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Deep Reactive-ion Etching
Deep reactive-ion etching (DRIE) is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios. It was developed for microelectromechanical systems (MEMS), which require these features, but is also used to excavate trenches for high-density capacitors for DRAM and more recently for creating through silicon vias ( TSVs) in advanced 3D wafer level packaging technology. In DRIE, the substrate is placed inside a reactor, and several gases are introduced. A plasma is struck in the gas mixture which breaks the gas molecules into ions. The ions accelerated towards, and react with the surface of the material being etched, forming another gaseous element. This is known as the chemical part of the reactive ion etching. There is also a physical part, if ions have enough energy, they can knock atoms out of the material to be etched without chemical reaction. DRIE is a special subclass of RIE. Th ...
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Anisotropy
Anisotropy () is the property of a material which allows it to change or assume different properties in different directions, as opposed to isotropy. It can be defined as a difference, when measured along different axes, in a material's physical or mechanical properties ( absorbance, refractive index, conductivity, tensile strength, etc.). An example of anisotropy is light coming through a polarizer. Another is wood, which is easier to split along its grain than across it. Fields of interest Computer graphics In the field of computer graphics, an anisotropic surface changes in appearance as it rotates about its geometric normal, as is the case with velvet. Anisotropic filtering (AF) is a method of enhancing the image quality of textures on surfaces that are far away and steeply angled with respect to the point of view. Older techniques, such as bilinear and trilinear filtering, do not take into account the angle a surface is viewed from, which can result in alias ...
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Passivation (chemistry)
Passivation, in physical chemistry and engineering, refers to coating a material so it becomes "passive", that is, less readily affected or corroded by the environment. Passivation involves creation of an outer layer of shield material that is applied as a microcoating, created by chemical reaction with the base material, or allowed to build by spontaneous oxidation in the air. As a technique, passivation is the use of a light coat of a protective material, such as metal oxide, to create a shield against corrosion. Passivation of silicon is used during fabrication of microelectronic devices. In electrochemical treatment of water, passivation reduces the effectiveness of the treatment by increasing the circuit resistance, and active measures are typically used to overcome this effect, the most common being polarity reversal, which results in limited rejection of the fouling layer. When exposed to air, many metals naturally form a hard, relatively inert surface layer, usually a ...
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Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronics, electronic devices. It is a multiple-step sequence of Photolithography, photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar process, planar diffusion and p–n junction isolation, junction isolation) during which electronic circuits are gradually created on a wafer (electronics), wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconduct ...
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Microelectromechanical Systems
Microelectromechanical systems (MEMS), also written as micro-electro-mechanical systems (or microelectronic and microelectromechanical systems) and the related micromechatronics and microsystems constitute the technology of microscopic devices, particularly those with moving parts. They merge at the nanoscale into nanoelectromechanical systems (NEMS) and nanotechnology. MEMS are also referred to as micromachines in Japan and microsystem technology (MST) in Europe. MEMS are made up of components between 1 and 100 micrometers in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2. They usually consist of a central unit that processes data (an integrated circuit chip such as microprocessor) and several components that interact with the surroundings (such as microsensors). Because of th ...
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Reactive-ion Etching
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it. Equipment A typical (parallel plate) RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber. The wafer platter is electrically isolated from the rest of the chamber. Gas enters through small inlets in the top of the chamber, and exits to the vacuum pump system through the bottom. The types and amount of gas used vary depending upon the etch process; for instance, sulfur hexafluoride is commonly used for etching silicon. Gas pressure is typically maintained in a range between a few milli torr and a few hundred millitorr ...
