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Electroless Nickel Electroless Palladium Immersion Gold
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to while the gold is reduced to metallic state. A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG. ENIG can be applied before or after the solder mask, also known as overall or selective chemical Ni/Au, respectively. The latter type is more common and significantly cheaper as less gold is needed to cover only the solder pads. Advantages and disadvantages ENIG and ENEPIG are mean ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Membrane Switch
A membrane switch is a custom switch assembly that can open or close the conducting path in an electrical circuit and requires at least one contact made of or attached to a flexible substrate. Its assembly differs from traditional mechanical switches: a membrane switch's construction consists of various thin layers sandwiched together using pressure-sensitive adhesives. Each layer in a membrane switch assembly serves a different purpose, and custom features require the addition of specialty layers. Typical implementations arrange multiple membrane switches across its layered structure to form a keypad interface that allows human interaction to control electronic systems. Unique to membrane switches, they are the only switches that can utilize the benefits of flexible printed electronics. These circuits are generally printed on Polyethylene Terephthalate (PET) or Indium Tin Oxide (ITO) substrates. The ink used for printing the circuit is usually filled with copper, silver, or graphi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wave Soldering
Wave soldering is a bulk soldering process used for the manufacturing of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave. Wave soldering is mainly used in soldering of through hole components. As through-hole components have been largely replaced by surface mount components, wave soldering has been supplanted by reflow soldering methods in many large-scale electronics applications. However, there is still significant wave soldering where surface-mount technology (SMT) is not suitable (e.g., large power devices and ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reflow Soldering
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (unconventionally) by soldering individual joints with a desoldering hot air pencil. Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology components or SMT to a printed circuit board or PCB. Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly. Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inse ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Organic Solderability Preservative
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering. The compounds typically used are from the azole family such as benzotriazoles, imidazoles, benzimidazoles. These adsorb on copper surfaces, by forming coordination bonds with copper atoms and form thicker films through formation of copper (I) – N–heterocycle complexes. The typical film thickness used is in the tens to hundreds of nanometers. See also * Electroless nickel immersion gold (ENIG) * Hot air solder leveling (HASL) * Immersion silver plating (IAg) * Immersion tin plating (ISn) * Reflow soldering * Wave soldering Wave soldering is a bulk soldering process used for the manufacturing of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the ci ... ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Immersion Tin Plating
Immersion may refer to: The arts * "Immersion", a 2012 story by Aliette de Bodard * ''Immersion'', a French comic book series by Léo Quievreux * ''Immersion'' (album), the third album by Australian group Pendulum * ''Immersion'' (film), a 2021 Chilean thriller film * Immersion (series), a webseries which test the concepts of video games in real life, created by Rooster Teeth Productions * Immersion journalism, a style of journalism Science and technology * Immersion lithography or immersion microscopy, optical techniques in which liquid is between the objective and image plane in order to raise numerical aperture * Immersion (mathematics), a smooth map whose differential is everywhere injective, related to the mathematical concept of an embedding * Immersion (virtual reality), the perception of being physically present in a non-physical world, created by using VR Other uses * Immersion baptism, a type of baptism whereby the subject is immersed in water * Immersion Corporation, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Immersion Silver Plating
Immersion silver plating (or IAg plating) is a surface plating process that creates a thin layer of silver over copper objects. It consists in dipping the object briefly into a solution containing silver ions. Immersion silver plating is used by the electronics industry in manufacture of printed circuit boards (PCBs), to protect copper conductors from oxidation and improve solderability. Advantages and disadvantages Immersion silver coatings have excellent surface planarity, compared more traditional coating processes such as hot air solder leveling (HASL). They also have low losses in high-frequency applications due to the skin effect. On the other hand, silver coatings will degrade over time due to oxidation or air contaminants such as sulfur compounds and chlorine. A problem peculiar to silver coatings is the formation of silver whiskers under electric fields, which may short out components. Specifications IPC Standard: IPC-4553 See also * Electroless nickel immersion gol ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IPC (electronics)
IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. It was founded in 1957 as the Institute of Printed Circuits. Its name was later changed to the Institute for Interconnecting and Packaging Electronic Circuits to highlight the expansion from bare boards to packaging and electronic assemblies. In 1999, the organization formally changed its name to IPC with the accompanying tagline, ''Association Connecting Electronics Industries''. IPC is accredited by the American National Standards Institute (ANSI) as a standards developing organization and is known globally for its standards. It publishes the most widely used acceptability standards in the electronics industry. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. and Atlanta, Ga. in the United States, and overseas offices in China, Thailand, Vietnam, India and Belgium. Standards IPC standa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electrical Connector
Components of an electrical circuit are electrically connected if an electric current can run between them through an electrical conductor. An electrical connector is an electromechanical device used to create an electrical connection between parts of an electrical circuit, or between different electrical circuits, thereby joining them into a larger circuit. Most electrical connectors have a genderi.e. the male component, called a ''plug'', connects to the female component, or ''socket''. The connection may be removable (as for portable equipment), require a tool for assembly and removal, or serve as a permanent electrical joint between two points. An adapter can be used to join dissimilar connectors. Thousands of configurations of connectors are manufactured for power, data, and audiovisual applications. Electrical connectors can be divided into four basic categories, differentiated by their function: * ''inline'' or ''cable'' connectors permanently attached to a cable, so it ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Through-hole Technology
In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines. History Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction. From the second generation of computers in the 1950s until surface-mount technology (SMT) became popular in the mid 1980s, every component on a typical PCB was a through-hole component. PCBs initially had tracks printed on one side only, later both sides, then multi-layer boards were in use. Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, bu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hot Air Solder Leveling
{{unreferenced, date=November 2012 HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives. HASL can be applied with or without lead (Pb), but only lead-free HASL is RoHS compliant. Advantages of HASL * Excellent wetting during component soldering * Avoids copper corrosion. Disadvantages of HASL * Low planarity on vertical levelers may make this surface finish unsuitable for use with fine pitch components. Improved planarity can be achieved using a horizontal leveler. * High thermal stress during the process may introduce defects into PCB See also * Electroless Nickel Immersion Gold (ENIG) * Immersion Silver (IAg) * Organic Solderability Preservative (OSP) * Reflow soldering * Wave soldering Wave soldering is a bulk soldering process used f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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