Dual In-line Package
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Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For e ...
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Indonesian Democratic Party Of Struggle
The Indonesian Democratic Party of Struggle ( id, Partai Demokrasi Indonesia Perjuangan, PDI-P) is an Indonesian political party, and the party of the current President of Indonesia, Joko Widodo. The PDI-P was founded and is currently led by Megawati Sukarnoputri, president of Indonesia from 2001 to 2004, and daughter of Sukarno, the first president of Indonesia. Megawati was forced out from the leadership of the Indonesian Democratic Party (PDI) by the government of Indonesia under Suharto in 1996. Megawati formed the PDI-P in 1999, after Suharto resigned and restrictions on political parties were lifted. The party's ideology is based on the official Indonesian national philosophy, ''Pancasila'', and is considered as conservative-left. It is a member of the Council of Asian Liberals and Democrats and Progressive Alliance. Origins At the 1993 National Congress, Megawati Sukarnoputri was elected Chairperson of the Indonesian Democratic Party, one of the three political par ...
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Light-emitting Diode
A light-emitting diode (LED) is a semiconductor device that emits light when current flows through it. Electrons in the semiconductor recombine with electron holes, releasing energy in the form of photons. The color of the light (corresponding to the energy of the photons) is determined by the energy required for electrons to cross the band gap of the semiconductor. White light is obtained by using multiple semiconductors or a layer of light-emitting phosphor on the semiconductor device. Appearing as practical electronic components in 1962, the earliest LEDs emitted low-intensity infrared (IR) light. Infrared LEDs are used in remote-control circuits, such as those used with a wide variety of consumer electronics. The first visible-light LEDs were of low intensity and limited to red. Early LEDs were often used as indicator lamps, replacing small incandescent bulbs, and in seven-segment displays. Later developments produced LEDs available in visible, ultraviolet (UV) ...
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EPROM
An EPROM (rarely EROM), or erasable programmable read-only memory, is a type of programmable read-only memory (PROM) chip that retains its data when its power supply is switched off. Computer memory that can retrieve stored data after a power supply has been turned off and back on is called non-volatile. It is an array of floating-gate transistors individually programmed by an electronic device that supplies higher voltages than those normally used in digital circuits. Once programmed, an EPROM can be erased by exposing it to strong ultraviolet light source (such as from a mercury-vapor lamp). EPROMs are easily recognizable by the transparent fused quartz (or on later models resin) window on the top of the package, through which the silicon chip is visible, and which permits exposure to ultraviolet light during erasing. Operation Development of the EPROM memory cell started with investigation of faulty integrated circuits where the gate connections of transistors had broken ...
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Perfboard
Perfboard is a material for prototyping electronic circuits (also called DOT PCB). It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of spacing. These holes are ringed by round or square copper pads, though bare boards are also available. Inexpensive perfboard may have pads on only one side of the board, while better quality perfboard can have pads on both sides ( plate-through holes). Since each pad is electrically isolated, the builder makes all connections with either wire wrap or miniature point to point wiring techniques. Discrete components are soldered to the prototype board such as resistors, capacitors, and integrated circuits. The substrate is typically made of paper laminated with phenolic resin (such as FR-2) or a fiberglass-reinforced epoxy laminate ( FR-4). Connections The grid system accommodates integrated circuits in DIP packages and many other types of through-hole components. Perfboard is not desi ...
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Stripboard
Stripboard is the generic name for a widely used type of electronics prototyping material for circuit boards characterized by a pre-formed regular (rectangular) grid of holes, with wide parallel strips of copper cladding running in one direction all the way across one side of on an insulating bonded paper board. It is commonly also known by the name of the original product Veroboard, which is a trademark, in the UK, of British company Vero Technologies Ltd and Canadian company Pixel Print Ltd. It was originated and developed in the early 1960s by the Electronics Department of Vero Precision Engineering Ltd (VPE). It was introduced as a general-purpose material for use in constructing electronic circuits - differing from purpose-designed printed circuit boards (PCBs) in that a variety of electronics circuits may be constructed using a standard wiring board. In using the board, breaks are made in the tracks, usually around holes, to divide the strips into multiple electrical no ...
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Small-outline Integrated Circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.) Note that because of t ...
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Plastic Leaded Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are ...
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Breadboard
A breadboard, solderless breadboard, or protoboard is a construction base used to build semi-permanent prototypes of electronic circuits. Unlike a perfboard or stripboard, breadboards do not require soldering or destruction of tracks and are hence reusable. For this reason, breadboards are also popular with students and in technological education. A variety of electronic systems may be prototyped by using breadboards, from small analog and digital circuits to complete central processing units (CPUs). Compared to more permanent circuit connection methods, modern breadboards have high parasitic capacitance, relatively high resistance, and less reliable connections, which are subject to jostle and physical degradation. Signaling is limited to about 10 MHz, and not everything works properly even well below that frequency. History In the early days of radio, amateurs nailed bare copper wires or terminal strips to a wooden board (often literally a bread cutting board) and sold ...
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Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ...
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Wave Soldering
Wave soldering is a bulk soldering process used for the manufacturing of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave. Wave soldering is mainly used in soldering of through hole components. As through-hole components have been largely replaced by surface mount components, wave soldering has been supplanted by reflow soldering methods in many large-scale electronics applications. However, there is still significant wave soldering where surface-mount technology (SMT) is not suitable (e.g., large power devices and ...
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Pin Header
A pin header (or simply header) is a form of electrical connector. A male pin header consists of one or more rows of metal pins molded into a plastic base, often apart, though available in many spacings. Male pin headers are cost-effective due to their simplicity. The female counterparts are sometimes known as female socket headers, though there are numerous naming variations of male and female connectors. Historically, headers have sometimes been called "Berg connectors", but headers are manufactured by many companies. Overview Normally pin headers are through-hole devices (THD / THT), but surface-mount devices (SMD / SMT) exist too. In the SMD case, the solder side of the pins are bent on a 90 degree angle so as to be soldered to pads on the PCB. On single row SMD headers the pins are bent alternating to one side or the other, on dual row SMD headers the pins are simply bent outwards. If pin headers are optional, the THD variant is often chosen for ease of manual assembl ...
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