will also be capacitance. Component designers will strive to minimise parasitic elements but are unable to eliminate them. Discrete components will often have some parasitic values detailed on their datasheets to aid circuit designers in compensating for unwanted effects. The most commonly seen manifestations of parasitic elements in components are in the parasitic inductance and resistance of the component leads and the parasitic capacitance of the component packaging. For wound comp ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
P-type Semiconductor
An extrinsic semiconductor is one that has been '' doped''; during manufacture of the semiconductor crystal a trace element or chemical called a doping agent has been incorporated chemically into the crystal, for the purpose of giving it different electrical properties than the pure semiconductor crystal, which is called an '' intrinsic semiconductor''. In an extrinsic semiconductor it is these foreign dopant atoms in the crystal lattice that mainly provide the charge carriers which carry electric current through the crystal. The doping agents used are of two types, resulting in two types of extrinsic semiconductor. An '' electron donor'' dopant is an atom which, when incorporated in the crystal, releases a mobile conduction electron into the crystal lattice. An extrinsic semiconductor which has been doped with electron donor atoms is called an n-type semiconductor, because the majority of charge carriers in the crystal are negative electrons. An ''electron acceptor'' dopant ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer (electronics)
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit. History In the semiconductor or silicon wafer industry, the term wafer appeared in the 1950s to describe a thin round slice of semiconductor material, typically germanium or silicon. Round shape comes from single-crystal ingots usually produced using the Czochralski method. Silicon wafers were first introduced in the 1940s. By 1960, silicon wafers were being manufactured in the U. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Bipolar Junction Transistor
A bipolar junction transistor (BJT) is a type of transistor that uses both electrons and electron holes as charge carriers. In contrast, a unipolar transistor, such as a field-effect transistor, uses only one kind of charge carrier. A bipolar transistor allows a small current injected at one of its terminals to control a much larger current flowing between the terminals, making the device capable of amplification or switching. BJTs use two p–n junctions between two semiconductor types, n-type and p-type, which are regions in a single crystal of material. The junctions can be made in several different ways, such as changing the doping of the semiconductor material as it is grown, by depositing metal pellets to form alloy junctions, or by such methods as diffusion of n-type and p-type doping substances into the crystal. The superior predictability and performance of junction transistors quickly displaced the original point-contact transistor. Diffused transistors, alo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
N-type Semiconductor
An extrinsic semiconductor is one that has been '' doped''; during manufacture of the semiconductor crystal a trace element or chemical called a doping agent has been incorporated chemically into the crystal, for the purpose of giving it different electrical properties than the pure semiconductor crystal, which is called an '' intrinsic semiconductor''. In an extrinsic semiconductor it is these foreign dopant atoms in the crystal lattice that mainly provide the charge carriers which carry electric current through the crystal. The doping agents used are of two types, resulting in two types of extrinsic semiconductor. An '' electron donor'' dopant is an atom which, when incorporated in the crystal, releases a mobile conduction electron into the crystal lattice. An extrinsic semiconductor which has been doped with electron donor atoms is called an n-type semiconductor, because the majority of charge carriers in the crystal are negative electrons. An ''electron acceptor'' dopant ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Parasitic Structure
In a semiconductor device, a parasitic structure is a portion of the device that resembles in structure some other, simpler semiconductor device, and causes the device to enter an unintended mode of operation when subjected to conditions outside of its normal range. For example, the internal structure of an NPN bipolar transistor resembles two PN junction diodes connected together by a common anode. In normal operation the base-emitter junction does indeed form a diode, but in most cases it is undesirable for the base-collector junction to behave as a diode. If a sufficient forward bias is placed on this junction it will form a parasitic diode structure, and current will flow from base to collector. A common parasitic structure is that of an SCR. Once triggered, an SCR conducts for as long as there is a current, necessitating a complete power-down to reset the behavior of the device. This condition is known as latchup A latch-up is a type of short circuit which can occur i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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