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Hairspring
A balance spring, or hairspring, is a spring attached to the balance wheel in mechanical timepieces. It causes the balance wheel to oscillate with a resonant frequency when the timepiece is running, which controls the speed at which the wheels of the timepiece turn, thus the rate of movement of the hands. A regulator lever is often fitted, which can be used to alter the free length of the spring and thereby adjust the rate of the timepiece. The balance spring is a fine spiral or helical torsion spring used in mechanical watches, alarm clocks, kitchen timers, marine chronometers, and other timekeeping mechanisms to control the rate of oscillation of the balance wheel. The balance spring is an essential adjunct to the balance wheel, causing it to oscillate back and forth. The balance spring and balance wheel together form a harmonic oscillator, which oscillates with a precise period or "beat" resisting external disturbances, and is responsible for timekeeping accuracy. The addition ...
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Cartier (jeweler)
Cartier International SNC, or simply Cartier (; ), is a French high-end luxury goods conglomerate that designs, manufactures, distributes, and sells jewellery, leather goods, and watches. Founded by Louis-François Cartier (1819–1904) in Paris in 1847, the company remained under family control until 1964. The company is headquartered in Paris and is a wholly owned subsidiary of the Swiss Richemont Group. Cartier operates more than 200 stores in 125 countries, with three Temples (Historical Maisons) in London, New York, and Paris. Cartier is regarded as one of the most prestigious jewellery manufacturers. ''Forbes'' ranked Cartier on its Most Valuable Brands list as 59th in 2018 and 56th in 2020, with a brand value of $12.2 B and revenue of $6.2 B. Cartier has a long history of sales to royalty. King Edward VII referred to Cartier as "the jeweller of kings and the king of jewellers." For his coronation in 1902, Edward VII ordered 27 tiaras and issued a royal warrant to Cartie ...
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Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Transistor count, Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as mode ...
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Nanometre
330px, Different lengths as in respect to the Molecule">molecular scale. The nanometre (international spelling as used by the International Bureau of Weights and Measures; SI symbol: nm) or nanometer ( American spelling) is a unit of length in the International System of Units (SI), equal to one billionth ( short scale) of a metre () and to 1000 picometres. One nanometre can be expressed in scientific notation as , and as  metres. History The nanometre was formerly known as the millimicrometre – or, more commonly, the millimicron for short – since it is of a micron (micrometre), and was often denoted by the symbol mμ or (more rarely and confusingly, since it logically should refer to a ''millionth'' of a micron) as μμ. Etymology The name combines the SI prefix '' nano-'' (from the Ancient Greek , ', "dwarf") with the parent unit name ''metre'' (from Greek , ', "unit of measurement"). Usage Nanotechnologies are based on phenomena typically occurr ...
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Isotropic
Isotropy is uniformity in all orientations; it is derived . Precise definitions depend on the subject area. Exceptions, or inequalities, are frequently indicated by the prefix ' or ', hence '' anisotropy''. ''Anisotropy'' is also used to describe situations where properties vary systematically, dependent on direction. Isotropic radiation has the same intensity regardless of the direction of measurement, and an isotropic field exerts the same action regardless of how the test particle is oriented. Mathematics Within mathematics, ''isotropy'' has a few different meanings: ; Isotropic manifolds: A manifold is isotropic if the geometry on the manifold is the same regardless of direction. A similar concept is homogeneity. ; Isotropic quadratic form: A quadratic form ''q'' is said to be isotropic if there is a non-zero vector ''v'' such that ; such a ''v'' is an isotropic vector or null vector. In complex geometry, a line through the origin in the direction of an isotropic vect ...
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Sputter
In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. It occurs naturally in outer space, and can be an unwelcome source of wear in precision components. However, the fact that it can be made to act on extremely fine layers of material is utilised in science and industry—there, it is used to perform precise etching, carry out analytical techniques, and deposit thin film layers in the manufacture of optical coatings, semiconductor devices and nanotechnology products. It is a physical vapor deposition technique. Physics When energetic ions collide with atoms of a target material, an exchange of momentum takes place between them. These ions, known as "incident ions", set off collision cascades in the target. Such cascades can take many paths; some recoil back toward the surface of the target. If a collision cascade reaches the ...
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